Abstract: Provided are semiconductor devices and methods for fabricating such devices. An exemplary method includes forming a fin structure over a semiconductor material; forming a sacrificial layer over the semiconductor material; removing a portion of the fin structure and an overlying portion of the sacrificial layer located over the portion of the fin structure to form a trench; forming an insulation structure in the trench, wherein an adjacent portion of the sacrificial layer is adjacent an end wall of the insulation structure; removing the adjacent portion to form a cavity partially defined by the end wall; lining the cavity with a liner, wherein an end portion of the liner is located on the end wall of the insulation structure; filling the cavity with a fill material; removing the end portion of the liner to form an opening; and forming an end isolation structure in the opening.

Abstract: A housing assembly for an electronic device includes a mounting assembly, an engaging assembly, a first housing, and a guiding member. The mounting assembly includes an accommodation room having an opening therein. The engaging assembly includes a first elastic member and a first engaging member mounted in the accommodation room. The first engaging member includes a first force receiving portion and a first engaging portion corresponding to the opening. The first housing is coupled with the mounting assembly and includes an assembling portion to be connected with the first engaging portion. The guiding member has a first guiding portion corresponding to the first force receiving portion. When the first guiding portion of the guiding member is applied by a force to move the first force receiving portion of the first engaging member to a position, the first engaging member is disengaged from the assembling portion of the first housing.