Patents by Inventor Shun-Ta Yu

Shun-Ta Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11353041
    Abstract: A fan blade includes an arc-shaped body and a connecting portion. The arc-shaped body has a main portion and an end portion connected to the main portion, wherein a width of the end portion is gradually decreased in a direction away from the main portion. The connecting portion is connected to the main portion, and the end portion and the connecting portion are respectively located at two opposite sides of the main portion. A fan structure is also provided.
    Type: Grant
    Filed: December 4, 2019
    Date of Patent: June 7, 2022
    Assignee: Acer Incorporated
    Inventors: Yu-Ming Lin, Wen-Neng Liao, Cheng-Wen Hsieh, Jau-Han Ke, Shun-Ta Yu
  • Patent number: 11035378
    Abstract: A fan structure including a fan housing and a fan body is provided. The fan housing includes a base and a cover assembled on the base. The cover includes a main portion, a periphery portion, a plurality of connecting portions and a plurality of flow guiding portions. The connecting portions are connected to the main portion and the periphery portion. The cover has a plurality of air inlet openings among the main portion, the periphery portion and connecting portions, wherein each of the flow guiding portions protrudes from the main portion and is adjacent to an inner side of the corresponding air inlet opening. The fan body is rotatably disposed in the fan housing. An electronic assembly is also provided.
    Type: Grant
    Filed: March 5, 2019
    Date of Patent: June 15, 2021
    Assignee: Acer Incorporated
    Inventors: Jau-Han Ke, Shun-Ta Yu, Cheng-Yu Cheng, Cheng-Wen Hsieh, Wen-Neng Liao
  • Patent number: 10914313
    Abstract: A heat dissipation fan including a hub and a plurality of heat dissipation blades is provided. The heat dissipation blades are arranged around the periphery of the hub. Each of the heat dissipation blades includes a curved surface body and a flow guiding portion. The curved surface body has a pressure bearing surface and a negative pressing surface opposite to the pressure bearing surface. The flow guiding portion is connected to the curved surface body. The flow guiding portion has a concave surface and a convex surface opposite to the concave surface, wherein the concave surface is recessed in the pressure bearing surface and the convex surface protrudes outward from the negative pressing surface.
    Type: Grant
    Filed: August 24, 2018
    Date of Patent: February 9, 2021
    Assignee: Acer Incorporated
    Inventors: Shun-Ta Yu, Wen-Neng Liao, Cheng-Yu Cheng, Jau-Han Ke, Cheng-Wen Hsieh
  • Patent number: 10808715
    Abstract: A heat dissipation fan including a hub and a plurality of metal fan blades disposed all around the hub. Each of the metal fan blades has a first end and a second end opposite to each other, wherein the first end is connected to the hub, and the metal fan blade has a flap wing at the second end. An angle is included between the flap wing and a surface of the metal fan blade.
    Type: Grant
    Filed: October 24, 2018
    Date of Patent: October 20, 2020
    Assignee: Acer Incorporated
    Inventors: Shun-Ta Yu, Wen-Neng Liao, Yu-Ming Lin, Cheng-Yu Cheng, Cheng-Wen Hsieh
  • Publication number: 20200182258
    Abstract: A fan blade includes an arc-shaped body and a connecting portion. The arc-shaped body has a main portion and an end portion connected to the main portion, wherein a width of the end portion is gradually decreased in a direction away from the main portion. The connecting portion is connected to the main portion, and the end portion and the connecting portion are respectively located at two opposite sides of the main portion. A fan structure is also provided.
    Type: Application
    Filed: December 4, 2019
    Publication date: June 11, 2020
    Applicant: Acer Incorporated
    Inventors: Yu-Ming Lin, Wen-Neng Liao, Cheng-Wen Hsieh, Jau-Han Ke, Shun-Ta Yu
  • Publication number: 20200091038
    Abstract: A heat dissipation module configured to dissipate heat from a heat source of an electronic device is provided. The heat dissipation module includes a heat pipe, a plurality of fins, and a fan. One end of the heat pipe is in thermal contact with the heat source. The fins are stacked up to be combined with one another and structurally propped against another end of the heat pipe. The fins form a plurality of flow inlets and a plurality of flow outlets. The fan is disposed at the flow inlets, and air flow generated by the fan flows in via the flow inlets and flows out via the flow outlets. A portion of the fin at the flow outlet forms a bending, and a pitch between any adjacent fins at the bending is less than 1mm to be qualified to achieve a safety certification.
    Type: Application
    Filed: November 21, 2019
    Publication date: March 19, 2020
    Applicant: Acer Incorporated
    Inventors: Shun-Ta Yu, Wen-Neng Liao, Cheng-Yu Cheng, Jau-Han Ke, Cheng-Wen Hsieh
  • Patent number: 10529649
    Abstract: A heat dissipation module configured to dissipate heat from a heat source of an electronic device is provided. The heat dissipation module includes a heat pipe, a plurality of fins, and a fan. One end of the heat pipe is in thermal contact with the heat source. The fins are stacked up to be combined with one another and structurally propped against another end of the heat pipe. The fins form a plurality of flow inlets and a plurality of flow outlets. The fan is disposed at the flow inlets, and air flow generated by the fan flows in via the flow inlets and flows out via the flow outlets. A portion of the fin at the flow outlet forms a bending, and a pitch between any adjacent fins at the bending is less than 1 mm to be qualified to achieve a safety certification.
    Type: Grant
    Filed: December 1, 2017
    Date of Patent: January 7, 2020
    Assignee: Acer Incorporated
    Inventors: Shun-Ta Yu, Wen-Neng Liao, Cheng-Yu Cheng, Jau-Han Ke, Cheng-Wen Hsieh
  • Publication number: 20190277306
    Abstract: A fan structure including a fan housing and a fan body is provided. The fan housing includes a base and a cover assembled on the base. The cover includes a main portion, a periphery portion, a plurality of connecting portions and a plurality of flow guiding portions. The connecting portions are connected to the main portion and the periphery portion. The cover has a plurality of air inlet openings among the main portion, the periphery portion and connecting portions, wherein each of the flow guiding portions protrudes from the main portion and is adjacent to an inner side of the corresponding air inlet opening. The fan body is rotatably disposed in the fan housing. An electronic assembly is also provided.
    Type: Application
    Filed: March 5, 2019
    Publication date: September 12, 2019
    Applicant: Acer Incorporated
    Inventors: Jau-Han Ke, Shun-Ta Yu, Cheng-Yu Cheng, Cheng-Wen Hsieh, Wen-Neng Liao
  • Publication number: 20190163246
    Abstract: A heat dissipation system of an electronic device including a body, at least one heat source, and a heat dissipation module is provided. The body has a stack tunnel, and the heat source is disposed in the body. The heat dissipation module includes an evaporator and a pipe connecting to the evaporator to form a loop, and a working fluid is filled in the loop. The evaporator is in thermal contact with the heat source to absorb heat generated from the heat source, and the heat is transferred to the loop through phase transition of the working fluid in the loop, such that the loop heats the air in the stack tunnel in a two-dimensional manner.
    Type: Application
    Filed: November 26, 2018
    Publication date: May 30, 2019
    Applicant: Acer Incorporated
    Inventors: Yu-Ming Lin, Wen-Neng Liao, Cheng-Wen Hsieh, Cheng-Yu Cheng, Shun-Ta Yu
  • Publication number: 20190128279
    Abstract: A heat dissipation fan including a hub and a plurality of metal fan blades disposed all around the hub. Each of the metal fan blades has a first end and a second end opposite to each other, wherein the first end is connected to the hub, and the metal fan blade has a flap wing at the second end. An angle is included between the flap wing and a surface of the metal fan blade.
    Type: Application
    Filed: October 24, 2018
    Publication date: May 2, 2019
    Applicant: Acer Incorporated
    Inventors: Shun-Ta Yu, Wen-Neng Liao, Yu-Ming Lin, Cheng-Yu Cheng, Cheng-Wen Hsieh
  • Publication number: 20190063451
    Abstract: A heat dissipation fan including a hub and a plurality of heat dissipation blades is provided. The heat dissipation blades are arranged around the periphery of the hub. Each of the heat dissipation blades includes a curved surface body and a flow guiding portion. The curved surface body has a pressure bearing surface and a negative pressing surface opposite to the pressure bearing surface. The flow guiding portion is connected to the curved surface body. The flow guiding portion has a concave surface and a convex surface opposite to the concave surface, wherein the concave surface is recessed in the pressure bearing surface and the convex surface protrudes outward from the negative pressing surface.
    Type: Application
    Filed: August 24, 2018
    Publication date: February 28, 2019
    Applicant: Acer Incorporated
    Inventors: Shun-Ta Yu, Wen-Neng Liao, Cheng-Yu Cheng, Jau-Han Ke, Cheng-Wen Hsieh
  • Publication number: 20180374777
    Abstract: A heat dissipation module configured to dissipate heat from a heat source of an electronic device is provided. The heat dissipation module includes a heat pipe, a plurality of fins, and a fan. One end of the heat pipe is in thermal contact with the heat source. The fins are stacked up to be combined with one another and structurally propped against another end of the heat pipe. The fins form a plurality of flow inlets and a plurality of flow outlets. The fan is disposed at the flow inlets, and air flow generated by the fan flows in via the flow inlets and flows out via the flow outlets. A portion of the fin at the flow outlet forms a bending, and a pitch between any adjacent fins at the bending is less than 1 mm to be qualified to achieve a safety certification.
    Type: Application
    Filed: December 1, 2017
    Publication date: December 27, 2018
    Applicant: Acer Incorporated
    Inventors: Shun-Ta Yu, Wen-Neng Liao, Cheng-Yu Cheng, Jau-Han Ke, Cheng-Wen Hsieh
  • Patent number: 9665140
    Abstract: An electrical device having thermal isolation function includes a housing, a heat-generating source, a heat-conductive member, and a thermal isolation plate. The housing includes an accommodation space therein, an inner surface and an outer surface which is opposite to the inner surface. The heat-generating source is disposed in the accommodation space. The heat-conductive member is disposed in the accommodation space, and is in contact with the heat-generating source. The thermal isolation plate is disposed between the heat-conductive member and the inner surface of the housing, and the thermal isolation plate is formed with a vacuum chamber therein.
    Type: Grant
    Filed: October 21, 2014
    Date of Patent: May 30, 2017
    Assignee: Quanta Computer Inc.
    Inventors: Sung-Fong Yang, Chang-Chun Lan, Yu-Nien Huang, Shun-Ta Yu, Wei-Che Yeh
  • Publication number: 20150277519
    Abstract: An electrical device having thermal isolation function includes a housing, a heat-generating source, a heat-conductive member, and a thermal isolation plate. The housing includes an accommodation space therein, an inner surface and an outer surface which is opposite to the inner surface. The heat-generating source is disposed in the accommodation space. The heat-conductive member is disposed in the accommodation space, and is in contact with the heat-generating source. The thermal isolation plate is disposed between the heat-conductive member and the inner surface of the housing, and the thermal isolation plate is formed with a vacuum camber therein.
    Type: Application
    Filed: October 21, 2014
    Publication date: October 1, 2015
    Applicant: QUANTA COMPUTER INC.
    Inventors: Sung-Fong YANG, Chang-Chun LAN, Yu-Nien HUANG, Shun-Ta YU, Wei-Che YEH
  • Patent number: 7312997
    Abstract: The invention provides a heat-dissipation device and a heat-dissipation method thereof. The electronic device includes a heat source, a thermal interface material (TIM) in contact with the heat source, a heat-dissipation module in contact with the thermal interface material, and an elastic member pushing the heat-dissipation module toward the heat source. The elastic member includes a base and a compressible portion extending from the base, whereby a force, applied to the compressible portion, is transmitted to and uniformly distributed on the base. The heat-dissipation method includes the steps of overlapping a thermal interface material and a heat-dissipation module on the heat source, and exerting a force toward the heat source to the heat-dissipation module.
    Type: Grant
    Filed: July 26, 2005
    Date of Patent: December 25, 2007
    Assignee: Quanta Computer Inc.
    Inventors: Yu-Nien Huang, Shun-Ta Yu, Cheng-Yu Wang, Jim-Fat Tseng, Tsan-Nan Chien, Yu Liu
  • Publication number: 20070248459
    Abstract: A centrifugal fan includes a spiral housing, a driving mechanism and multiple internally mounted impellers. The driving mechanism and the centrifugal impeller, rotated by the driving mechanism, are installed in the spiral housing. A spiral flow channel is defined between the centrifugal impeller and the spiral housing. When the centrifugal impeller rotates, airflow is sucked axially into the spiral housing through an inlet opening and moves along each blade of the centrifugal impeller into the spiral flow channel. The centrifugal impeller includes a hub and multiple blades. Each blade is secured to the hub at one end and has at least one vertical convex strip or vertical concave strip at an opposite end, wherein the vertical convex strip or vertical concave strip on each of blade disturbs the airflow across thereof and reduces narrow-band noise.
    Type: Application
    Filed: June 30, 2006
    Publication date: October 25, 2007
    Inventors: Chun-Fa Tseng, Yu-Nien Huang, Shun-Ta Yu, Cheng-Yu Wang
  • Patent number: 7284952
    Abstract: A centrifugal fan is described. The centrifugal fan is suitable for a portable electrical apparatus. A tongue shape is formed from a volute sidewall of a casing of the centrifugal fan and non-parallel to a rotational axis of blades. Therefore, when the blades rotate to generate a wake flow to blow on a surface of the volute sidewall at the tongue shape, noise generated by the centrifugal fan can be decreased.
    Type: Grant
    Filed: January 28, 2005
    Date of Patent: October 23, 2007
    Assignee: Quanta Computer Inc.
    Inventors: Yu-Nien Huang, Cheng-Yu Wang, Shun-Ta Yu
  • Patent number: 7251134
    Abstract: An extended fin array has a main heat-dissipation module and an extended heat-dissipation module. The main heat-dissipation module and the extended heat-dissipation module are stacked to increase the effective convective area to increase the heat-dissipation effect. The extended heat-dissipation module is in the main heat-dissipation module when the heat amount generated by an electronic device is normal. The extended heat-dissipation module extends out from the main heat-dissipation module to increase the heat convection area when the heat amount generated by the electronic device is large.
    Type: Grant
    Filed: January 31, 2005
    Date of Patent: July 31, 2007
    Assignee: Quanta Computer Inc.
    Inventors: Dennis Liu, Tsan-Nan Chien, Yu-Nien Huang, Shun-Ta Yu, Cheng-Yu Wang
  • Patent number: 7209349
    Abstract: A heat dissipation device for dissipating heat form a heat source includes a control unit, a sensor, a first heat dissipation module, a second heat dissipation module, and a driving mechanism. The sensor electrical connects with the control unit and detects a temperature of the heat source, and reports the temperature to the control unit. The second heat dissipation module is retractably connected to the first heat dissipation module. The driving mechanism is electrically connected to the control unit and the second heat dissipation module. When the temperature exceeds a first temperature, the control unit informs the driving mechanism to extend away from the second heat dissipation module with respect to the first heat dissipation module.
    Type: Grant
    Filed: May 19, 2005
    Date of Patent: April 24, 2007
    Assignee: Quanta Computer, Inc.
    Inventors: Tsan-Nan Chien, Yu Liu, Yu-Nien Huang, Shun-Ta Yu, Cheng-Yu Wang, Jim-Fat Tseng
  • Patent number: 7191822
    Abstract: An aluminum extruded fin set includes a substrate and a plurality of dissipation fins mounted upright on it. There are gaps between heat dissipation fins. Each dissipation fin is divided into three child dissipation fins by two slanted cutouts. The child dissipation fin between two slanted cutouts is bent toward the gap between heat dissipation fins. When airflow passes by the gaps, the airflow velocity distribution is modified due to the bent child dissipation fins and the noise spectrum distribution is modified as well. Such a Hay-stack noise spectrum distribution is more comfortable for the listener than a conventional one.
    Type: Grant
    Filed: April 14, 2005
    Date of Patent: March 20, 2007
    Assignee: Quanta Computer Inc.
    Inventors: Yu-Nien Huang, Shun-Ta Yu, Cheng-Yu Wang, Jim-Fat Tseng