Patents by Inventor Shunichi Kamata

Shunichi Kamata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200243468
    Abstract: An electronic device includes a circuit board, an electronic element, multiple connection bumps, a preventive bump, and a sidefill. The electronic element is mounted on the circuit board. The connection bumps are connected to the electronic element. The preventive bump is provided between the connection bumps. The sidefill surrounds the electronic element.
    Type: Application
    Filed: January 23, 2020
    Publication date: July 30, 2020
    Inventors: Shunichi Kamata, Tatsuhiro Mori, Takashi Sugata, Takeshi Okuyama