Abstract: A heat sink comprises a base plate and a plurality of heat dissipating fins upwardly extending from the base plate. Each fin includes a heat dissipating portion and a connecting portion integrated with the base plate by punching whereby concave sections are left in the connecting portion. The fins can be formed in various shapes by shearing and bending or by bending a metal sheet. A method for making a reliable heat sink includes a preparing step, a punching step and a flattening step. The preparing step comprises manufacturing a base plate and a plurality of fins each including a connecting portion and a heat dissipating portion. The punching step comprises punching the connecting portions of the fins against the base plate thereby integrating the connecting portions with the base plate, forming concave sections in the connecting portions and convex sections on an opposite lower surface of the base plate.

Abstract: A heat sink includes a base plate and a plurality of heat dissipating fins upwardly extending from the base plate. Each fin includes a heat dissipating portion and a connecting portion integrated with the base plate by punching whereby concave sections are left in the connecting portion. The fins can be formed in various shapes by shearing and bending or by bending a metal sheet. A method for making a reliable heat sink includes a preparing step, a punching step and a flattening step. The preparing step comprises manufacturing a base plate and a plurality of fins each including a connecting portion and a heat dissipating portion. The punching step comprises punching the connecting portions of the fins against the base plate thereby integrating the connecting portions with the base plate, forming concave sections in the connecting portions and convex sections on an opposite lower surface of the base plate.

Abstract: A memory module assembly in accordance with the present invention comprises a memory module, such as a RAM module, and a pair of shells for enclosing the RAM module. The RAM module comprises a printed circuit board (PCB), a plurality of memory chips attached on the PCB and a plurality of related electronic elements disposed near the chips. A securing means comprises a clasp for fixing the PCB and the shells together at a middle portion proximate upper edges of the PCB and the shells, and a pair of rivets extending through corresponding positioning apertures defined proximate a bottom edge of the PCB and corresponding apertures defined proximate a bottom edge of the shell. The clasp is resilient and comprises a shoulder and a pair of resilient arms inwardly extending from opposite ends of the shoulder for securing the PCB and the shells together.

Abstract: A heat sink includes a thermally conductive body and at least one clip to secure the conductive body to a circuit board with a central processing unit interposed between the heat sink and the circuit board. The conductive body has a base with a flat bottom face positioned on the central processing unit and a top side on which a plurality of fins are formed. The fins are parallel with and spaced from each other to define slots therebetween which serve as air flow passages. The conductive body is made by means of extrusion whereby the fins and the base are integrated with each other as a unitary member. The clip has a U-shaped anchoring section fit into one of the slots and retained by the adjacent fins and a cantilevered arm extending from the anchoring section and having a free end. The free end has a hole for receiving a fastener to secure the clip to the circuit board. The clip is stamped to be a unitary member. Thus, the manufacture of the heat sink is greatly simplified.

Abstract: A heat sink includes a base plate and a plurality of heat dissipating fins upwardly extending from the base plate. Each fin includes a heat dissipating portion and a connecting portion integrated with the base plate by punching whereby concave sections are left in the connecting portion. The fins can be formed in various shapes by shearing and bending or by bending a metal sheet. A method for making a reliable heat sink includes a preparing step, a punching step and a flattening step. The preparing step comprises manufacturing a base plate and a plurality of fins each including a connecting portion and a heat dissipating portion. The punching step comprises punching the connecting portions of the fins against the base plate thereby integrating the connecting portions with the base plate, forming concave sections in the connecting portions and convex sections on an opposite lower surface of the base plate.

Abstract: A heat sink includes a base plate and a plurality of heat dissipating fins upwardly extending from the base plate. Each fin includes a heat dissipating portion and a connecting portion integrated with the base plate by punching whereby concave sections are left in the connecting portion. The fins can be formed in various shapes by shearing and bending or by bending a metal sheet. A method for making a reliable heat sink includes a preparing step, a punching step and a flattening step. The preparing step comprises manufacturing a base plate and a plurality of fins each including a connecting portion and a heat dissipating portion. The punching step comprises punching the connecting portions of the fins against the base plate thereby integrating the connecting portions with the base plate, forming concave sections in the connecting portion and convex sections on an opposite lower surface of the base plate.

Abstract: A cooler device for fixing a CPU module on a printed circuit board comprises a heat sink having a base and a plurality of fins extending upward from the base and adjacent fins and a portion of the base therebetween defining a reception space. A clip is sized to be retained in one of the reception spaces between adjacent fins and includes a U-shaped portion having a first horizontal portion, two second horizontal portions extending from two ends of the U-shaped portion, and two vertical portions extending downward from the second horizontal portions and respectively forming a boardlock at the end thereof for engaging to the printed circuit board, thereby forcing the first horizontal portion of the U-shaped portion to abut against the base of the heat sink.

Abstract: An apparatus and a method for producing a heat dissipating element having a multiplicity of pins arranged in parallel rows and columns in longitudinal and transverse directions from a generally longitudinally extending extruded member having a base and a number of transversely spaced longitudinally extending ribs on the base. A cover frame having a number of transversely spaced longitudinal grooves is placed over ribs to establish a supporting relationship between the cover frame and the free ends of the ribs. The support provided by the cover frame to the ribs facilitates a subsequent cutting operation by a cutting tool on the ribs, thereby obviating potential damage to the ribs.

Abstract: A method for making a heat sink device, comprises the steps of: 1) forming an second cooling fins strip from a material sheet; 2) providing a substrate having at least two rows of mounting holes; 3) inserting each second cooling fin into the corresponding mounting hole; and 4) cutting a redundant material portion from the second cooling fins.

Abstract: A heat sink includes a base plate having a bottom face adapted to be positioned on an electronic device to remove heat therefrom and a top face on which a central fin assembly and two end fin assemblies are fixed by means of screws. The central fin assembly is located between the end fin assemblies and a space is defined between the central fin assembly and each end fin assembly for receiving a clip to secure the heat sink to the electronic device. The central fin assembly has a number of fins defining passages therebetween through which air flows. Each end fin assembly has a number of fins defining passages therebetween through which air flows. The number of fins of the central fin assembly is greater than that of the end fin assemblies whereby the central fin assembly has a larger surface area for facilitating heat dissipation, while the end fin assemblies have larger passages for reducing resistance to air flowing therethrough.

Abstract: A method for making a heat sink device comprises the steps of 1) forming a base from punching an array of mounting holes in at substrates; 2) forming a plurality of cooling fin strips from a material sheet; 3) aligning and assembling each of the cooling fins to the corresponding mounting holes of the substrate; 4) punching deformation holes in the first substrate to fixedly secure the cooling fin assembled to the mounting holes; and 5) cutting a redundant material portion from the cooling fin strips.

Abstract: A foldable supporting bracket assembly for use with a connector comprises a supporting bracket having a mounting joint at each end thereof, and a supporting pillar pivotably assembled to the mounting joint. Interengaging means for securely positioning the supporting pillar with respect to the mounting joint includes a raised portion integrally formed at a base wall of the pillar. The raised portion defines a directing passage therethrough. A block portion is integrally formed between lugs of the mounting joint and defines a retaining passage therethrough. A latch tab is inserted through the directing passage and the retaining passage thereby securely positioning the supporting pillar with respect to the mounting joint.

Abstract: A heat sink for dissipating heat generated by a CPU, includes a metallic base, a number of heat dissipating fins projecting from the base, thermal grease spread on the base, and a protective cap enclosing the thermal grease to protect it from being contaminated before the heat sink is assembled to the CPU or a CPU module.

Abstract: A protective cap comprises a cap portion and a mounting bracket attached to the cap portion along its peripheral walls. The mounting bracket includes upper and lower bars connected to opposite peripheral walls of the cap portion. A mounting seat is defined by the vertical beam and portions of the upper and lower bars. An attaching tab is seated within the mounting seat for attaching the protective cap to an under face of a heat sink. A tab extends outward from one of the upper and lower bars serving as a handle.

Abstract: A securing device for attaching a heat sink to a vertically mounted CPU module comprises a pair of abutting members, a pair of engaging brackets, and a pair of sleeves. The heat sink defines two grooves between cooling elements extending from a base thereof and a hole through the base of the heat sink at the bottom of each groove for receiving a first end of the corresponding abutting member. Each engaging bracket is formed with a base, two extension portions extending from opposite distal ends of the base, a curved resilient claw extending from an end of each extension portion for engaging with openings defined in the CPU module, and a hole defined in the base for receiving a second end of each abutting member. Each sleeve engages with the second end of the corresponding abutting member and a jig can be used to facilitate the insertion of the claws into the corresponding openings of the CPU whereby the heat sink is firmly secured to the CPU module.

Abstract: A clipping device for attaching a heat sink to an electrical device comprises an elongate biasing strip and a pivotal grasp pivotally connected to an end of the biasing strip. Interconnecting retaining device between the biasing strip and the pivotal grasp to pivotally attach the pivotal grasp to the biasing strip, includes a slot defined in the latch tab and a head portion formed on the biasing strip. The head portion includes a tongue portion and a neck portion. The tongue portion includes at least a wing extending transversely therefrom, wherein the wing is deformed to offset from a horizontal side of the slot after insertion thereof, thereby securely retaining the head portion within the slot.