Patents by Inventor Shun Imai

Shun Imai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20050213128
    Abstract: At least one of a plurality of achromatic object color ranges is selected based on the image targeted for processing, and a color adjustment process is executed based on the selected achromatic object color range. Image may be reproduced using a color image data after a color correction of the color image data, the color correction being performed according to illumination light source associated with the color image data. Image data may also be output after the color correction. Image data may also be output associated with data related to the illumination light source, to reproduce the image after the color correction.
    Type: Application
    Filed: March 11, 2005
    Publication date: September 29, 2005
    Inventors: Shun Imai, Kenji Fukasawa
  • Publication number: 20050009484
    Abstract: Cross-band isolation characteristics are to be significantly improved without using any filtering circuit. In the central part of a semiconductor chip provided in an RF power module is formed a ground wiring layer from the upper part downward. This ground wiring layer is formed on the boundary between GSM side transistors and DCS side transistors for amplifying different frequency bands. Over the ground wiring layer are formed chip electrodes at equal intervals, and any one of the chip electrodes is connected via a bonding wire to a bonding electrode. The bonding electrode is formed over a module wiring board over which the semiconductor chip is to be mounted, and the ground wiring layer is connected to it. Harmonic signals are trapped by the ground wiring layer and the bonding wire.
    Type: Application
    Filed: June 8, 2004
    Publication date: January 13, 2005
    Inventors: Shun Imai, Satoshi Sasaki, Katsunari Nakazawa, Tetsuaki Adachi
  • Patent number: 6753604
    Abstract: The present invention relates to a high frequency circuit module in which a two or more layer dielectric substrate is used. The dielectric substrate provided between a conductor line of a matching circuit on the input side or on the output side and a metal ground is composed of two or more layers. Since a required part can be increased in thickness without changing the thickness of the whole dielectric substrate, the transmission loss can be reduced and the miniaturization of the high frequency circuit module and the communication device using the same can be realized.
    Type: Grant
    Filed: August 14, 2000
    Date of Patent: June 22, 2004
    Assignee: Renesas Technology Corp.
    Inventors: Eiichi Hase, Shun Imai
  • Publication number: 20030027539
    Abstract: A directional coupler for detecting an output of a high frequency circuit module includes a main line and a sub-line overlapped with the main line with a dielectric material. The sub-line is set, in width, narrower than the main line and both side edges of the sub-line are allocated at the internal side of both side edges of the main line. Accordingly, the sub-line is surely provided opposed to the main line in the total width area and a signal current flowing into the main line can be detected in higher accuracy. Therefore, a wireless communication system for controlling an output of the high frequency circuit module by including such directional coupler assures stable communication.
    Type: Application
    Filed: October 1, 2002
    Publication date: February 6, 2003
    Applicant: Hitachi, Ltd.
    Inventors: Hiroyuki Nagamori, Hitoshi Akamine, Shun Imai, Satoshi Arai, Yasuhiro Nunogawa
  • Publication number: 20030022638
    Abstract: The invention realizes a wireless communication module that is capable of transmitting the fundamental wave with low loss and reducing the double higher harmonic wave level to a desired level or lower as the whole module. The invention provides a front end module to be used for a wireless communication system such as cellular phone in which at least an output power amplifier, a matching circuit, and a low-pass filter are mounted on one insulating substrate and these circuits are connected in the above-mentioned order, wherein the relative phase of the double higher harmonic wave impedance between phases in view of the matching circuit side and the low-pass filter side from the connection point between the matching circuit and the low-pass filter is set in a range of 180 degrees±90 degrees.
    Type: Application
    Filed: June 14, 2002
    Publication date: January 30, 2003
    Inventors: Shun Imai, Hitoshi Akamine, Takashi Ito, Satoshi Arai
  • Patent number: 6483398
    Abstract: A directional coupler for detecting an output of a high frequency circuit module includes a main line and a sub-line overlapped with the main line with a dielectric material. The sub-line is set, in width, narrower than the main line and both side edges of the sub-line are allocated at the internal side of both side edges of the main line. Accordingly, the sub-line is surely provided opposed to the main line in the total width area and a signal current flowing into the main line can be detected in higher accuracy. Therefore, a wireless communication system for controlling an output of the high frequency circuit module by including such directional coupler assures stable communication.
    Type: Grant
    Filed: May 4, 2001
    Date of Patent: November 19, 2002
    Assignees: Hitachi, Ltd., Hitachi ULSI Systems Co., LTD
    Inventors: Hiroyuki Nagamori, Hitoshi Akamine, Shun Imai, Satoshi Arai, Yasuhiro Nunogawa
  • Publication number: 20010043130
    Abstract: A directional coupler for detecting an output of a high frequency circuit module includes a main line and a sub-line overlapped with the main line each other with a dielectric material. The sub-line is set, in the width, narrower than the main line and both side edges of the sub-line are allocated at the internal side of both side edges of the main line. Accordingly, the sub-line is surely provided opposed to the main line in the total width area and a signal current flowing into the main line can be detected in higher accuracy. Therefore, a wireless communication system for controlling an output of the high frequency circuit module by comprising such directional coupler assures stable communication.
    Type: Application
    Filed: May 4, 2001
    Publication date: November 22, 2001
    Applicant: Hitachi, Ltd.
    Inventors: Hiroyuki Nagamori, Hitoshi Akamine, Shun Imai, Satoshi Arai, Yasuhiro Nunogawa