Patents by Inventor Shun MURAMOTO

Shun MURAMOTO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250027983
    Abstract: A method for estimating a partial discharge factor of a power semiconductor module which is capable of automatically estimating a partial discharge factor is provided using time-series data of a quantity of charge discharged during a partial discharge test. The method includes: a measurement step of applying, to the power semiconductor module, a test voltage pattern in which a voltage pattern changes, and measuring a quantity of charge that is due to partial discharge of the power semiconductor module; a feature quantity extraction step of extracting a plurality of feature quantities including at least a first feature quantity that is an average value of a quantity of charge in a first time period and a second feature quantity that is an average value of a quantity of charge in a second time period; and an estimation step of estimating the partial discharge factor based on the plurality of feature quantities.
    Type: Application
    Filed: November 8, 2022
    Publication date: January 23, 2025
    Inventors: Daisuke YAGI, Kazuaki NAOE, Junpei KUSUKAWA, Shun SAKURAI, Akihiro MURAMOTO
  • Patent number: 10419845
    Abstract: There are provided headphones and a speaker unit having proper acoustic properties and exhibiting excellent reproduced sound quality even in the case of providing air holes at a damping member. The headphones include a speaker unit having a diaphragm and a frame supporting an outer peripheral portion of the diaphragm, a housing configured to house the speaker unit, and a damping member made of a material exhibiting air permeability and attached to cover an opening of the frame through which a sound wave emitted from the diaphragm passes and/or an opening of the housing. The damping member has one or more air holes formed by removal of the material forming the damping member. A secondary damping member is attached to an annular edge portion defining each air hole, thereby reducing vibration of the edge portion.
    Type: Grant
    Filed: April 12, 2018
    Date of Patent: September 17, 2019
    Assignee: ONKYO CORPORATION
    Inventors: Shun Muramoto, Akira Tamadera, Takashi Ouchi
  • Publication number: 20180310093
    Abstract: There are provided headphones and a speaker unit having proper acoustic properties and exhibiting excellent reproduced sound quality even in the case of providing air holes at a damping member. The headphones include a speaker unit having a diaphragm and a frame supporting an outer peripheral portion of the diaphragm, a housing configured to house the speaker unit, and a damping member made of a material exhibiting air permeability and attached to cover an opening of the frame through which a sound wave emitted from the diaphragm passes and/or an opening of the housing. The damping member has one or more air holes formed by removal of the material forming the damping member. A secondary damping member is attached to an annular edge portion defining each air hole, thereby reducing vibration of the edge portion.
    Type: Application
    Filed: April 12, 2018
    Publication date: October 25, 2018
    Inventors: Shun MURAMOTO, Akira TAMADERA, Takashi OUCHI