Abstract: A wafer handling device is configured to transport a wafer tray. The wafer handling device includes a sucker module and a transporting apparatus. The sucker module includes a sucker body, at least one airtight assembly, and a pump. The sucker body includes a first portion and a second portion. The first portion has a hole and a first air sucking hole. The second portion has a second air sucking hole. The airtight assembly is connected to the hole. The pump has a suction tube connected to the first air sucking hole and the second air sucking hole. The transporting apparatus is configured to move the sucker body. When the sucker body is connected to the wafer tray, the first portion, the second portion, and the wafer tray form an airtight space.

Abstract: A wiping apparatus includes a wiping mechanism, a sensor set, and a conveying mechanism. The sensor set includes a first station sensor, the first station sensor corresponds to the wiping mechanism, and the first station sensor is configured to generate a first station signal. The conveying mechanism corresponds to the wiping mechanism, the conveying mechanism is configured to generate a first conveying movement, and the first conveying movement responds to the first station signal. The wiping mechanism generates a first wiping motion according to the first station signal and a first wiping parameter, and the wiping mechanism generates a second wiping motion according to the first wiping motion and a second wiping parameter.

Abstract: A feeding apparatus is provided. The feeding apparatus includes an apparatus body, a container, an elevatable platform, and a pulling mechanism. The container is disposed in the apparatus body, wherein the container has a carrier unit, and the carrier unit is detachably connected to the container. The elevatable platform is disposed on the apparatus body, wherein the elevatable platform is adapted to be moved between the first height and the second height. The pulling mechanism is disposed on the elevatable platform, wherein the pulling mechanism is adapted to be moved relative to the container.