Patents by Inventor Shunichi Hosaka
Shunichi Hosaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7692720Abstract: A solid-state imaging device, comprises: a semiconductor substrate having a first surface; a solid-state imaging element in the first surface of the semiconductor substrate, the solid-state imaging element comprising a light-receiving region; a light-transmission member having a second surface and a third surface, the second surface being opposite to the third surface, wherein the light-transmission member and the first surface of the semiconductor substrate define a gap between the second surface of the light-transmission member and an outer surface of the light-receiving region; and an external connection terminal connected to the solid-state imaging element, wherein a distance between the outer surface of the light-receiving region and the third surface of the light-transmission member is 0.5 mm or more.Type: GrantFiled: August 2, 2004Date of Patent: April 6, 2010Assignee: FUJIFILM CorporationInventors: Kazuhiro Nishida, Hiroshi Maeda, Yoshihisa Negishi, Shunichi Hosaka, Masatoshi Yasumatsu, Eiji Watanabe
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Patent number: 7688382Abstract: A solid-state imaging device, comprises: a semiconductor substrate having a first surface; a solid-state imaging element in the first surface of semiconductor substrate, the solid-state imaging element comprising a light-receiving region; a light-transmission member having a second surface and a third surface, the second surface being opposite to the third surface, wherein the light-transmission member and the first surface of the semiconductor substrate define a gap between the second surface of the light-transmission member and an outer surface of the light-receiving region; and an external connection terminal connected to the solid-state imaging element, wherein the light-transmission member comprises low ?-ray glass.Type: GrantFiled: July 22, 2004Date of Patent: March 30, 2010Assignee: FUJIFILM CorporationInventors: Kazuhiro Nishida, Hiroshi Maeda, Yoshihisa Negishi, Shunichi Hosaka, Eiji Watanabe, Masatoshi Yasumatsu
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Patent number: 7659136Abstract: It is an object to provide solid-state imaging device, which can easily be manufactured and has a high reliability, and a method of manufacturing the solid-state imaging device. In the present invention, a manufacturing method comprises the steps of forming a plurality of IT-CCDs on a surface of a semiconductor substrate, bonding a translucent member to the surface of the semiconductor substrate in order to have a gap opposite to each light receiving region of the IT-CCD, and isolating a bonded member obtained at the bonding step for each of the IT-CCDs.Type: GrantFiled: April 17, 2006Date of Patent: February 9, 2010Assignee: Fujifilm CorporationInventors: Hiroshi Maeda, Kazuhiro Nishida, Yoshihisa Negishi, Shunichi Hosaka
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Patent number: 7638823Abstract: It is an object to provide solid-state imaging device, which can easily be manufactured and has a high reliability, and a method of manufacturing the solid-state imaging device. In the present invention, a manufacturing method comprises the steps of forming a plurality of IT-CCDs on a surface of a semiconductor substrate, bonding a translucent member to the surface of the semiconductor substrate in order to have a gap opposite to each light receiving region of the IT-CCD, and isolating a bonded member obtained at the bonding step for each of the IT-CCDs.Type: GrantFiled: April 17, 2006Date of Patent: December 29, 2009Assignee: Fujifilm CorporationInventors: Hiroshi Maeda, Kazuhiro Nishida, Yoshihisa Negishi, Shunichi Hosaka
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Patent number: 7592200Abstract: There are provided a semiconductor substrate 101 on which solid-state imaging devices are formed, and a translucent member 201 provided onto a surface of the semiconductor substrate such that spaces are provided to oppose to light receiving areas of the solid-state imaging devices, wherein external connecting terminals are arranged on an opposing surface of the semiconductor substrate 101 to a solid-state imaging device forming surface, and the external connecting terminals are connected to the solid-state imaging devices via through-holes provided in the semiconductor substrate 101.Type: GrantFiled: June 24, 2005Date of Patent: September 22, 2009Assignee: Fujifilm CorporationInventors: Hiroshi Maeda, Kazuhiro Nishida, Yoshihisa Negishi, Shunichi Hosaka
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Patent number: 7582505Abstract: It is an object to provide solid-state imaging device, which can easily be manufactured and has a high reliability, and a method of manufacturing the solid-state imaging device. In the present invention, a manufacturing method comprises the steps of forming a plurality of IT-CCDs on a surface of a semiconductor substrate, bonding a translucent member to the surface of the semiconductor substrate in order to have a gap opposite to each light receiving region of the IT-CCD, and isolating a bonded member obtained at the bonding step for each of the IT-CCDs.Type: GrantFiled: April 17, 2006Date of Patent: September 1, 2009Assignee: Fujifilm CorporationInventors: Hiroshi Maeda, Kazuhiro Nishida, Yoshihisa Negishi, Shunichi Hosaka
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Patent number: 7411230Abstract: It is an object to provide solid-state imaging device, which can easily be manufactured and has a high reliability, and a method of manufacturing the solid-state imaging device. In the present invention, a manufacturing method comprises the steps of forming a plurality of IT-CCDs on a surface of a semiconductor substrate, bonding a translucent member to the surface of the semiconductor substrate in order to have a gap opposite to each light receiving region of the IT-CCD, and isolating a bonded member obtained at the bonding step for each of the IT-CCDs.Type: GrantFiled: April 17, 2006Date of Patent: August 12, 2008Assignee: Fujifilm CorporationInventors: Hiroshi Maeda, Kazuhiro Nishida, Yoshihisa Negishi, Shunichi Hosaka
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Publication number: 20060284215Abstract: It is an object to provide solid-state imaging device, which can easily be manufactured and has a high reliability, and a method of manufacturing the solid-state imaging device. In the present invention, a manufacturing method comprises the steps of forming a plurality of IT-CCDs on a surface of a semiconductor substrate, bonding a translucent member to the surface of the semiconductor substrate in order to have a gap opposite to each light receiving region of the IT-CCD, and isolating a bonded member obtained at the bonding step for each of the IT-CCDs.Type: ApplicationFiled: April 17, 2006Publication date: December 21, 2006Inventors: Hiroshi Maeda, Kazuhiro Nishida, Yoshihisa Negishi, Shunichi Hosaka
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Publication number: 20060252174Abstract: It is an object to provide solid-state imaging device, which can easily be manufactured and has a high reliability, and a method of manufacturing the solid-state imaging device. In the present invention, a manufacturing method comprises the steps of forming a plurality of IT-CCDs on a surface of a semiconductor substrate, bonding a translucent member to the surface of the semiconductor substrate in order to have a gap opposite to each light receiving region of the IT-CCD, and isolating a bonded member obtained at the bonding step for each of the IT-CCDs.Type: ApplicationFiled: April 17, 2006Publication date: November 9, 2006Inventors: Hiroshi Maeda, Kazuhiro Nishida, Yoshihisa Negishi, Shunichi Hosaka
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Publication number: 20060252175Abstract: It is an object to provide solid-state imaging device, which can easily be manufactured and has a high reliability, and a method of manufacturing the solid-state imaging device. In the present invention, a manufacturing method comprises the steps of forming a plurality of IT-CCDs on a surface of a semiconductor substrate, bonding a translucent member to the surface of the semiconductor substrate in order to have a gap opposite to each light receiving region of the IT-CCD, and isolating a bonded member obtained at the bonding step for each of the IT-CCDs.Type: ApplicationFiled: April 17, 2006Publication date: November 9, 2006Inventors: Hiroshi Maeda, Kazuhiro Nishida, Yoshihisa Negishi, Shunichi Hosaka
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Publication number: 20060186499Abstract: It is an object to provide solid-state imaging device, which can easily be manufactured and has a high reliability, and a method of manufacturing the solid-state imaging device. In the present invention, a manufacturing method comprises the steps of forming a plurality of IT-CCDs on a surface of a semiconductor substrate, bonding a translucent member to the surface of the semiconductor substrate in order to have a gap opposite to each light receiving region of the IT-CCD, and isolating a bonded member obtained at the bonding step for each of the IT-CCDs.Type: ApplicationFiled: April 17, 2006Publication date: August 24, 2006Inventors: Hiroshi Maeda, Kazuhiro Nishida, Yoshihisa Negishi, Shunichi Hosaka
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Patent number: 7074638Abstract: It is an object to provide solid-state imaging device, which can easily be manufactured and has a high reliability, and a method of manufacturing the solid-state imaging device. In the present invention, a manufacturing method comprises the steps of forming a plurality of IT-CCDs on a surface of a semiconductor substrate, bonding a translucent member to the surface of the semiconductor substrate in order to have a gap opposite to each light receiving region of the IT-CCD, and isolating a bonded member obtained at the bonding step for each of the IT-CCDs.Type: GrantFiled: July 14, 2003Date of Patent: July 11, 2006Assignee: Fuji Photo Film Co., Ltd.Inventors: Hiroshi Maeda, Kazuhiro Nishida, Yoshihisa Negishi, Shunichi Hosaka
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Publication number: 20050236621Abstract: There are provided a semiconductor substrate 101 on which solid-state imaging devices are formed, and a translucent member 201 provided onto a surface of the semiconductor substrate such that spaces are provided to oppose to light receiving areas of the solid-state imaging devices, wherein external connecting terminals are arranged on an opposing surface of the semiconductor substrate 101 to a solid-state imaging device forming surface, and the external connecting terminals are connected to the solid-state imaging devices via through-holes provided in the semiconductor substrate 101.Type: ApplicationFiled: June 24, 2005Publication date: October 27, 2005Inventors: Hiroshi Maeda, Kazuhiro Nishida, Yoshihisa Negishi, Shunichi Hosaka
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Patent number: 6930327Abstract: There are provided a semiconductor substrate 101 on which solid-state imaging devices are formed, and a translucent member 201 provided onto a surface of the semiconductor substrate such that spaces are provided to oppose to light receiving areas of the solid-state imaging devices, wherein external connecting terminals are arranged on an opposing surface of the semiconductor substrate 101 to a solid-state imaging device forming surface, and the external connecting terminals are connected to the solid-state imaging devices via through-holes provided in the semiconductor substrate 101.Type: GrantFiled: June 24, 2003Date of Patent: August 16, 2005Assignee: Fuji Photo Film Co., Ltd.Inventors: Hiroshi Maeda, Kazuhiro Nishida, Yoshihisa Negishi, Shunichi Hosaka
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Publication number: 20050061429Abstract: An actinic radiation curable adhesive is provided that includes 50 to 99 wt % of a bifunctional and/or a polyfunctional oxetane compound, 0 to 40 wt % of a monofunctional oxetane compound, 1 to 50 wt % of an epoxy compound having a cyclic structure, and a catalytic amount of a photoinitiator. The adhesive has an initial viscosity of 10 to 1,000 mPa·s and a viscosity at gel point of 1×101 to 9×106 Pa·s. There is also provided a process for bonding an adherend A and a different adherend B, the process including forming an adhesive layer by coating a surface of the adherend A with the above adhesive at a thickness of 0.05 to 50 ?m, irradiating the adhesive layer with actinic radiation, and bonding the adherend B to the adhesive layer after 0.01 to 4 times the time required for gelling of the adhesive layer has passed following the start of irradiation with actinic radiation.Type: ApplicationFiled: September 15, 2004Publication date: March 24, 2005Inventor: Shunichi Hosaka
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Publication number: 20050062871Abstract: A solid-state imaging device, comprises: a semiconductor substrate having a first surface; a solid-state imaging element in the first surface of the semiconductor substrate, the solid-state imaging element comprising a light-receiving region; a light-transmission member having a second surface and a third surface, the second surface being opposite to the third surface, wherein the light-transmission member and the first surface of the semiconductor substrate define a gap between the second surface of the light-transmission member and an outer surface of the light-receiving region; and an external connection terminal connected to the solid-state imaging element, wherein a distance between the outer surface of the light-receiving region and the third surface of the light-transmission member is 0.5 mm or more.Type: ApplicationFiled: August 2, 2004Publication date: March 24, 2005Inventors: Kazuhiro Nishida, Hiroshi Maeda, Yoshihisa Negishi, Shunichi Hosaka, Masatoshi Yasumatsu, Eiji Watanabe
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Publication number: 20050024519Abstract: A solid-state imaging device, comprises: a semiconductor substrate having a first surface; a solid-state imaging element in the first surface of semiconductor substrate, the solid-state imaging element comprising a light-receiving region; a light-transmission member having a second surface and a third surface, the second surface being opposite to the third surface, wherein the light-transmission member and the first surface of the semiconductor substrate define a gap between the second surface of the light-transmission member and an outer surface of the light-receiving region; and an external connection terminal connected to the solid-state imaging element, wherein the light-transmission member comprises low ?-ray glass.Type: ApplicationFiled: July 22, 2004Publication date: February 3, 2005Inventors: Kazuhiro Nishida, Hiroshi Maeda, Yoshihisa Negishi, Shunichi Hosaka, Eiji Watanabe, Masatoshi Yasumatsu
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Publication number: 20040075761Abstract: There are provided a semiconductor substrate 101 on which solid-state imaging devices are formed, and a translucent member 201 provided onto a surface of the semiconductor substrate such that spaces are provided to oppose to light receiving areas of the solid-state imaging devices, wherein external connecting terminals are arranged on an opposing surface of the semiconductor substrate 101 to a solid-state imaging device forming surface, and the external connecting terminals are connected to the solid-state imaging devices via through-holes provided in the semiconductor substrate 101.Type: ApplicationFiled: June 24, 2003Publication date: April 22, 2004Inventors: Hiroshi Maeda, Kazuhiro Nishida, Yoshihisa Negishi, Shunichi Hosaka
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Publication number: 20040077121Abstract: It is an object to provide solid-state imaging device, which can easily be manufactured and has a high reliability, and a method of manufacturing the solid-state imaging device. In the present invention, a manufacturing method comprises the steps of forming a plurality of IT-CCDs on a surface of a semiconductor substrate, bonding a translucent member to the surface of the semiconductor substrate in order to have a gap opposite to each light receiving region of the IT-CCD, and isolating a bonded member obtained at the bonding step for each of the IT-CCDs.Type: ApplicationFiled: July 14, 2003Publication date: April 22, 2004Inventors: Hiroshi Maeda, Kazuhiro Nishida, Yoshihisa Negishi, Shunichi Hosaka
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Patent number: 6196484Abstract: An improvement of a photographic film roll composed of a spool which has a spool core having a slit therein and a flange at both ends of the spool core and a photographic 120-size film which is placed and fixed on a continuous light-shielding backing paper in which one end of the backing paper is inserted into the slit of the spool and other portion of the backing paper is wound on the spool to form multiple convolutions, resides in that the backing paper has at the center in its longitudinal direction a width less than the distance between the two flanges measured at the position of ½ of height of the flanges and has two wide areas of at least 10 cm long one of which is within 50 cm area measured from its one end and another of which is within 50 cm area measured from its another end, the width of each wide area being larger than the distance between the two flanges measured at the tops of the flanges.Type: GrantFiled: October 21, 1999Date of Patent: March 6, 2001Assignee: Fuji Photo Film Co., Ltd.Inventors: Shunichi Hosaka, Masayoshi Nagata, Yukiyoshi Ishii