Patents by Inventor Shumpei KONDO

Shumpei KONDO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10607874
    Abstract: According to one embodiment, an electrostatic chuck includes a ceramic dielectric substrate, a base plate, and a heater plate. The ceramic dielectric substrate has a surface where a processing object is placed. The base plate supports the ceramic dielectric substrate. The heater plate is provided between the ceramic dielectric substrate and the base plate. The heater plate includes a first support plate including a metal, a second support plate including a metal, a heater element, a first resin layer, and a second resin layer. The heater element is provided between the first support plate and the second support plate. The heater element emits heat due to a current flowing. The first resin layer is provided between the first support plate and the heater element. The second resin layer is provided between the second support plate and the heater element.
    Type: Grant
    Filed: July 12, 2017
    Date of Patent: March 31, 2020
    Assignee: Toto Ltd.
    Inventors: Kengo Maehata, Shumpei Kondo, Hitoshi Sasaki, Kosuke Yamaguchi, Yuichi Yoshii
  • Publication number: 20200053016
    Abstract: An information processing apparatus includes a radio module which wirelessly transmits and receives a packet through synchronous communication to and from another apparatus and a first controller. The first controller determines whether or not the packet transmitted from the radio module has been received by another apparatus, and selects, when reception of a previously transmitted packet by the another apparatus is not confirmed, between retransmission processing for retransmitting the previously transmitted packet and non-retransmission processing for transmitting another packet instead of the previously transmitted packet depending on a content of the previously transmitted packet.
    Type: Application
    Filed: October 16, 2019
    Publication date: February 13, 2020
    Inventors: Yoshihisa KONDO, Shumpei YASUDA, Toshiki OIZUMI, Kouichi KAWAMOTO
  • Patent number: 10484292
    Abstract: An information processing apparatus includes a radio module which wirelessly transmits and receives a packet through synchronous communication to and from another apparatus and a first controller. The first controller determines whether or not the packet transmitted from the radio module has been received by another apparatus, and selects, when reception of a previously transmitted packet by the another apparatus is not confirmed, between retransmission processing for retransmitting the previously transmitted packet and non-retransmission processing for transmitting another packet instead of the previously transmitted packet depending on a content of the previously transmitted packet.
    Type: Grant
    Filed: July 6, 2017
    Date of Patent: November 19, 2019
    Assignee: NINTENDO CO., LTD.
    Inventors: Yoshihisa Kondo, Shumpei Yasuda, Toshiki Oizumi, Kouichi Kawamoto
  • Publication number: 20190148206
    Abstract: According to an aspect of the invention, an electrostatic chuck includes: a ceramic dielectric substrate having a first major surface, and a second major surface on a side opposite to the first major surface; a base plate supporting the ceramic dielectric substrate and being provided at a position separated from the ceramic dielectric substrate; and a heater plate provided between the ceramic dielectric substrate and the base plate, the heater plate including a first support plate including a metal, a heater element emitting heat due to a current flowing, and a first resin layer provided between the first support plate and the heater element, the heater element having a first surface and a second surface, the first surface opposing the first resin layer, the second surface facing a side opposite to the first surface, a width of the first surface being different from a width of the second surface.
    Type: Application
    Filed: January 16, 2019
    Publication date: May 16, 2019
    Inventors: Kosuke YAMAGUCHI, Hitoshi SASAKI, Kengo MAEHATA, Shumpei KONDO, Yuichi YOSHII
  • Publication number: 20190148204
    Abstract: According to an aspect of the invention, an electrostatic chuck comprises: a ceramic dielectric substrate; a base plate; and a heater plate. The heater plate includes a first and a second support plates including a metal, a heater element provided between the first and the second support plates, a first resin layer provided between the first support plate and the heater element, and a second resin layer provided between the second support plate and the heater element. A surface of the first support plate on the second support plate side includes a first region and a second region, the first region overlapping the heater element when viewed along the stacking direction, the second region not overlapping the heater element when viewed along the stacking direction. In a cross section parallel to the stacking direction, the second region protrudes toward the second support plate side compared to the first region.
    Type: Application
    Filed: January 9, 2019
    Publication date: May 16, 2019
    Inventors: Kosuke YAMAGUCHI, Hitoshi SASAKI, Kengo MAEHATA, Shumpei KONDO, Yuichi YOSHII
  • Publication number: 20170309510
    Abstract: According to one embodiment, an electrostatic chuck includes a ceramic dielectric substrate, a base plate, and a heater plate. The ceramic dielectric substrate has a surface where a processing object is placed. The base plate supports the ceramic dielectric substrate. The heater plate is provided between the ceramic dielectric substrate and the base plate. The heater plate includes a first support plate including a metal, a second support plate including a metal, a heater element, a first resin layer, and a second resin layer. The heater element is provided between the first support plate and the second support plate. The heater element emits heat due to a current flowing. The first resin layer is provided between the first support plate and the heater element. The second resin layer is provided between the second support plate and the heater element.
    Type: Application
    Filed: July 12, 2017
    Publication date: October 26, 2017
    Inventors: Kengo MAEHATA, Shumpei KONDO, Hitoshi SASAKI, Kosuke YAMAGUCHI, Yuichi YOSHII