Abstract: A semiconductor device card includes an electric circuit board, at least one panel having self-locking pawls formed at several places along the edge thereof, and a frame having engagement surfaces for engaging the pawls.

Abstract: Two types of semiconductor packages (6a, 6b), being different in direction of bending of external lead terminals (3) from each other, are prepared to be mounted on a single surface or both surfaces of a package substrate. In case of single-surface mounting, the external lead terminals (3) of the same pin numbers can be electrically connected with each other by drawing around wires (9). In case of double-surface mounting, the external lead terminals (3) of the same pin numbers can be electrically connected with each other by through holes.

Abstract: A packaged semiconductor device includes a resin package having a rectangular shape, a semiconductor device contained in the resin package and having a plurality of terminals oriented along the shorter sides of the resin package, a plurality of leads located in the vicinity of the terminals of the semiconductor device and extending outwardly from the shorter sides of the resin package generally parallel to the longer sides, and a plurality of lead wires respectively connecting each of the plurality of terminals of the semiconductor device to one of the plurality of leads.