Abstract: A laser processing apparatus includes a processing nozzle. The processing nozzle includes an upper wall having a laser beam passage port defined therein, a lower wall that is connected to a lower portion of a part of the upper wall and that includes a debris capturing chamber defined therein, a suction port defined between another part of the upper wall and the lower wall, a first air ejection port defined in the lower wall, for ejecting air across the debris capturing chamber toward the suction port in a predetermined direction perpendicular to an optical path of a laser beam, and a second air ejection port defined in the lower wall below the first air ejection port, for ejecting air in the predetermined direction. A flow rate of air ejected from the second air ejection port is smaller than a flow rate of air ejected from the first air ejection port.

Abstract: A plate-shaped workpiece holding tool includes a holding base having a joint port coupled to a suction source and a holding surface for holding the plate-shaped workpiece thereon, a first O-ring disposed on the holding surface, a second O-ring disposed on the holding surface radially inwardly of the first O-ring, a suction port that is open in the holding surface between the first O-ring and the second O-ring and held in fluid communication with the joint port, and a liquid supply mechanism for forming a liquid seal between the holding surface and the plate-shaped workpiece radially outwardly of the first O-ring.

Abstract: A grinding apparatus includes a loading unit for loading a wafer to a chuck table having a holding surface for holding the wafer, an unloading unit for unloading the wafer from the chuck table, and a cleaning unit for cleaning the holding surface of the chuck table or the upper surface of the wafer held on the holding surface of the chuck table. The cleaning unit includes a cleaning portion and a horizontal moving portion for horizontally moving the cleaning portion in a lateral direction of the grinding apparatus. The loading unit has a first holding portion for holding the wafer, and the unloading unit has a second holding portion for holding the wafer.

Abstract: A laser processing apparatus has a suction unit for suctioning debris. The suction unit includes a debris trapping chamber and a cleaning unit for cleaning the inside of the debris trapping chamber. The cleaning unit includes a shutter for closing an opening of the debris trapping chamber and a cleaning water supply port for supplying cleaning water to the debris trapping chamber when the opening thereof is closed. The shutter closes the opening of the debris trapping chamber, the suction unit exerts a suction through the suction port, and cleaning water is supplied from the cleaning water supply port to the debris trapping chamber and suctioned through the suction port to clean the inside of the debris trapping chamber.

Abstract: A laser processing apparatus ablates the upper surface of a plate-shaped workpiece by using a laser beam passed through a water-soluble protective film formed on the upper surface of the plate-shaped workpiece. A nozzle applies the laser beam to the upper surface of the plate-shaped workpiece. The processing nozzle includes a debris capturing chamber for capturing debris scattering due to the application of the laser beam. A capturing space is defined in the debris capturing chamber, and an air discharge port and a suction port are opposed to each other in the capturing space. Air is discharged from the air discharge port toward the suction port so as to produce an air flow perpendicular to the optical path of the laser beam, so that the debris is sucked into the suction port by this air flow.

Abstract: A laser processing apparatus has a suction unit for suctioning debris. The suction unit includes a debris trapping chamber and a cleaning unit for cleaning the inside of the debris trapping chamber. The cleaning unit includes a shutter for closing an opening of the debris trapping chamber and a cleaning water supply port for supplying cleaning water to the debris trapping chamber when the opening thereof is closed. The shutter closes the opening of the debris trapping chamber, the suction unit exerts a suction through the suction port, and cleaning water is supplied from the cleaning water supply port to the debris trapping chamber and suctioned through the suction port to clean the inside of the debris trapping chamber.