Patents by Inventor Shunichi Haruyama

Shunichi Haruyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230271240
    Abstract: To improve forming performance in a smart mill allowing implementation of required forming by moving a forming tool arranged in a stand of a pipe mill automatically to a predetermined position. Non-drive type breakdown rolls BD exclusive to bending are arranged in multiple stands. Drive roll DR stands exclusive to driving are arranged in stages in front of and behind each DR stand. The drive roll DR is configured to apply thrust to a central portion of a raw material using an upper flat roll and a lower flat roll, and has thrust control means and driving rotation number control means for applying thrust required for passage through the step using the drive rolls DR in multiple stages entirely and controlling the thrust.
    Type: Application
    Filed: July 30, 2021
    Publication date: August 31, 2023
    Applicant: NAKATA MANUFACTURING CO., LTD.
    Inventors: Tomoyasu NAKANO, Masato NISHII, Takeyuki SATO, Jilong YIN, Feizhou WANG, Shunichi HARUYAMA
  • Publication number: 20230145306
    Abstract: In a method for manufacturing a metal pipe from a metal plate using a forming tool, the position of the tool is optimized simply and correctly by incorporating individuality of the raw material plate into setting of the tool position. As a preparatory stage, a forming process is analyzed by simulation for each plate. Based on result of the analysis, correlation between a deformed shape value of a raw pipe and tool position information is acquired. Then, the forming process for each plate is stored as correlation between the deformed shape value of the raw pipe and the tool position information. During pipe manufacturing, a deformed shape value of the raw pipe is measured actually while a plate is passed. On the basis of the actually measured deformed shape value, a forming process for the raw pipe is expected and assumed (by using the correlation). Tool position information necessary for implementing the expected and assumed forming process is retrieved from the stored correlation.
    Type: Application
    Filed: April 8, 2021
    Publication date: May 11, 2023
    Applicant: NAKATA MANUFACTURING CO., LTD.
    Inventors: Tomoyasu NAKANO, Takeyuki SATO, Jilong YIN, Feizhou WANG, Shunichi HARUYAMA
  • Publication number: 20050003224
    Abstract: A method suitable for increasing the hardness, strength, and water resistance of a surface layer such as cedar sheets or cedar plywood is presented. The method does not require a resin component layer such as coating films or resin films provided by the conventional typical coating processes. The method is suitable for modifying surfaces of porous materials such as wooden materials, inorganic materials or ceramic material. Also, the same method can be used for modifying a surface layer portion by impregnating a solution of organic or inorganic matter by using steam and for forming a coating film on the surface.
    Type: Application
    Filed: August 1, 2002
    Publication date: January 6, 2005
    Inventor: Shunichi Haruyama
  • Patent number: 6506321
    Abstract: A silicon based conductive material based on a semiconductor silicon and having an electric resistivity of 10−3(&OHgr;·m) or less at ambient temperature which has been unattainable heretofore, while facilitating production and handling. An electric resistivity of 10−6 (&OHgr;·m) or less, which is common for conductors can be realized by adding relatively large quantities of various kinds of elements to silicon. The conductive material can be provided in a semiconductor silicon substrate in a desired pattern by ion beam implantation and patterning. It can be employed not only in the form of a substrate, a rod or a wire, but also in the form of fine particles dispersed in a resin or glass to be employed in various applications requiring conduction, including a conductive sheet material.
    Type: Grant
    Filed: June 8, 2000
    Date of Patent: January 14, 2003
    Assignee: Sumitomo Special Metals Co., Ltd.
    Inventors: Osamu Yamashita, Nobuhiro Sadatomi, Tsunekazu Saigo, Shunichi Haruyama