Patents by Inventor Shun-An Hsieh
Shun-An Hsieh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Lead frame, package structure comprising the same and method for manufacturing the package structure
Patent number: 11462467Abstract: A lead frame includes a die paddle and a plurality of leads. The leads surround the die paddle. Each of the leads includes an inner lead portion and an outer lead portion connecting to the inner lead portion. The inner lead portion is adjacent to and spaced apart from the die paddle. A bottom surface of the inner lead portion is higher than a bottom surface of the outer lead portion. The bottom surface of the inner lead portion includes one or more supporting members disposed thereon. The one or more supporting members have a convex surface facing away from the inner lead portion.Type: GrantFiled: July 14, 2020Date of Patent: October 4, 2022Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Chia Hsiu Huang, Chun Chen Chen, Wei Chih Cho, Shao-Lun Yang, Yu-Shun Hsieh -
Patent number: 11450596Abstract: A lead frame includes a die paddle, a plurality of leads, at least one connector and a bonding layer. The leads surround the die paddle. Each of the leads includes an inner lead portion adjacent to and spaced apart from the die paddle and an outer lead portion opposite to the inner lead portion. The connector is connected to the die paddle and the inner lead portions of the leads. The bonding layer is disposed on a lower surface of the die paddle and a lower surface of each of the outer lead portions.Type: GrantFiled: November 22, 2019Date of Patent: September 20, 2022Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Yi-Cheng Hsu, Chih-Hung Hsu, Mei-Lin Hsieh, Yuan-Chun Chen, Yu-Shun Hsieh, Ko-Pu Wu, Chin Li Huang
-
LEAD FRAME, PACKAGE STRUCTURE COMPRISING THE SAME AND METHOD FOR MANUFACTURING THE PACKAGE STRUCTURE
Publication number: 20220020680Abstract: A lead frame includes a die paddle and a plurality of leads. The leads surround the die paddle. Each of the leads includes an inner lead portion and an outer lead portion connecting to the inner lead portion. The inner lead portion is adjacent to and spaced apart from the die paddle. A bottom surface of the inner lead portion is higher than a bottom surface of the outer lead portion. The bottom surface of the inner lead portion includes one or more supporting members disposed thereon. The one or more supporting members have a convex surface facing away from the inner lead portion.Type: ApplicationFiled: July 14, 2020Publication date: January 20, 2022Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Chia Hsiu HUANG, Chun Chen CHEN, Wei Chih CHO, Shao-Lun YANG, Yu-Shun HSIEH -
Device including a plurality of leads surrounding a die paddle and method for manufacturing the same
Patent number: 11139225Abstract: A device includes a die paddle and a plurality of leads. The leads surround the die paddle. Each of the leads includes an inner lead portion adjacent to and spaced apart from the die paddle, an outer lead portion opposite to the inner lead portion and a bridge portion between the inner lead portion and the outer lead portion. The inner lead portion has an upper bond section connected to the bridge portion and a lower support section below the upper bond section. A sum of a thickness of the upper bond section and a thickness of the lower support section is greater than a thickness of the bridge portion.Type: GrantFiled: June 14, 2019Date of Patent: October 5, 2021Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Kuang-Hsiung Chen, Chih-Hung Hsu, Mei-Lin Hsieh, Yi-Cheng Hsu, Yuan-Chun Chen, Yu-Shun Hsieh, Ko-Pu Wu -
Publication number: 20210159155Abstract: A lead frame includes a die paddle, a plurality of leads, at least one connector and a bonding layer. The leads surround the die paddle. Each of the leads includes an inner lead portion adjacent to and spaced apart from the die paddle and an outer lead portion opposite to the inner lead portion. The connector is connected to the die paddle and the inner lead portions of the leads. The bonding layer is disposed on a lower surface of the die paddle and a lower surface of each of the outer lead portions.Type: ApplicationFiled: November 22, 2019Publication date: May 27, 2021Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Yi-Cheng HSU, Chih-Hung HSU, Mei-Lin HSIEH, Yuan-Chun CHEN, Yu-Shun HSIEH, Ko-Pu WU, Chin LI HUANG
-
Publication number: 20200395275Abstract: A device includes a die paddle and a plurality of leads. The leads surround the die paddle. Each of the leads includes an inner lead portion adjacent to and spaced apart from the die paddle, an outer lead portion opposite to the inner lead portion and a bridge portion between the inner lead portion and the outer lead portion. The inner lead portion has an upper bond section connected to the bridge portion and a lower support section below the upper bond section. A sum of a thickness of the upper bond section and a thickness of the lower support section is greater than a thickness of the bridge portion.Type: ApplicationFiled: June 14, 2019Publication date: December 17, 2020Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Kuang-Hsiung CHEN, Chih-Hung HSU, Mei-Lin HSIEH, Yi-Cheng HSU, Yuan-Chun CHEN, Yu-Shun HSIEH, Ko-Pu WU
-
Patent number: 10797004Abstract: A semiconductor device package includes: (1) a lead frame including a connection element and multiple leads; (2) a package body encapsulating the lead frame, wherein the package body includes a lower surface and an upper surface opposite to the lower surface, the package body includes a cavity exposing at least one of the leads; (3) at least one conductive via disposed in the cavity of the package body, electrically connected to the connection element, and exposed from the upper surface of the package body; and (4) a conductive layer disposed on the upper surface of the package body and the conductive via.Type: GrantFiled: May 23, 2019Date of Patent: October 6, 2020Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Shao-Lun Yang, Yu-Shun Hsieh, Chia Yi Cheng, Hong Jie Chen, Shih Yu Huang
-
Publication number: 20190279941Abstract: A semiconductor device package includes: (1) a lead frame including a connection element and multiple leads; (2) a package body encapsulating the lead frame, wherein the package body includes a lower surface and an upper surface opposite to the lower surface, the package body includes a cavity exposing at least one of the leads; (3) at least one conductive via disposed in the cavity of the package body, electrically connected to the connection element, and exposed from the upper surface of the package body; and (4) a conductive layer disposed on the upper surface of the package body and the conductive via.Type: ApplicationFiled: May 23, 2019Publication date: September 12, 2019Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Shao-Lun YANG, Yu-Shun HSIEH, Chia Yi CHENG, Hong Jie CHEN, Shih Yu HUANG
-
Patent number: 10312198Abstract: A semiconductor device package includes a lead frame, an electronic component, a package body, at least one conductive via and a conductive layer. The lead frame includes a paddle, a connection element and a plurality of leads. The electronic component is disposed on the paddle. The package body encapsulates the electronic component and the lead frame. The at least one conductive via is disposed in the package body, electrically connected to the connection element, and exposed from the package body. The conductive layer is disposed on the package body and the conductive via.Type: GrantFiled: October 20, 2017Date of Patent: June 4, 2019Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Shao-Lun Yang, Yu-Shun Hsieh, Chia Yi Cheng, Hong Jie Chen, Shih Yu Huang
-
Publication number: 20190122992Abstract: A semiconductor device package includes a lead frame, an electronic component, a package body, at least one conductive via and a conductive layer. The lead frame includes a paddle, a connection element and a plurality of leads. The electronic component is disposed on the paddle. The package body encapsulates the electronic component and the lead frame. The at least one conductive via is disposed in the package body, electrically connected to the connection element, and exposed from the package body. The conductive layer is disposed on the package body and the conductive via.Type: ApplicationFiled: October 20, 2017Publication date: April 25, 2019Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Shao-Lun YANG, Yu-Shun HSIEH, Chia Yi CHENG, Hong Jie CHEN, Shih Yu HUANG
-
Patent number: 9800003Abstract: A standing structure for a shell of an extension cord is provided. Intercalating trenches are disposed on rear edges of a pair of opposite surfaces of the shell of the extension cord. A support frame includes a horizontally-disposed bottom plate and a vertically-disposed support plate connecting the bottom plate and having two intercalating strips intercalated into the intercalating trenches. Thus, the shell of the extension cord can be combined with the support frame to form the standing structure. The planar surface, not combined with the shell of the extension cord, of the support plate thus can face to a user for hiding power outlets and power cables plugged into the power outlets.Type: GrantFiled: September 21, 2016Date of Patent: October 24, 2017Assignee: Attia Technology Inc.Inventors: Wen-Bean Chen, Wen-Shun Hsieh, Yue-Long Lu
-
Patent number: 8274270Abstract: An adaptive pulse width control power conversion device includes a pulse width adjustable pulse frequency module (PFM) control circuit, a pulse width modulation (PWM) control circuit, a PWM/PFM switching unit, a switching circuit, and a load status detection circuit. When the power conversion device is to be switched from a PWM mode to a PFM mode, pulse width of a series of PFM control signals is sequentially adjusted from a low value to a high value according to a predetermined pulse width increment until an optimum pulse width is determined and thereafter, an output voltage is supplied to a load in the PFM mode, whereby ripple of output voltage in the PFM mode can be improved and improved stability of output of the power conversion device is realized.Type: GrantFiled: July 16, 2009Date of Patent: September 25, 2012Assignee: Feeling Technology Corp.Inventors: Shun-An Hsieh, Yu-Shen Lin
-
Publication number: 20110012658Abstract: An adaptive pulse width control power conversion device includes a pulse width adjustable pulse frequency module (PFM) control circuit, a pulse width modulation (PWM) control circuit, a PWM/PFM switching unit, a switching circuit, and a load status detection circuit. When the power conversion device is to be switched from a PWM mode to a PFM mode, pulse width of a series of PFM control signals is sequentially adjusted from a low value to a high value according to a predetermined pulse width increment until an optimum pulse width is determined and thereafter, an output voltage is supplied to a load in the PFM mode, whereby ripple of output voltage in the PFM mode can be improved and improved stability of output of the power conversion device is realized.Type: ApplicationFiled: July 16, 2009Publication date: January 20, 2011Inventors: Shun-An Hsieh, Yu-Shen Lin
-
Publication number: 20070126322Abstract: A novel vehicle which is suitable for transporting and/or temporarily storing objects such as masks or reticles and is effective in eliminating or preventing electrostatic discharges on the masks, reticles or other objects. The vehicle includes a frame for receiving the objects and at least one ESD eliminator provided on the frame for neutralizing electrostatic charges on the objects. Neutralization of the electrostatic charges prevents electrostatic discharges from damaging microelectronic circuits, for example, on the masks, reticles or other objects.Type: ApplicationFiled: December 5, 2005Publication date: June 7, 2007Inventors: Chian-Chen Chiou, Chi-Chien Chang, Shun Hsieh, Yi Lin, Hsiao-Lung Sun, Nien-Hua Chang
-
Patent number: 6409283Abstract: A wheel assembly for a trunk-attached carriage includes an integrally formed wheel bracket having a vertical, a side and a bottom plate for mounting onto a lower rear corner of a trunk, a compression spring, a short wheel axle, a locking member, and a wheel. The wheel bracket defines a wheel-space for the wheel to locate therein. The wheel axle transversely extends across behind the vertical plate of the wheel bracket to pass through an axle hole on the wheel, so that the wheel is rotatably mounted on the wheel axle and connected the wheel bracket. An end of the wheel axle close to the side plate of the wheel bracket is connected to a diameter-reduced inner end of the locking member, so that the wheel axle can be turned into a locked position on the wheel bracket by turning a diameter-expanded outer end of the locking member. And, by turning the locking member in a reverse direction, the wheel axle can be removed from the wheel bracket for replacement of any damaged component of the wheel assembly.Type: GrantFiled: March 2, 2001Date of Patent: June 25, 2002Inventor: Yung-Shun Hsieh
-
Patent number: 5984327Abstract: A handcart is constructed to include two main frames having outward expanded shoulder and lower portions, an extension handle assembly, an upper crossbar, a lower crossbar, a carrier, and two wheel holders. The two main frames have two upper ends fixedly received in side holes formed at the upper crossbar and two lower ends pivotally connected to the carrier. The extension handle assembly includes two outer pipes, two inner pipes, and a top handle. The upper crossbar is provided with a mechanism means to control the extension and collapse of the inner pipes from and into the outer pipes. The lower crossbar may, together with a fastening strap, hold the carrier and luggages loaded on the carrier in place. When the carrier is extended to a horizontal position, the two wheel holders are extended outward at the same time, permitting the handcart to conveniently carry and transport luggages or articles.Type: GrantFiled: August 7, 1997Date of Patent: November 16, 1999Inventors: Hung-Ching Hsieh, Yung-Shun Hsieh
-
Patent number: 5961256Abstract: A rough boring tool is composed of a boring rod having a tool hole which is provided with a base line and a plurality of reading scales. The rough boring tool is further composed of a boring tool engaged with the tool hole and provided with a plurality of measuring scales corresponding in location to the reading scales and forming an angle with the base line. The advancement quantity of the boring tool can be easily observed with the naked eye by converging the reading scales of the tool hole of the boring rod and the measuring scales of the boring tool.Type: GrantFiled: October 30, 1998Date of Patent: October 5, 1999Inventor: Ho-Shun Hsieh
-
Patent number: 5951037Abstract: A luggage cart which mainly includes a handle assembly, a vertical telescopic frame assembly, a movable upper crossbar assembly, a fixed crossbar, a luggage support, a foot-control assembly, a horizontal telescopic frame assembly, and an upper and a lower fixing members for mounting onto a back side of a trunk. The handle assembly has a long pull rod provided therein for controlling the sliding of pipes of the vertical telescopic frame assembly. The movable upper crossbar assembly may be adjusted in height to associate with the upper fixing member and the foot-control assembly may be associated with said lower fixing member. Whereby when the trunk is loaded on the luggage support and the horizontal telescopic frame assembly with the upper and the lower fixing members respectively associated with the upper crossbar assembly and the foot-control assembly, the trunk can be carried with the cart in a laborsaving manner.Type: GrantFiled: August 7, 1997Date of Patent: September 14, 1999Inventors: Hung-Ching Hsieh, Yung-Shun Hsieh
-
Patent number: 5816604Abstract: A stretchable and foldable cart whose handle bar can be stretched, retracted or folded by operation of a pressing rod associated with positioning elastic lugs, pins and stoppers. The loading stage of the car is able to adjust its size according to actual requirements by the operation of push button, positioning stoppers and connecting rods. The front and rear mountings of cart are made of plastics with sufficient engineering strength for reducing the cart weight yet without affecting the cart's functions; facilitating assembly work and reducing production cost.Type: GrantFiled: May 27, 1997Date of Patent: October 6, 1998Inventors: Hung-Ching Hsieh, Yung-Shun Hsieh
-
Patent number: D468882Type: GrantFiled: February 8, 2002Date of Patent: January 14, 2003Inventors: Yung-Shun Hsieh, Hung-Hsin Hsieh