Abstract: An optoelectronic device includes a semiconductor substrate, wherein a first transport layer is formed on a first partial region of the semiconductor substrate; a first insulation layer is formed on a second partial region around the first partial region; the first transport layer is formed on the first insulation layer; an interface layer is formed on the first transport layer; a light-emitting material layer containing perovskite material is formed on the interface layer; a second insulation layer is formed on the light-emitting material layer in the second partial region and on the light-emitting material layer near a second partial region side in the first partial region, so that the characteristic size of a single light-emitting pixel or effective working region is adjustable.

Abstract: An optoelectronic device includes a semiconductor substrate, wherein a first transport layer is formed on a first partial region of the semiconductor substrate; a first insulation layer is formed on a second partial region around the first partial region; the first transport layer is formed on the first insulation layer; an interface layer is formed on the first transport layer; a light-emitting material layer containing perovskite material is formed on the interface layer; a second insulation layer is formed on the light-emitting material layer in the second partial region and on the light-emitting material layer near a second partial region side in the first partial region, so that the characteristic size of a single light-emitting pixel or effective working region is adjustable.

Abstract: The hinge is made with a metal injection molding process from an alloy having at least: from 4 to 32 wt % Mn, from 16 to 37 wt % Cr, and from Fe that fills up the rest of the percentage.

Abstract: The hinge in accordance with the present invention is made with a metal injection molding process from an alloy having at least: from 4 to 32 wt % Mn, from 16 to 37 wt % Cr and Fe that fills up the rest percentage.

Abstract: A light emitting diode substrate assembly has a metal substrate, a circuit board, multiple chip strings, an annular wall and an encapsulant. The circuit board is mounted on the top surface of the substrate and has multiple through holes and multiple current conducting lines. The chip strings are mounted on the substrate and respectively in the through hole in the circuit board. Each chip string has at least one light emitting diode chip connected electrically to two corresponding current conducting lines on the circuit board with bonding wires. Accordingly, the heat generating during the operation of the chips can be efficiently dissipated from the substrate.

Abstract: A light emitting diode (LED) lamp has a seat with a base, a cover mounted on the seat, and an AC fan, a heat sink and an AC LED light source mounted in the seat. The AC fan and the AC LED light source are electrically connected to the base of the seat. An AC directly provides to and drives the AC fan and the AC LED light source and no converter module is needed. Therefore, the LED lamp is quiet, energy saving and has good heat dissipation and low manufacturing costs for a prolonged operating life.

Abstract: A light emitting diode substrate assembly has a metal substrate, a circuit board, multiple chip strings, an annular wall and an encapsulant. The circuit board is mounted on the top surface of the substrate and has multiple through holes and multiple current conducting lines. The chip strings are mounted on the substrate and respectively in the through hole in the circuit board. Each chip string has at least one light emitting diode chip connected electrically to two corresponding current conducting lines on the circuit board with bonding wires. Accordingly, the heat generating during the operation of the chips can be efficiently dissipated from the substrate.

Abstract: A light-emitting diode (LED) package including a carrier, a pair of conductive wire units, an LED chip, and a control circuit module is provided. The carrier has a carrying portion and a ring frame connected to the periphery of the carrying portion. The carrying portion has a dome-like upper surface and a pair of through holes. The pair of conductive wire units is disposed inside the through holes respectively, and each of the conductive wire units has a conductive wire and an insulating material encapsulating the conductive wire. The LED chip is disposed on the upper surface of the carrier and is electrically connected to the conductive wires. The control circuit module is disposed at a bottom of the carrier and is electrically connected to the conductive wires for controlling the operation of the LED chip.

Abstract: A method for manufacturing a chip antenna is invented, which comprises forming multiple meandered lines, folding the meandered line set, and forming a package to encapsulate a three-dimensional antenna structure. The material of the package is a dielectric composite formed with polymers and ceramic powders, which has a dielectric constant designed for the antenna. The characteristics of the chip antenna are determined by the structures of the antenna body and the dielectric constant of the package. Thus, a requirement for miniature structures in antenna applications can be satisfied.

Abstract: A light-emitting device of a light-emitting diode (LED) and a manufacture method thereof are provided. The light-emitting device includes a post-like metal material, a printed circuit board, conductors, insulators, light-emitting diodes, wires, and an encapsulating material. The light-emitting device has through holes, in which conductors are disposed and surrounded with the insulators. One end of each conductor is connected to the printed circuit board to form a composite structure heat-dissipation substrate. The light-emitting diodes are disposed on the post-like metal material, connected to the conductors via the wires, and encapsulated by the encapsulating material. Furthermore, the light-emitting diodes, the wires, and the encapsulating material can be combined into a light-emitting unit. Moreover, red, blue, and green light-emitting diodes can be combined and the color of output light thereof can be adjusted by controlling the input signal.

Abstract: A light-emitting diode (LED) package including a carrier, a pair of conductive wire units, an LED chip, and a control circuit module is provided. The carrier has a carrying portion and a ring frame connected to the periphery of the carrying portion. The carrying portion has a dome-like upper surface and a pair of through holes. The pair of conductive wire units is disposed inside the through holes respectively, and each of the conductive wire units has a conductive wire and an insulating material encapsulating the conductive wire. The LED chip is disposed on the upper surface of the carrier and is electrically connected to the conductive wires. The control circuit module is disposed at a bottom of the carrier and is electrically connected to the conductive wires for controlling the operation of the LED chip.

Abstract: A light emitting diode (LED) package including a heat dissipation base, an electrical insulating layer, a circuit layer, and an LED chip is provided. The electrical insulating layer is disposed on the heat dissipation base. The circuit layer is disposed on the electrical insulating layer. The circuit layer has a receiving hole extending and passing through the electrical insulating layer for exposing a portion of the heat dissipation base. The LED chip is disposed on the heat dissipation base exposed by the receiving hole and is electrically connected to the circuit layer.

Abstract: A light emitting diode (LED) lamp including a substrate, a plurality of wire units, a plurality of LED chips, a lamp cap, and a control circuit module is provided. The substrate has a carrying portion and a ring frame connected to the periphery thereof. The carrying portion has a plurality of openings. The wire units are respectively disposed inside the openings. Each wire unit has a wire and an insulating material covering the periphery of the wire, such that the wire is electrically isolated from the substrate. The LED chips are disposed on the carrying portion, and each LED chip is electrically connected to the corresponding wires. The lamp, cap is disposed on the bottom of the substrate and has two power contacts. The control circuit module is disposed between the substrate and the lamp cap and electrically connected to wires and power contacts, to control operations of LED chips.

Abstract: A heat dissipation module including a substrate, a printed circuit board (PCB), and at least one light emitting diode (LED) chip is provided. A surface of the substrate has at least one positioning portion protruding upward. The PCB has at least one positioning hole corresponding to the positioning part. The PCB is disposed on the surface of the substrate, such that the positioning part is located in the positioning hole. The LED chip is disposed on the positioning part and electrically connected to the PCB.

Abstract: A chip antenna apparatus for receiving global positioning system signals, includes a L-shaped ground area and an omni-directional chip antenna. The L-shaped ground area is disposed on a circuit board. The omni-directional chip antenna is disposed in a gap of the L-shaped ground area on the circuit board and electrically connected to the L-shaped ground area.

Abstract: A method for manufacturing microchip antenna comprises a dielectric substrate having antenna radiation conductor paths composing of at least one feeding point and multiple-curved paths; a dielectric substrate having the antenna radiation conductor paths being packaged by the material capable of adjusting easily dielectric constant; and an antennal object including antenna radiation conductor paths, feeding ends, welding spots and packaging materials. The main body of the antenna has multi-folded paths, feeding ends, welding spots, and a packaging body. The radiation wires of the antenna is built on a single or a multiple input ends on a dielectric substrate and is multi-folded wires and it is packaged by another dielectric material. The radiation wires of the antenna can be designed and manufactured in three dimension so as to reduce the area occupied by the antenna and reduce the coupling interference between the elements.

Abstract: A method of fabricating antenna units is described, including providing a conductive material and a dielectric material, laminating the conductive material and the dielectric material, press-cutting the conductive material to form therein circuits of a plurality of antenna units, removing the conductive material other than the circuits to form a composite structure, and cutting the composite structure to obtain the antenna units. Before each antenna unit is obtained through cutting, a chip may be bonded onto the circuit thereof and then packaged so that an RFID tag is obtained after the cutting. The method allows the manufacturer to conduct a fabricating process in high efficiency, low cost and little pollution in a continuous manner, and also allows each antenna to have a full receiving performance due to the precision of the process.

Abstract: A connection apparatus for a chip antenna includes a connection base and at least one chip slot. The connection base is disposed on a circuit board and connects to the electronic components of the circuit board via a connection wire. The chip slot is disposed on the connection base for inserting the chip antenna. Thus, the chip antenna is connected to the electronic components of the circuit board via the connection wire.

Abstract: An integrating SOC capable of integrating a micro-antenna System on Chip (SOC) of integrating micro-antennas comprises an existing radio frequency model, a circuit board and an antenna element to a package of single SOC. The micro-antenna element is formed by using antenna radiated conductor paths composing of a single-feeding end or multiple-feeding ends and multiple-curved paths. Active or passive elements are selected to match up the antenna element and relative circuits, and arranges on the circuit board. Then by using embedding type injection molding or glue-filling modeling, the single SOC is finished by the package of a radio frequency model and an antenna element.

Abstract: A chip antenna apparatus for receiving global positioning system signals, includes a L-shaped ground area and an omni-directional chip antenna. The L-shaped ground area is disposed on a circuit board. The omni-directional chip antenna is disposed in a gap of the L-shaped ground area on the circuit board and electrically connected to the L-shaped ground area.