Abstract: A heat dissipation device includes a plurality of fins, at least one first heat pipe and at least one second heat pipe. Each of the fins includes a main body and two first deflectors. The main body has an inflow side, an outflow side and two first communication openings. The first communication openings are located between the inflow side and the outflow side. The first deflectors are arranged obliquely relative to the main body and respectively located on sides of the first communication openings. Air flowing out of the first communication openings is guided by the first deflectors to flow into an area between the first deflectors. The first heat pipe is located between the first deflectors. The second heat pipe is located on one side of one of the first deflectors located relatively far away from the other one of the first deflectors.

Abstract: A liquid cooling device is configured to be in fluid communication with a heat absorbing component. The liquid cooling device includes a first tank, a second tank, a third tank, and a channel structure. The second tank has a first connector, the third tank has a second connector, and the first connector and the second connector are configured to be in fluid communication with the heat absorbing component via pipes. The second tank and the third tank are in fluid communication with the first tank via the channel structure. Orthogonal projections of the second tank and the third tank onto the first tank do not overlap with each other.

Abstract: This disclosure relates to a liquid-cooling device that includes a liquid block and a radiator. The liquid block is in thermal contact with an interface card. The radiator includes a first tank, a second tank, and a heat dissipation channel structure. The first tank and the second tank respectively have a first chamber and a second chamber. The heat dissipation channel structure includes a plurality of liquid transmission components. The first chamber and the second chamber are respectively connected to two opposite sides of the heat dissipation channel structure. Each of the liquid transmission components has an end in fluid communication with the first chamber of the first tank and another end in fluid communication with the second chamber of the second tank. The first chamber and the second chamber are in fluid communication with the liquid block to form a cooling cycle.

Abstract: A water cooling radiator includes a first radiator having a liquid tank, first liquid return tank, first inlet radiator portion, and first outlet radiator portion. The first inlet radiator portion is adjacent to the first outlet radiator portion and both are between the liquid tank and first liquid return tank. The first inlet radiator portion includes at least one first inlet pipe thermally coupled to at least one first inlet heat dissipating fin. The first outlet radiator portion includes at least one first outlet pipe thermally coupled to at least one first outlet heat dissipating fin. A first inlet temperature of a liquid coolant at a first inlet fluid input end is greater than a first return temperature of the liquid coolant at a first outlet fluid input end. A pitch measurement of a first inlet fin pitch is greater than a pitch measurement of a first outlet fin pitch.

Abstract: A heat dissipation device includes a plurality of fins, at least one first heat pipe and at least one second heat pipe. Each of the fins includes a main body and two first deflectors. The main body has an inflow side, an outflow side and two first communication openings. The first communication openings are located between the inflow side and the outflow side. The first deflectors are arranged obliquely relative to the main body and respectively located on sides of the first communication openings. Air flowing out of the first communication openings is guided by the first deflectors to flow into an area between the first deflectors. The first heat pipe is located between the first deflectors. The second heat pipe is located on one side of one of the first deflectors located relatively far away from the other one of the first deflectors.

Abstract: This disclosure relates to a liquid-cooling device that includes a liquid block and a radiator. The liquid block is in thermal contact with an interface card. The radiator includes a first tank, a second tank, and a heat dissipation channel structure. The first tank and the second tank respectively have a first chamber and a second chamber. The heat dissipation channel structure includes a plurality of liquid transmission components. The first chamber and the second chamber are respectively connected to two opposite sides of the heat dissipation channel structure. Each of the liquid transmission components has an end in fluid communication with the first chamber of the first tank and another end in fluid communication with the second chamber of the second tank. The first chamber and the second chamber are in fluid communication with the liquid block to form a cooling cycle.

Abstract: A liquid cooling device is configured to be in fluid communication with a heat absorbing component. The liquid cooling device includes a first tank, a second tank, a third tank, and a channel structure. The second tank has a first connector, the third tank has a second connector, and the first connector and the second connector are configured to be in fluid communication with the heat absorbing component via pipes. The second tank and the third tank are in fluid communication with the first tank via the channel structure. Orthogonal projections of the second tank and the third tank onto the first tank do not overlap with each other.

Abstract: Disclosed is a water cooling system for a circuit board with heat generating components. The water cooling system includes a fin module, a water block, a liquid guiding tube and a fan. The fin module is installed on the circuit board and has a through hole; the water block is clamped between the fin module and the circuit board and has a side thermally coupled to the heat generating components, and further has a liquid inlet end and a liquid outlet end; the liquid guiding tube communicates with the liquid inlet end and the liquid outlet end and passes and is fixed into the through hole and thermally coupled to an inner wall of the through hole; and the fan is configured to be corresponsive to the fin module. Therefore, the water cooling system has the advantages of reduced volume and high cooling efficiency.

Abstract: Disclosed is a water cooling system for a circuit board with heat generating components. The water cooling system includes a fin module, a water block, a liquid guiding tube and a fan. The fin module is installed on the circuit board and has a through hole; the water block is clamped between the fin module and the circuit board and has a side thermally coupled to the heat generating components, and further has a liquid inlet end and a liquid outlet end; the liquid guiding tube communicates with the liquid inlet end and the liquid outlet end and passes and is fixed into the through hole and thermally coupled to an inner wall of the through hole; and the fan is configured to be corresponsive to the fin module. Therefore, the water cooling system has the advantages of reduced volume and high cooling efficiency.