Patents by Inventor Shunichi Ogasawara

Shunichi Ogasawara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer rotary holding apparatus and wafer surface treatment apparatus with waste liquid recovery mechanism
    Patent number: 6810888
    Abstract: Provided is a wafer rotary holding apparatus by which a reduced pressure is created on an upper surface of a rotary disk by a simple and easy-to-make mechanism with no need of any of a vacuum source apparatus, a compressed air supply apparatus, a compressed gas supply apparatus and other apparatuses in use; a wafer can be held while rotating with no contact to a rear surface thereof; a degree of pressure reduction can be adjusted with ease and even a thin wafer (of 0.1 mm or less in thickness) can be held while rotating with no deformation; and the wafer with a bowing can be held while rotating with no correction of the bowing. A wafer rotary holding apparatus includes: a rotary disk on which a fluid flow path is formed; a through hole formed in a central section of the rotary disk; and a plurality of wafer rests provided on an upper surface of the rotary disk.
    Type: Grant
    Filed: November 5, 2003
    Date of Patent: November 2, 2004
    Assignee: Mimasu Semiconductor Industry Co., Ltd.
    Inventors: Masato Tsuchiya, Shunichi Ogasawara, Hideyuki Murooka
  • Wafer rotary holding apparatus and wafer surface treatment apparatus with waste liquid recovery mechanism
    Publication number: 20040103931
    Abstract: Provided is a wafer rotary holding apparatus by which a reduced pressure is created on an upper surface of a rotary disk by a simple and easy-to-make mechanism with no need of any of a vacuum source apparatus, a compressed air supply apparatus, a compressed gas supply apparatus and other apparatuses in use; a wafer can be held while rotating with no contact to a rear surface thereof; a degree of pressure reduction can be adjusted with ease and even a thin wafer (of 0.1 mm or less in thickness) can be held while rotating with no deformation; and the wafer with a bowing can be held while rotating with no correction of the bowing. A wafer rotary holding apparatus includes: a rotary disk on which a fluid flow path is formed; a through hole formed in a central section of the rotary disk; and a plurality of wafer rests provided on an upper surface of the rotary disk.
    Type: Application
    Filed: November 5, 2003
    Publication date: June 3, 2004
    Applicant: Mimasu Semiconductor Industry Co., Ltd.
    Inventors: Masato Tsuchiya, Shunichi Ogasawara, Hideyuki Murooka
  • Wafer rotary holding apparatus and wafer surface treatment apparatus with waste liquid recovery mechanism
    Patent number: 6672318
    Abstract: Provided is a wafer rotary holding apparatus by which a reduced pressure is created on an upper surface of a rotary disk by a simple and easy-to-make mechanism with no need of any of a vacuum source apparatus, a compressed air supply apparatus, a compressed gas supply apparatus and other apparatuses in use; a wafer can be held while rotating with no contact to a rear surface thereof; a degree of pressure reduction can be adjusted with ease and even a thin wafer (of 0.1 mm or less in thickness) can be held while rotating with no deformation; and the wafer with a bowing can be held while rotating with no correction of the bowing. A wafer rotary holding apparatus includes: a rotary disk on which a fluid flow path is formed; a through hole formed in a central section of the rotary disk; and a plurality of wafer rests provided on an upper surface of the rotary disk.
    Type: Grant
    Filed: August 29, 2000
    Date of Patent: January 6, 2004
    Assignee: Mimasu Semiconductor Industry Co., Ltd.
    Inventors: Masato Tsuchiya, Shunichi Ogasawara, Hideyuki Murooka