Abstract: An automatic concrete dam defect image description generation method based on graph attention network, including: 1) extract the local grid features and whole image features of the defect image and conduct image coding by using multi-layer convolutional neural network; 2) construct the grid feature interaction graph, and fuse and encode the grid visual features and global image features of the defect image; 3) update and optimize the global and local features through the graph attention network, and fully utilize the improved visual features for defect description. The invention constructs the grid feature interaction graph, updates the node information by using the graph attention network, and realizes the feature extraction task as the graph node classification task. The invention can capture the global image information of the defect image and the potential interaction of local grid features, and the generated description text can accurately and coherently describe the defect information.

Abstract: The present disclosure relates to a traceable in-situ micro- and nano-indentation testing instrument and method under variable temperature conditions. A macro-micro switchable mechanical loading module, a nano mechanical loading module and an indentation position optical positioning module are fixed on a gantry beam, an optical imaging axis of an optical microscopic in-situ observation or alignment module and a loading axis of the nano mechanical loading module are coplanar, the optical microscopic in-situ observation or alignment module and the function switchable module are mounted on a table top of a marble pedestal, and a contact or ambient mixed variable temperature module is fixedly mounted on the function switchable module. A modular design is adopted, the micro- and nano-indentation testing instrument is used as a core, in combination with a multi-stage vacuum or ambient chamber, an indentation depth traceability calibration module and multiple sets of optical microscopic imaging assemblies.

Abstract: Embodiments of the present disclosure provide an IC packaging structure and an IC packaging method, relating to the chip packaging field. The IC packaging structure includes: a substrate, a stress buffer sheet mounted on the substrate; a packaged chip mounted on the stress buffer sheet, and a plastic package body coated outside the packaged chip, wherein the packaged chip is electrically connected to the substrate, and the stress buffer sheet is used for buffering stress acting on the packaged chip. Compared with the prior art, in the IC packaging structure provided in the present disclosure, the stress buffer sheet is mounted on the substrate through silver glue, the packaged chip is mounted on the stress buffer sheet through silver glue.

Abstract: The present disclosure relates to a traceable in-situ micro- and nano-indentation testing instrument and method under variable temperature conditions. A macro-micro switchable mechanical loading module, a nano mechanical loading module and an indentation position optical positioning module are fixed on a gantry beam, an optical imaging axis of an optical microscopic in-situ observation or alignment module and a loading axis of the nano mechanical loading module are coplanar, the optical microscopic in-situ observation or alignment module and the function switchable module are mounted on a table top of a marble pedestal, and a contact or ambient mixed variable temperature module is fixedly mounted on the function switchable module. A modular design is adopted, the micro- and nano-indentation testing instrument is used as a core, in combination with a multi-stage vacuum or ambient chamber, an indentation depth traceability calibration module and multiple sets of optical microscopic imaging assemblies.

Abstract: Embodiments of the present disclosure provide an IC packaging structure and an IC packaging method, relating to the chip packaging field. The IC packaging structure includes: a substrate, a stress buffer sheet mounted on the substrate; a packaged chip mounted on the stress buffer sheet, and a plastic package body coated outside the packaged chip, wherein the packaged chip is electrically connected to the substrate, and the stress buffer sheet is used for buffering stress acting on the packaged chip. Compared with the prior art, in the IC packaging structure provided in the present disclosure, the stress buffer sheet is mounted on the substrate through silver glue, the packaged chip is mounted on the stress buffer sheet through silver glue.

Abstract: Provided are a material in-situ test device and method under multi-load and multi-physical field coupled service conditions. The device is composed of a precise six-degree-of-freedom composite load applying module, a precise torsion module, a precise indentation module, a clamp module and a control module which work together to complete a composite-load and multi-physical field coupled experiment, and is integrated with a digital speckle strain measurement and infrared thermal imaging module and a microscope observation module, so as to carry out in-situ observation and quantitative characterization on material deformation behaviors and damage mechanism phenomena in a composite-load and multi-physical field loading process. For example, loading methods of “cantilever type pure bending, cantilever type tension/compression-torsion, and cantilever type bending-torsion”, etc. can realize the loading of composite load.

Abstract: Provided are a material in-situ test device and method under multi-load and multi-physical field coupled service conditions. The device is composed of a precise six-degree-of-freedom composite load applying module, a precise torsion module, a precise indentation module, a clamp module and a control module which work together to complete a composite-load and multi-physical field coupled experiment, and is integrated with a digital speckle strain measurement and infrared thermal imaging module and a microscope observation module, so as to carry out in-situ observation and quantitative characterization on material deformation behaviours and damage mechanism phenomena in a composite-load and multi-physical field loading process. For example, loading methods of “cantilever type pure bending, cantilever type tension/compression-torsion, and cantilever type bending-torsion”, etc. can realize the loading of composite load.