Patents by Inventor Shunichi KAWAKAMI

Shunichi KAWAKAMI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor manufacturing apparatus and method of manufacturing semiconductor device
    Patent number: 11901201
    Abstract: A semiconductor manufacturing apparatus includes: a sheet separation jig having contact with a rear surface of a sheet which is a surface of the sheet on a side opposite to a front surface of the sheet, wherein the sheet separation jig includes therein a plurality of support blocks each having a first suction hole formed for sucking the rear surface of the sheet and a single driving plate connected to the plurality of support blocks so that the plurality of support blocks can move in a first direction as a direction away from the sheet with a time difference, and the plurality of support blocks are disposed in the sheet separation jig along a second direction, as a direction of a separation of the semiconductor device from the sheet, intersecting the first direction.
    Type: Grant
    Filed: August 15, 2022
    Date of Patent: February 13, 2024
    Assignee: Mitsubishi Electric Corporation
    Inventors: Shunichi Kawakami, Takaya Noguchi
  • SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
    Publication number: 20230131572
    Abstract: A semiconductor manufacturing apparatus includes: a sheet separation jig having contact with a rear surface of a sheet which is a surface of the sheet on a side opposite to a front surface of the sheet, wherein the sheet separation jig includes therein a plurality of support blocks each having a first suction hole formed for sucking the rear surface of the sheet and a single driving plate connected to the plurality of support blocks so that the plurality of support blocks can move in a first direction as a direction away from the sheet with a time difference, and the plurality of support blocks are disposed in the sheet separation jig along a second direction, as a direction of a separation of the semiconductor device from the sheet, intersecting the first direction.
    Type: Application
    Filed: August 15, 2022
    Publication date: April 27, 2023
    Applicant: Mitsubishi Electric Corporation
    Inventors: Shunichi KAWAKAMI, Takaya NOGUCHI