Patents by Inventor Shunichi Kikuchi
Shunichi Kikuchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10443957Abstract: A cooling plate that includes: a plate that is attached to a heat generating element; feed flow paths and return flow paths for coolant that are alternatingly arranged along a plate face of the plate; and a plurality of coolant flow paths that are formed in a plurality of levels within the plate closer to the heat generating element than the feed flow paths and the return flow paths, the plurality of coolant flow paths placing adjacent paths of the feed flow paths and the return flow paths in parallel communication through each of the levels.Type: GrantFiled: August 23, 2018Date of Patent: October 15, 2019Assignee: FUJITSU LIMITEDInventors: Shunichi Kikuchi, Yoshihisa Iwakiri, Naoaki Nakamura, Takayoshi Matsumura
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Publication number: 20190093964Abstract: A cooling plate that includes: a plate that is attached to a heat generating element; feed flow paths and return flow paths for coolant that are alternatingly arranged along a plate face of the plate; and a plurality of coolant flow paths that are formed in a plurality of levels within the plate closer to the heat generating element than the feed flow paths and the return flow paths, the plurality of coolant flow paths placing adjacent paths of the feed flow paths and the return flow paths in parallel communication through each of the levels.Type: ApplicationFiled: August 23, 2018Publication date: March 28, 2019Applicant: FUJITSU LIMITEDInventors: Shunichi KIKUCHI, Yoshihisa IWAKIRI, Naoaki NAKAMURA, Takayoshi MATSUMURA
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Patent number: 10108235Abstract: An information processing apparatus is disclosed. The information processing apparatus includes a first heat emitting device and a heat exchanger. The heat exchanger includes a first layered structure of layers of a plurality of first flow channel members having one or more first flow channels formed therein for a first coolant that is liquid, a first header in fluid communication with the first flow channel members, a second layered structure of layers of a plurality of second flow channel members having one or more second flow channels formed therein for a second coolant that is liquid, and a second header in fluid communication with the second flow channel members. The first and the second layered structures are overlapped in a first region when viewed in a layered direction, and at least one of the first and the second layered structures has space between layers in a second region.Type: GrantFiled: October 2, 2017Date of Patent: October 23, 2018Assignee: FUJITSU LIMITEDInventors: Shunichi Kikuchi, Michimasa Aoki, Masumi Suzuki, Mitsutaka Yamada
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Publication number: 20180113494Abstract: An information processing apparatus is disclosed. The information processing apparatus includes a first heat emitting device and a heat exchanger. The heat exchanger includes a first layered structure of layers of a plurality of first flow channel members having one or more first flow channels formed therein for a first coolant that is liquid, a first header in fluid communication with the first flow channel members, a second layered structure of layers of a plurality of second flow channel members having one or more second flow channels formed therein for a second coolant that is liquid, and a second header in fluid communication with the second flow channel members. The first and the second layered structures are overlapped in a first region when viewed in a layered direction, and at least one of the first and the second layered structures has space between layers in a second region.Type: ApplicationFiled: October 2, 2017Publication date: April 26, 2018Applicant: FUJITSU LIMITEDInventors: Shunichi Kikuchi, Michimasa AOKI, Masumi SUZUKI, Mitsutaka YAMADA
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Patent number: 9642287Abstract: A channel distribution type cooling plate where a space between a first coolant storage part for inflow of coolant and a second cooling storage part for outflow of coolant formed at the two ends of an upper space of a main body provided with a lower space for removing heat of a heat generating member is partitioned by a meandering type partition wall to form coolant distribution paths connected to the first coolant storage part and coolant collection paths connected to the second coolant storage part, the bottom of the coolant distribution paths and the coolant collection paths are communicated by a plurality of through holes with the lower space, and side surfaces of the partition wall at the coolant distribution path sides are formed with subchannels for running coolant from the first coolant storage part, in order to improve the cooling efficiency at the coolant outlet side.Type: GrantFiled: May 17, 2016Date of Patent: May 2, 2017Assignee: FUJITSU LIMITEDInventors: Shunichi Kikuchi, Yoshihisa Iwakiri, Naoaki Nakamura, Hiroshi Onuki
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Publication number: 20170084581Abstract: A laminated chip includes: semiconductor chips that are laminated; and multiple types of adhesive insulating resin films that include mutually different characteristics and that are filled between the semiconductor chips, wherein the multiple types of the adhesive insulating resin films are arranged in a chip plane direction, depending on a demand characteristic for each region in a chip plane.Type: ApplicationFiled: August 31, 2016Publication date: March 23, 2017Applicant: FUJITSU LIMITEDInventors: Shunichi Kikuchi, Hiroshi Onuki, Naoaki Nakamura, Yoshihisa IWAKIRI
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Publication number: 20160366793Abstract: A channel distribution type cooling plate where a space between a first coolant storage part for inflow of coolant and a second cooling storage part for outflow of coolant formed at the two ends of an upper space of a main body provided with a lower space for removing heat of a heat generating member is partitioned by a meandering type partition wall to form coolant distribution paths connected to the first coolant storage part and coolant collection paths connected to the second coolant storage part, the bottom of the coolant distribution paths and the coolant collection paths are communicated by a plurality of through holes with the lower space, and side surfaces of the partition wall at the coolant distribution path sides are formed with subchannels for running coolant from the first coolant storage part, in order to improve the cooling efficiency at the coolant outlet side.Type: ApplicationFiled: May 17, 2016Publication date: December 15, 2016Applicant: FUJITSU LIMITEDInventors: Shunichi Kikuchi, Yoshihisa IWAKIRI, Naoaki Nakamura, Hiroshi Onuki
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Publication number: 20110286188Abstract: A multilayer printed circuit board includes an interior interconnect layer, and a semiconductor package including a flexible interconnect structure whose distal end is a free end, wherein the flexible interconnect structure and the interior interconnect layer are electrically connected to each other.Type: ApplicationFiled: March 15, 2011Publication date: November 24, 2011Applicant: FUJITSU LIMITEDInventors: Ryo KANAI, Shunichi KIKUCHI, Naoki NAKAMURA, Shigeru SUGINO, Kiyoyuki HATANAKA, Nobuo TAKETOMI
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Publication number: 20110132654Abstract: A method for manufacturing a multilayer printed circuit board, and a printed circuit board manufactured according to the method, includes laterally-aligning a first inner substrate in which first insulation layers and first conductor layers are alternately laminated and a second inner substrate in which second insulation layers and second conductor layers are alternately laminated. The second inner substrate has a lager number of layers than the first inner substrate. The laterally-aligned first inner substrate and second inner substrate are placed between a pair of third insulation layers in a thickness direction. The pair of the third insulation layer are heated under pressure in the thickness direction. A conductor pattern is formed on surfaces of the pair of the third insulation layers.Type: ApplicationFiled: December 3, 2010Publication date: June 9, 2011Applicant: FUJITSU LIMITEDInventors: Nobuo TAKETOMI, Shunichi KIKUCHI, Naoki NAKAMURA, Kiyoyuki HATANAKA, Shigeru SUGINO, Ryo KANAI
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Patent number: 7951249Abstract: The present invention provides an RFID tag excellent in the diffusion of heat. The RFID tag includes a base, an antenna pattern that is provided on the base and forms a communication antenna, a circuit chip that is electrically connected to the antenna pattern and performs radio communication via the antenna, a cover that is provided in close contact with the base in such a manner as to cover the antenna pattern except a prescribed region including the circuit chip, and an insulating thermal diffusion material that covers the prescribed region and is in thermal contact with the circuit chip. The insulating thermal diffusion material has thermal conductivity higher than the thermal conductivity of the cover.Type: GrantFiled: February 9, 2007Date of Patent: May 31, 2011Assignee: Fujitsu LimitedInventors: Shunichi Kikuchi, Masumi Suzuki, Michimasa Aoki
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Patent number: 7431218Abstract: An RFID tag including a first part which has a first base and a communication antenna formed on the first base by use of a paste of resin material mixed with metallic filler; and a second part disposed on the first part, which has a second base, a metallic patch disposed on the second base and electrically connected to the antenna on the first part, and a circuit chip connected onto the metallic patch via a bump, the circuit chip performing radio communication via the antenna.Type: GrantFiled: July 25, 2005Date of Patent: October 7, 2008Assignee: Fujitsu LimitedInventors: Naoki Ishikawa, Shunji Baba, Hidehiko Kira, Hiroshi Kobayashi, Shunichi Kikuchi
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Publication number: 20070139206Abstract: The present invention provides an RFID tag excellent in the diffusion of heat. The RFID tag includes a base, an antenna pattern that is provided on the base and forms a communication antenna, a circuit chip that is electrically connected to the antenna pattern and performs radio communication via the antenna, a cover that is provided in close contact with the base in such a manner as to cover the antenna pattern except a prescribed region including the circuit chip, and an insulating thermal diffusion material that covers the prescribed region and is in thermal contact with the circuit chip. The insulating thermal diffusion material has thermal conductivity higher than the thermal conductivity of the cover.Type: ApplicationFiled: February 9, 2007Publication date: June 21, 2007Inventors: Shunichi Kikuchi, Masumi Suzuki, Michimasa Aoki
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Patent number: 7214563Abstract: An IC chip mounting method which mounts two or more IC chips on a base, includes: preparing a wafer by mounting a tape on a face thereof, which is the reverse of the wafer having a mounting surface to be attached to the base, and by dividing the wafer into IC chips by dicing while leaving the tape; positioning the wafer to face the base in such a direction that the mounting surface to be attached to the base faces the base; sequentially pressing the IC chips on the wafer against the base and temporarily fixing the IC chips while the base is being fed in a prescribed one-dimensional direction along the wafer and while the wafer is being moved two-dimensionally along the base; and fixing the IC chips temporarily fixed on the base on the base by heating and pressurizing in a batch manner.Type: GrantFiled: December 29, 2005Date of Patent: May 8, 2007Assignees: Fujitsu Limited, Fujitsu Frontech LimitedInventors: Naoki Ishikawa, Shunji Baba, Hidehiko Kira, Hiroshi Kobayashi, Shunichi Kikuchi, Tatsuro Tsuneno
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Patent number: 7199718Abstract: The present invention provides an RFID tag excellent in the diffusion of heat. The RFID tag includes a base, an antenna pattern that is provided on the base and forms a communication antenna, a circuit chip that is electrically connected to the antenna pattern and performs radio communication via the antenna, a cover that is provided in close contact with the base in such a manner as to cover the antenna pattern except a prescribed region including the circuit chip, and an insulating thermal diffusion material that covers the prescribed region and is in thermal contact with the circuit chip. The insulating thermal diffusion material has thermal conductivity higher than the thermal conductivity of the cover.Type: GrantFiled: March 22, 2005Date of Patent: April 3, 2007Assignee: Fujitsu LimitedInventors: Shunichi Kikuchi, Masumi Suzuki, Michimasa Aoki
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Publication number: 20070020800Abstract: An IC chip mounting method which mounts two or more IC chips on a base, includes: preparing a wafer by mounting a tape on a face thereof, which is the reverse of the wafer having a mounting surface to be attached to the base, and by dividing the wafer into IC chips by dicing while leaving the tape; positioning the wafer to face the base in such a direction that the mounting surface to be attached to the base faces the base; sequentially pressing the IC chips on the wafer against the base and temporarily fixing the IC chips while the base is being fed in a prescribed one-dimensional direction along the wafer and while the wafer is being moved two-dimensionally along the base; and fixing the IC chips temporarily fixed on the base on the base by heating and pressurizing in a batch manner.Type: ApplicationFiled: December 29, 2005Publication date: January 25, 2007Applicants: FUJITSU LIMITED, FUJITSU FRONTECH LIMITEDInventors: Naoki Ishikawa, Shunji Baba, Hidehiko Kira, Hiroshi Kobayashi, Shunichi Kikuchi, Tatsuro Tsuneno
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Publication number: 20060208094Abstract: An RFID tag is provided which comprises: a first part which has a first base and a communication antenna formed on the first base by use of a paste of resin material mixed with metallic filler; and a second part disposed on the first part, which has a second base, a metallic patch disposed on the second base and electrically connected to the antenna on the first part, and a circuit chip connected onto the metallic patch via a bump, the circuit chip performing radio communication via the antenna.Type: ApplicationFiled: July 25, 2005Publication date: September 21, 2006Inventors: Naoki Ishikawa, Shunji Baba, Hidehiko Kira, Hiroshi Kobayashi, Shunichi Kikuchi
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Publication number: 20060161787Abstract: An article that is worn or carried by a living being includes an authentication key for identifying the living being or acquiring information about the living being. The authentication key is formed on a surface of the article by processing the article. An authenticating apparatus performs authentication whether an authority to make access to information is present, and includes an authentication key information reading unit and authenticating unit. The authentication key information reading unit reads authentication key information stored in the authentication key. The authenticating unit performs the authentication to check whether an authority to make access to the information about the living being is present based on the read authentication key information.Type: ApplicationFiled: April 29, 2005Publication date: July 20, 2006Applicant: FUJITSU LIMITEDInventor: Shunichi Kikuchi
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Publication number: 20060145867Abstract: The present invention provides an RFID tag excellent in the diffusion of heat. The RFID tag includes a base, an antenna pattern that is provided on the base and forms a communication antenna, a circuit chip that is electrically connected to the antenna pattern and performs radio communication via the antenna, a cover that is provided in close contact with the base in such a manner as to cover the antenna pattern except a prescribed region including the circuit chip, and an insulating thermal diffusion material that covers the prescribed region and is in thermal contact with the circuit chip. The insulating thermal diffusion material has thermal conductivity higher than the thermal conductivity of the cover.Type: ApplicationFiled: March 22, 2005Publication date: July 6, 2006Applicant: FUJITSU LIMITEDInventors: Shunichi Kikuchi, Masumi Suzuki, Michimasa Aoki
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Patent number: 6891247Abstract: A semiconductor device includes a semiconductor bare chip and an electrically-insulative board member with a thin-film structure capacitor. The semiconductor bare chip has a power supply terminal and a grounding terminal on the back surface thereof. The semiconductor bare chip is mounted on a circuit board by flip-chip bonding. The board member includes a board and a thin-film structure capacitor provided on the board. The capacitor has terminals corresponding to the power supply terminal and the grounding terminal of the semiconductor bare chip thereon. The side of the board member where the capacitor is provided is bonded to the back surface of the semiconductor bare chip. The terminals of the capacitor are electrically connected to the power supply terminal and the grounding terminal of the semiconductor bare chip.Type: GrantFiled: June 24, 2002Date of Patent: May 10, 2005Assignee: Fujitsu LimitedInventors: Shunichi Kikuchi, Misao Umematsu
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Patent number: 6787711Abstract: A printed wiring board device includes circuit parts which are mounted on a wiring board and constitute parts of a circuit in the printed wiring board device. Pads are provided on the wiring board in the circumference of the circuit parts, and the pads being electrically isolated from the circuit. Heat-absorbing dummy parts are mounted on the pads, and the dummy parts absorb heat from the circuit parts through the pads during reflow soldering.Type: GrantFiled: July 16, 2002Date of Patent: September 7, 2004Assignee: Fujitsu LimitedInventors: Shunichi Kikuchi, Mitsutaka Yamada, Kenji Iketaki