Patents by Inventor Shun Yee LAO

Shun Yee LAO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Plating leveler for electrodeposition of copper pillar
    Patent number: 10100420
    Abstract: The presently claimed invention provides a plating additive for electrodeposition, and the corresponding fabrication method thereof. The plating additive of the present invention enables to electroplate holes on a substrate with good height uniformity within a feature and among features at different diameters.
    Type: Grant
    Filed: December 29, 2015
    Date of Patent: October 16, 2018
    Assignee: Hong Kong Applied Science and Technology Research Institute Company Limtied
    Inventors: Yaofeng Sun, Minjie Xu, Shun Yee Lao, Shu Kin Yau
  • PLATING LEVELER FOR ELECTRODEPOSITION OF COPPER PILLAR
    Publication number: 20170183791
    Abstract: The presently claimed invention provides a plating additive for electrodeposition, and the corresponding fabrication method thereof. The plating additive of the present invention enables to electroplate holes on a substrate with good height uniformity within a feature and among features at different diameters.
    Type: Application
    Filed: December 29, 2015
    Publication date: June 29, 2017
    Inventors: Yaofeng SUN, Minjie XU, Shun Yee LAO, Shu Kin YAU