Abstract: A power converter includes a housing including a convex radiator that radiates heat from a heater element and protrudes toward a board, in which the board and the heater element are arranged, and an urging member that is arranged between the board and a bottom surface of the housing and urges the heater element toward a first side surface of the convex radiator of the housing.

Abstract: A power conversion apparatus includes a board including a device for power conversion mounted on the board; a connector fixed to the board and configured to electrically connect the board to an external side; a top plate formed of a metal plate and arranged to cover the board; and a bottom plate formed of a metal plate and arranged to face the top plate. The bottom plate includes a bottom-plate folded part that is arranged on an end part of the bottom plate on which the connector is arranged, and is folded to contact the connector whereby preventing movement of the connector.

Abstract: The power conversion device includes: a DC-DC converter unit including a transformer having a coil substrate where a primary side coil is formed and a bus bar forming a secondary side coil, and converting a voltage of DC power input from a DC power supply into a different voltage; and a cooling portion where a cooling flow path through which a cooling liquid flows is provided and the DC-DC converter unit is disposed. The bus bar of the transformer has a cooling portion side fixed portion fixed to the cooling portion provided with the cooling flow path.

Abstract: This power conversion device includes an inverter, a DC-DC converter, and a flat plate-shaped base where the inverter and the DC-DC converter are disposed on the front side and the back side. The base includes a cooling flow path having a front side flow path disposed on the front side and a back side flow path connected to the front side flow path and disposed on the back side.

Abstract: In this power conversion device, a DC-DC converter substrate on which a DC-DC converter element is mounted is attached to a base portion along the front surface or back surface of the flat plate-shaped base portion.

Abstract: A mounting structure for a heater element includes a heater element having a surface to be cooled, a board on which the heater element is mounted, a cooling member that cools the surface to be cooled of the heater element mounted on the board, and a supporting member temporarily fixed to the board, the supporting member temporarily fixing the heater element.

Abstract: A power converter includes a housing including a convex radiator that radiates heat from a heater element and protrudes toward a board, in which the board and the heater element are arranged, and an urging member that is arranged between the board and a bottom surface of the housing and urges the heater element toward a first side surface of the convex radiator of the housing.

Abstract: A heat sink 7A is disposed on a circuit board, an air duct is disposed on the heat sink, external cooling air is supplied by the fan attached to the sink air inlet of the heat sink and the air duct inlet of the air duct. Cooling air flowing out of the air duct outlet of the air duct comes into contact with the magnetic component mounted on the circuit board.

Abstract: A mounting structure for a heater element includes a heater element having a surface to be cooled, a board on which the heater element is mounted, a cooling member that cools the surface to be cooled of the heater element mounted on the board, and a supporting member temporarily fixed to the board, the supporting member temporarily fixing the heater element.

Abstract: A heat sink 7A is disposed on a circuit board, an air duct is disposed on the heat sink, external cooling air is supplied by the fan attached to the sink air inlet of the heat sink and the air duct inlet of the air duct. Cooling air flowing out of the air duct outlet of the air duct comes into contact with the magnetic component mounted on the circuit board.

Abstract: A power conversion device including: a chassis in which a heat sink is housed, and within which an upper space above the heat sink, a lower space below the heat sink, and a vertically continuous space that continues from a lower part to an upper part of the chassis are formed; a first substrate arranged from the lower space to the vertically continuous space, in which heat of a component mounted on the first substrate is transferred to the heat sink; a second substrate arranged in the upper space, in which heat of a component mounted on the second substrate is transferred to the heat sink; a wiring connecting the first substrate to the second substrate and passing through the vertically continuous space; and a tall electronic component taller than heights of the upper and lower spaces, that is mounted on the first substrate and arranged in the vertically continuous space.

Abstract: Winding components, each being formed by winding a coil around and along an inner peripheral surface and an outer peripheral surface of a ring-shaped core a plurality of times, are fixed to a case. An attachment structure includes a placing member made of an insulating material and fixed to a fixing surface of the case in a state where a lower surface of the winding component is placed, a pressing member made of an insulating material and disposed to abut on an upper surface of the winding component, and a pressing force imparting portion that couples the placing member with the pressing member and imparts a pressing force toward the fixing surface, from the pressing member to the winding component, and in the pressing force imparting portion, a distance between the placing member and the pressing member is variable in accordance with a height change of the winding component.

Abstract: A power conversion device including: a chassis in which a heat sink is housed, and within which an upper space above the heat sink, a lower space below the heat sink, and a vertically communicating space that communicates from a lower part to an upper part of the chassis are formed; a first substrate arranged from the lower space to the vertically communicating space, in which heat of a component mounted on the first substrate is transferred to the heat sink; a second substrate arranged in the upper space, in which heat of a component mounted on the second substrate is transferred to the heat sink; a wiring connecting the first substrate to the second substrate and passing through the vertically communicating space; and a tall electronic component taller than heights of the upper and lower spaces, that is mounted on the first substrate and arranged in the vertically communicating space.

Abstract: Winding components, each being formed by winding a coil around and along an inner peripheral surface and an outer peripheral surface of a ring-shaped core a plurality of times, are fixed to a case. An attachment structure includes a placing member made of an insulating material and fixed to a fixing surface of the case in a state where a lower surface of the winding component is placed, a pressing member made of an insulating material and disposed to abut on an upper surface of the winding component, and a pressing force imparting portion that couples the placing member with the pressing member and imparts a pressing force toward the fixing surface, from the pressing member to the winding component, and in the pressing force imparting portion, a distance between the placing member and the pressing member is variable in accordance with a height change of the winding component.