Patents by Inventor SHUN-SIANG TU

SHUN-SIANG TU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8885345
    Abstract: An electronic device includes a circuit board, a tray abutting a bottom surface of the circuit board, and a heat sink attached to a top surface of the circuit board. The circuit board includes a heat generating chip, and a number of through holes defined in the circuit board. The tray includes a number of clipping members. A number of elastic members are attached to the heat sink. The number of clipping members extend through the number of through holes and engaged with the plurality of elastic members, and the number of elastic members are deformable to disengage from the number of clipping members.
    Type: Grant
    Filed: August 24, 2012
    Date of Patent: November 11, 2014
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Shun-Siang Tu
  • Publication number: 20140152164
    Abstract: An extension tray for a data storage device includes a bottom wall, two sidewalls, and a detaching assembly. The two sidewalls are substantially perpendicular to the bottom wall. The two sidewalls are substantially parallel to each other. A buffer member protrudes form one of the two sidewalls to buffer a movement of the data storage device when the data storage device moves between the two sidewalls. A detaching assembly is accessible through one of the two sidewalls. The detaching assembly moves along a first direction to urge the data storage device to move along a second direction. The first direction is substantially perpendicular to the second direction.
    Type: Application
    Filed: August 8, 2013
    Publication date: June 5, 2014
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: SHUN-SIANG TU
  • Publication number: 20140111941
    Abstract: An electronic device includes a chassis and a cooling module. A plurality of air inlets and a plurality of air outlets are defined in a same side plate of the chassis. A partition separates the air inlets from the air outlets. Air flows into the chassis through the plurality of air inlets and flows out of the plurality of air outlets under the action of the cooling module, and then the electronic device is cooled.
    Type: Application
    Filed: June 28, 2013
    Publication date: April 24, 2014
    Inventors: SHUN-SIANG TU, LI-KAN YEH
  • Publication number: 20140102670
    Abstract: A heat dissipating apparatus includes a heat-generating electronic component, a heat pipe, a heat sink. The heat sink includes a bottom panel, a top panel, and a plurality of fins. An air intake is defined between the bottom panel and the top panel. The plurality of fins defines a first air outlet and a second air outlet. An air guiding wall extends through the plurality of fins. The air intake, the air guiding wall, and the first air outlet together define a first air passage for air extending through the heat sink, and the air intake, the air guiding wall, and the second air outlet together define a second air passage for air extending through the heat sink. The invention further provides an assembly with the heat dissipating apparatus.
    Type: Application
    Filed: June 12, 2013
    Publication date: April 17, 2014
    Inventor: SHUN-SIANG TU
  • Publication number: 20140092557
    Abstract: An electronic device includes a bottom enclosure and a heat dissipating module. The heat dissipating module includes an installation box, a fan received in the installation box, and a plurality of fins secured to the installation box and closed to the fan. The installation box defines a cutout located between the fan and the plurality of fins. Airflow generated by the fan is guided along a first direction by the plurality of fins to dissipate heat generated by a heat generating component, and along a second direction through the cutout to dissipate heat generated by the bottom enclosure; the second direction is substantially perpendicular to the first direction. The heat dissipating module dissipates heat for the heat generating component and the bottom enclosure simultaneously.
    Type: Application
    Filed: June 12, 2013
    Publication date: April 3, 2014
    Inventor: SHUN-SIANG TU
  • Publication number: 20130155621
    Abstract: An electronic device includes a circuit board, a tray abutting a bottom surface of the circuit board, and a heat sink attached to a top surface of the circuit board. The circuit board includes a heat generating chip, and a number of through holes defined in the circuit board. The tray includes a number of clipping members. A number of elastic members are attached to the heat sink. The number of clipping members extend through the number of through holes and engaged with the plurality of elastic members, and the number of elastic members are deformable to disengage from the number of clipping members.
    Type: Application
    Filed: August 24, 2012
    Publication date: June 20, 2013
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: SHUN-SIANG TU