Patents by Inventor Shung-Bo Lin

Shung-Bo Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11852679
    Abstract: A circuit board for semiconductor test includes first and second sub-circuit boards, and an insulating dielectric layer therebetween. Each sub-circuit board includes a substrate and circuits including upper and lower contacts. The insulating dielectric layer includes through holes, and connecting conductors disposed therein and electrically connected with the upper and lower contacts of two sub-circuit boards. The circuit board is defined with central and peripheral regions. The lower contacts of the first sub-circuit board in the central region are electrically connected with a probe head. The upper contacts of the second sub-circuit board in the peripheral region are electrically connected with a tester, larger in pitch than the lower contacts of the first sub-circuit board in the central region, and larger in amount than the lower contacts of the first sub-circuit board in the peripheral region. The circuit board has great power test uniformity.
    Type: Grant
    Filed: April 14, 2022
    Date of Patent: December 26, 2023
    Assignee: MPI CORPORATION
    Inventors: Shih-Ching Chen, Jun-Liang Lai, Shung-Bo Lin, Ta-Cheng Liao, Yu-Chih Hsiao, Kun-Han Hsieh