Patents by Inventor Shun UCHIYAMA

Shun UCHIYAMA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230368948
    Abstract: Provided are a novel insulating material for a circuit substrate and a novel metal foil-clad laminate, and the like, in which the anisotropy of coefficients of linear thermal expansion in a MD direction, a TD direction, and a ZD direction is reduced. An insulating material for a circuit substrate, comprising a thermoplastic liquid crystal polymer film, wherein ratios of average coefficients of linear thermal expansion in a MD direction, a TD direction, and a thickness direction (CTEMD, CTETD, CTEZ) at 23 to 200° C., as measured by a TMA method according to JIS K7197, satisfy the following expressions (I) to (III): 0.5?CTEMD/CTETD?1.5 ??(I) 0.10?CTEMD/CTEZ?1.00 ??(II) 0.10?CTETD/CTEZ?1.00 ??(III).
    Type: Application
    Filed: September 21, 2021
    Publication date: November 16, 2023
    Applicant: Denka Company Limited
    Inventors: Shun UCHIYAMA, Yusuke MASUDA
  • Publication number: 20230371188
    Abstract: Provided are an insulating material for a circuit substrate, which has excellent dielectric characteristics in a high frequency area, has low coefficients of linear thermal expansion all in a MD direction, a TD direction, and a ZD direction, is easily manufactured and has excellent productivity, and a method for manufacturing the same and a metal foil-clad laminate. An insulating material for a circuit substrate, comprising a laminate having a thermoplastic liquid crystal polymer film and a woven fabric of an inorganic fiber, wherein the thermoplastic liquid crystal polymer film contains an inorganic filler, and the laminate is a dry laminate in which the thermoplastic liquid crystal polymer film and the woven fabric are thermocompression bonded.
    Type: Application
    Filed: September 21, 2021
    Publication date: November 16, 2023
    Applicant: Denka Company Limited
    Inventors: Shun UCHIYAMA, Yusuke MASUDA
  • Patent number: 11541645
    Abstract: A cover film having at least (A) a substrate layer, (B) an intermediate layer, (C) an adhesive layer, and (D) a heat seal layer having a heat sealable resin, a thermoplastic resin of the (D) heat sealing layer having a mixture of two types of (meth)acrylic acid ester copolymers having different glass transition temperatures and a hydrazide compound, wherein one of the (meth)acrylic acid ester copolymer in the (meth)acrylic acid ester copolymer mixture has a glass transition temperature of ?20 to 10° C. and the other (meth)acrylic acid ester copolymer has a glass transition temperature of 40 to 80° C.
    Type: Grant
    Filed: October 29, 2018
    Date of Patent: January 3, 2023
    Assignee: DENKA COMPANY LIMITED
    Inventors: Takanori Atsusaka, Akira Sasaki, Saori Niwa, Shun Uchiyama, Akihiro Yoshikawa
  • Publication number: 20220105707
    Abstract: A method of producing a double-sided metal-clad laminate comprises a supplying step of supplying an insulating film interposed between two metal foils continuously to between a pair of endless belts, a heat and pressure applying step of forming a laminate of the insulating film and the metal foils by heating and applying a pressure to the insulating film and the metal foils under predetermined condition while the insulating film is interposed by the two metal foils in between the endless belts, and a cooling step of cooling the laminate, wherein the insulating film has a thickness of 10 to 500 ?m, a degree of planar orientation of 30% or more, an average coefficient of linear expansion in an MD direction of ?40 to 0 ppm/K and an average coefficient of linear expansion in a TD direction of 0 to 120 ppm/K.
    Type: Application
    Filed: January 22, 2020
    Publication date: April 7, 2022
    Inventors: Ikuka INODA, Yusuke MASUDA, Shun UCHIYAMA, Takako EBISUZAKI
  • Publication number: 20210268695
    Abstract: A method of producing a thermoplastic liquid-crystal polymer film includes forming a thermoplastic liquid-crystal polymer film having opposite surfaces by molding a thermoplastic liquid-crystal polymer, melting the thermoplastic liquid-crystal polymer film by heating the thermoplastic liquid-crystal polymer film with the opposite surfaces being in contact with two support sheets at a temperature of from a melting point of the thermoplastic liquid-crystal polymer to a temperature higher than the melting point by 70° C., cooling the melted thermoplastic liquid-crystal polymer film to a temperature equal to or less than a crystallization temperature of the thermoplastic liquid-crystal polymer at a cooling rate of from 3° C. per second to 7° C. per second, and separating the cooled thermoplastic liquid-crystal polymer film from the support sheets.
    Type: Application
    Filed: July 8, 2019
    Publication date: September 2, 2021
    Inventors: Shun UCHIYAMA, Ikuka INODA
  • Publication number: 20200247099
    Abstract: A cover film having at least (A) a substrate layer, (B) an intermediate layer, (C) an adhesive layer, and (D) a heat seal layer having a heat sealable resin, a thermoplastic resin of the (D) heat sealing layer having a mixture of two types of (meth)acrylic acid ester copolymers having different glass transition temperatures and a hydrazide compound, wherein one of the (meth)acrylic acid ester copolymer in the (meth)acrylic acid ester copolymer mixture has a glass transition temperature of ?20 to 10° C. and the other (meth)acrylic acid ester copolymer has a glass transition temperature of 40 to 80° C.
    Type: Application
    Filed: October 29, 2018
    Publication date: August 6, 2020
    Applicant: DENKA COMPANY LIMITED
    Inventors: Takanori ATSUSAKA, Akira SASAKI, Saori NIWA, Shun UCHIYAMA, Akihiro YOSHIKAWA