Patents by Inventor Shunichi Iwanaga

Shunichi Iwanaga has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package featuring thin semiconductor substrate and liquid crystal polymer sheet, and method for manufacturing such semiconductor package
    Publication number: 20070194457
    Abstract: In a semiconductor package, a wiring board includes an insulating substrate, and a plurality of first electrode terminals formed on a surface thereof. A semiconductor chip includes a semiconductor substrate, and a plurality of second electrode terminals formed on a surface thereof, and is mounted on the wiring board so that the first electrode terminals are bonded to the second electrode terminals, respectively. A sealing layer is formed between the wiring board and the semiconductor chip so that the first electrode terminals and the second electrode terminals are sealed by the sealing layer, and so that the wiring board and the semiconductor chip are adhered to each other. The sealing s layer is derived from a liquid crystal polymer sheet intervened between the wiring board and the semiconductor chip.
    Type: Application
    Filed: February 22, 2007
    Publication date: August 23, 2007
    Applicant: NEC ELECTRONICS COROPORATION
    Inventors: Gorou Ikegami, Shunichi Iwanaga