Abstract: A wiping apparatus includes a wiping mechanism, a sensor set, and a conveying mechanism. The sensor set includes a first station sensor, the first station sensor corresponds to the wiping mechanism, and the first station sensor is configured to generate a first station signal. The conveying mechanism corresponds to the wiping mechanism, the conveying mechanism is configured to generate a first conveying movement, and the first conveying movement responds to the first station signal. The wiping mechanism generates a first wiping motion according to the first station signal and a first wiping parameter, and the wiping mechanism generates a second wiping motion according to the first wiping motion and a second wiping parameter.

Abstract: This disclosure relates to a film removal apparatus that is suitable for uncovering a film of a semiconductor substrate and includes a carrier, an uncovering mechanism and a lifting mechanism. The carrier supports the semiconductor substrate. The uncovering mechanism includes a slider, a guider and a roller. The slider is slidably disposed on the carrier. The guider is fixed to the slider. The roller is rotatably disposed on the slider and arranged beside the guider. The uncovering mechanism is to uncover the film from the semiconductor substrate. The lifting mechanism selectively separates the semiconductor substrate away from the carrier.

Abstract: A transportation control system, a transportation device, and a transportation control method related to an automated transportation control method are used to provide automated transportation between platforms which are not interconnected. The transportation control method includes receiving a sensed signal which corresponds to a location of a transportation platform, generating a first motion command according to the sensed signal, transmitting the first motion command to a controller which controls the transportation platform, sensing a location of the transportation platform from different sensing locations to generate the sensed signal, transmitting the sensed signal through a network, and controlling the transportation platform to move by the controller in response to the first motion command.

Abstract: A feeding apparatus is provided. The feeding apparatus includes an apparatus body, a container, an elevatable platform, and a pulling mechanism. The container is disposed in the apparatus body, wherein the container has a carrier unit, and the carrier unit is detachably connected to the container. The elevatable platform is disposed on the apparatus body, wherein the elevatable platform is adapted to be moved between the first height and the second height. The pulling mechanism is disposed on the elevatable platform, wherein the pulling mechanism is adapted to be moved relative to the container.

Abstract: A cloth replacement apparatus includes a frame body, a robotic arm, a replacement module, a clamping-pulling module, and a supply module. The robotic arm includes a wiping head. The replacement module includes a base body. The base body has a receiving portion. The wiping head is selectively received in the receiving portion. The clamping-pulling module is movably disposed on the frame body. The supply module includes a cutting assembly. The cutting assembly is movably disposed on the frame body.

Abstract: An automation system includes a controller, an AGV (Automated Guided Vehicle), and a carrier component. The controller generates a control signal, so as to perform a moving process. The AGV receives the control signal. The AGV moves the carrier component from a first location to a second location according to the control signal.

Abstract: A wafer handling device is configured to transport a wafer tray. The wafer handling device includes a sucker module and a transporting apparatus. The sucker module includes a sucker body, at least one airtight assembly, and a pump. The sucker body includes a first portion and a second portion. The first portion has a hole and a first air sucking hole. The second portion has a second air sucking hole. The airtight assembly is connected to the hole. The pump has a suction tube connected to the first air sucking hole and the second air sucking hole. The transporting apparatus is configured to move the sucker body. When the sucker body is connected to the wafer tray, the first portion, the second portion, and the wafer tray form an airtight space.

Abstract: A wiping apparatus includes a wiping mechanism, a sensor set, and a conveying mechanism. The sensor set includes a first station sensor, the first station sensor corresponds to the wiping mechanism, and the first station sensor is configured to generate a first station signal. The conveying mechanism corresponds to the wiping mechanism, the conveying mechanism is configured to generate a first conveying movement, and the first conveying movement responds to the first station signal. The wiping mechanism generates a first wiping motion according to the first station signal and a first wiping parameter, and the wiping mechanism generates a second wiping motion according to the first wiping motion and a second wiping parameter.

Abstract: A feeding apparatus is provided. The feeding apparatus includes an apparatus body, a container, an elevatable platform, and a pulling mechanism. The container is disposed in the apparatus body, wherein the container has a carrier unit, and the carrier unit is detachably connected to the container. The elevatable platform is disposed on the apparatus body, wherein the elevatable platform is adapted to be moved between the first height and the second height. The pulling mechanism is disposed on the elevatable platform, wherein the pulling mechanism is adapted to be moved relative to the container.