Patents by Inventor Shunichi Igarashi

Shunichi Igarashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7700400
    Abstract: The present invention can finely arrange p+-type diffusion layers and n+-type diffusion layers. A p+-type diffusion layer 2 and an n+-type diffusion layer 3 are simultaneously formed on a back surface 1a of a semiconductor substrate 1 in a state that the p+-type diffusion layer 2 and the n+-type diffusion layer 3 are arranged close to each other, and a back surface 1a side of the semiconductor substrate 1 on which outer end portions of the p+-type diffusion layers 2 and the n+-type diffusion layers 3 are brought into contact with each other is removed thus separating the p+-type diffusion layer 2 and the n+-type diffusion layer 3 from each other and hence, the p+-type diffusion layer 2 and the n+-type diffusion layer 3 can be separately arranged in a state that the p+-type diffusion layer 2 and the n+-type diffusion layer 3 are arranged close to each other.
    Type: Grant
    Filed: October 21, 2005
    Date of Patent: April 20, 2010
    Assignees: Naoetsu Electronics Co., Ltd., Shin-Etsu Chemical Co., Ltd.
    Inventors: Tsutomu Onishi, Takeshi Akatsuka, Shunichi Igarashi
  • Publication number: 20070264746
    Abstract: The present invention can finely arrange p+-type diffusion layers and n+-type diffusion layers. A p+-type diffusion layer 2 and an n+-type diffusion layer 3 are simultaneously formed on a back surface 1a of a semiconductor substrate 1 in a state that the p+-type diffusion layer 2 and the n+-type diffusion layer 3 are arranged close to each other, and a back surface la side of the semiconductor substrate 1 on which outer end portions of the p+-type diffusion layers 2 and the n+-type diffusion layers 3 are brought into contact with each other is removed thus separating the p+-type diffusion layer 2 and the n+-type diffusion layer 3 from each other and hence, the p+-type diffusion layer 2 and the n+-type diffusion layer 3 can be separately arranged in a state that the p+-type diffusion layer 2 and the n+-type diffusion layer 3 are arranged close to each other.
    Type: Application
    Filed: October 21, 2005
    Publication date: November 15, 2007
    Applicants: NAOETSU ELECTRONICS CO., LTD., SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Tsutomu Onishi, Takeshi Akatsuka, Shunichi Igarashi
  • Publication number: 20050284032
    Abstract: A high-ductility material or a high-ductility covering material is disposed on the outer circumferential surface of a member, such as a column, of a structure so as to confine expansion of apparent volume accompanying rupture of the member, to thereby control rupture of the member. The high-ductility material is a fibrous or rubber sheet material. The high-ductility material is disposed in such a manner as to surround the member. Alternatively, the high-ductility material is spirally wound or rolled on the member.
    Type: Application
    Filed: August 22, 2005
    Publication date: December 29, 2005
    Inventor: Shunichi Igarashi
  • Patent number: 6964141
    Abstract: A high-ductility material or a high-ductility covering material is disposed on the outer circumferential surface of a member, such as a column, of a structure so as to confine expansion of apparent volume accompanying rupture of the member, to thereby control rupture of the member. The high-ductility material is a fibrous or rubber sheet material. The high-ductility material is disposed in such a manner as to surround the member. Alternatively, the high-ductility material is spirally wound or rolled on the member.
    Type: Grant
    Filed: December 26, 2000
    Date of Patent: November 15, 2005
    Assignee: Structural Quality Assurance Inc.
    Inventor: Shunichi Igarashi
  • Publication number: 20050076596
    Abstract: Disclosed is a reinforcing member, which comprises a woven body formed by a weaving process, or a tape-shaped or sheet-shaped body, having a high ductility and high bendability. The reinforcing member is adapted to be installed on a surface of a structure member or a boundary portion of the structure member, or inside a structure member, to reinforce the structure member. The woven body, or a tape-shaped or sheet-shaped body, has a Young's modulus equal to or less than that of the structure member, and a tensile fracture strain of 10% or more. The Young's modulus of the reinforcing member is preferably in the range of 1/2 to 1/20, more preferably 1/5 to 1/10, of that of the structure member. Specifically, the Young's modulus of the woven body is preferably in the range of 500 to 50000 MPa, more preferably 1000 to 10000 MPa. The present invention also provides a reinforced structure using the above reinforcing member.
    Type: Application
    Filed: September 25, 2002
    Publication date: April 14, 2005
    Applicant: STRUCTURAL QUALITY ASSURANCE, INC.
    Inventor: Shunichi Igarashi
  • Publication number: 20030089063
    Abstract: A high-ductility material or a high-ductility covering material is disposed on the outer circumferential surface of a member, such as a column, of a structure so as to confine expansion of apparent volume accompanying rupture of the member, to thereby control rupture of the member. The high-ductility material is a fibrous or rubber sheet material. The high-ductility material is disposed in such a manner as to surround the member. Alternatively, the high-ductility material is spirally wound or rolled on the member.
    Type: Application
    Filed: March 26, 2002
    Publication date: May 15, 2003
    Inventor: Shunichi Igarashi