Abstract: A display panel, including an active area and a peripheral area, which is located outside of the active area, wherein the active area comprises a base substrate, and a display structure layer and a touch structure layer sequentially arranged on the base substrate; the peripheral area includes an isolation dam, a first ground trace and a second ground trace arranged on the base substrate; and the first ground trace is located at a side of the isolation dam close to the active area, and the second ground trace is located at a side of the isolation dam away from the active area.

Abstract: The invention provides a display device and an operation method thereof. The display device includes a calculation unit and a local dimming driving unit. The calculation unit generates image data for displaying on a display panel. The calculation unit determines a location of a mouse pointer (cursor) in the image data based on an operation of a user interface device. The calculation unit defines an attention area corresponding to the mouse pointer based on the location of the mouse pointer. Based on information of the calculation unit, the local dimming driving unit enables a local dimming function for the attention area corresponding to the location of the mouse pointer, or disables the local dimming function for a non-attention area outside the attention area.

Abstract: The invention discloses an ultra-high-toughness multifunctional self-assembly C-S-H gel material and preparation method thereof. The ultra-high-toughness multifunctional self-assembly C-S-H gel material includes several stacked core-shell structure layers, wherein the core-shell structural layer is composed of several core-shell structure particles; the core-shell structure particles are composed of calcium silicate hydrate nanoparticles as the core and poly(acrylamide-co-acrylic acid) as the shell. The obtained ultra-high-toughness multifunctional self-assembly C-S-H gel material has high toughness, good tensile performance and temperature sensitive effect.

Abstract: Various embodiments of the teachings herein include an interface display method for industrial software. An example method includes: obtaining a present operation sequence by a user in a functional interface of industrial software; using a recurrent neural network (RNN) model to predict a next operation of the user according to the present operation sequence by the user, wherein the RNN model is obtained through history operation sequence of the user and history operation sequence of typical users in industrial domain knowledge; and highlighting a functional component of the predicted operation of the user from the functional interface and/or generating navigation corresponding to the predicted operation of the user.

Abstract: A sound effect display method and a terminal device.

Abstract: Provided are a sound effect display method and a terminal device. The method includes receiving a first operation input to a target audio file; in response to the first operation, displaying a sound effect display interface corresponding to the target audio file, the sound effect display interface includes a grid, a sound wave line, and a cover image corresponding to the target audio file; the grid is located on a first plane in an interface scenario of the sound effect display interface, and the first plane is a horizontal plane in the interface scenario; the sound wave line is a closed curve in the first plane, and is used for displaying a sound wave waveform corresponding to a preset sound attribute of the target audio file; and the cover image is on a second plane in the interface scenario.

Abstract: Disclosed are an antibody that can bind to human MASP-2, a preparation method therefor and an application thereof. The anti-human MASP-2 antibody of the present invention can specifically bind to human MASP-2, has good biological activity of inhibiting the cleavage of C4 and the generation of C3b, and can be applied in the treatment of MASP-2 related diseases, such as IgA nephropathy.

Abstract: Embodiments of the present disclosure provide a media collection generation method and apparatus, an electronic device, a storage medium, a computer program product, and a computer program, In the media collection generation method, a plurality of emotion identifiers are displayed in a playing interface for a target piece of media, the emotion identifiers being used for representing preset emotion types; and in response to a first interaction operation on a target emotion identifier, adding the target piece of media to a target emotion media collection corresponding to the target emotion identifier.

Abstract: Disclosed are an antibody that can bind to human MASP-2, a preparation method therefor and an application thereof. The anti-human MASP-2 antibody of the present invention can specifically bind to human MASP-2, has good biological activity of inhibiting the cleavage of C4 and the generation of C3b, and can be applied in the treatment of MASP-2 related diseases, such as IgA nephropathy.

Abstract: Embodiments of bonded semiconductor structures and fabrication methods thereof are disclosed. In an example, a method for forming a semiconductor device is disclosed. A first device layer is formed on a first substrate. A first bonding layer including a first bonding contact and a first bonding alignment mark is formed above the first device layer. A second device layer is formed on a second substrate. A second bonding layer including a second bonding contact and a second bonding alignment mark is formed above the second device layer. The first bonding alignment mark is aligned with the second bonding alignment mark, such that the first bonding contact is aligned with the second bonding contact. The first substrate and the second substrate are bonded in a face-to-face manner, so that the first bonding contact is in contact with the second bonding contact at a bonding interface, and the first bonding alignment mark is in contact with the second bonding alignment mark at the bonding interface.

Abstract: A method for calibrating measurements of human physiological state applied on an electronic device couples the device to at least one uncalibrated measurement device, worn or placed. Readings of a physiological state are collected by the uncalibrated measurement device and the readings are input into a model for calibration. A sub-module corresponding to the type of reading, for blood pressure or heart rate for example, is called up from the calibration model and a regression algorithm is applied to the calibration model to generate a calibrated reading, each sub-module in the model corresponding to one type of reading. The method also outputs calibrated physiological measurements by the called-up sub-module. A related electronic device and a non-transitory storage medium are also disclosed.

Abstract: Embodiments of bonded semiconductor structures and fabrication methods thereof are disclosed. In an example, a bonded structure includes a first bonding layer including a first bonding contact and a first bonding alignment mark, a second bonding layer including a second bonding contact and a second bonding alignment mark, and a bonding interface between the first bonding layer and the second bonding layer. The first bonding alignment mark is aligned with the second bonding alignment mark at the bonding interface, such that the first bonding contact is aligned with the second bonding contact at the bonding interface. The first bonding alignment mark includes a plurality of first repetitive patterns. The second bonding alignment mark includes a plurality of second repetitive patterns different from the plurality of first repetitive patterns.

Abstract: Embodiments of bonded semiconductor structures and fabrication methods thereof are disclosed. In an example, a semiconductor device includes a first semiconductor structure, a second semiconductor structure, and a bonding interface between the first semiconductor structure and the second semiconductor structure. The first semiconductor structure includes a substrate, a first device layer disposed on the substrate, and a first bonding layer disposed above the first device layer and including a first bonding contact and a first bonding alignment mark. The second semiconductor structure includes a second device layer, and a second bonding layer disposed below the second device layer and including a second bonding contact and a second bonding alignment mark. The first bonding alignment mark is aligned with the second bonding alignment mark at the bonding interface, such that the first bonding contact is aligned with the second bonding contact at the bonding interface.

Abstract: An efficient electronic structure for circuit design, testing and/or manufacture for validating a cell layout design using an intelligent engine trained using selectively arranged cells selected from a cell library. An initial design rule violation (DRV) prediction engine is initially trained using a plurality of pin patterns generated by predefined cell placement combinations, where pin patterns are pixelized and quantified and is classified as either (i) a DRV pin pattern (i.e., pin patterns likely to produce a DRV) or (ii) a DRV-clean pin pattern (i.e., pin patterns unlikely to produce a DRV).

Abstract: A method for calibrating measurements of human physiological state applied on an electronic device couples the device to at least one uncalibrated measurement device, worn or placed. Readings of a physiological state are collected by the uncalibrated measurement device and the readings are input into a model for calibration. A sub-module corresponding to the type of reading, for blood pressure or heart rate for example, is called up from the calibration model and a regression algorithm is applied to the calibration model to generate a calibrated reading, each sub-module in the model corresponding to one type of reading. The method also outputs calibrated physiological measurements by the called-up sub-module. A related electronic device and a non-transitory storage medium are also disclosed.

Abstract: Embodiments of bonded semiconductor structures and fabrication methods thereof are disclosed. In an example, a method for forming a semiconductor device is disclosed. A first device layer is formed on a first substrate. A first bonding layer including a first bonding contact and a first bonding alignment mark is formed above the first device layer. A second device layer is formed on a second substrate. A second bonding layer including a second bonding contact and a second bonding alignment mark is formed above the second device layer. The first bonding alignment mark is aligned with the second bonding alignment mark, such that the first bonding contact is aligned with the second bonding contact. The first substrate and the second substrate are bonded in a face-to-face manner, so that the first bonding contact is in contact with the second bonding contact at a bonding interface, and the first bonding alignment mark is in contact with the second bonding alignment mark at the bonding interface.