Abstract: Disclosed is a wafer edge polishing system which improves the throughput and reduces the average processing cost. The system incorporates a wafer inspection unit. A wafer is polished in a wafer edge polishing unit and carried by a carrier unit to the wafer inspection unit where the polished surfaces of the wafer is inspected, and if it is judged as poorly polished, it is re-carried to the wafer edge polishing unit by the carrier unit.

Abstract: When a device wafer is chucked and is rotated about an axis thereof, arc-shaped work faces of first and second inclined-face-polishing members are brought into line-contact with inclined faces disposed at front and rear faces, respectively, of the device wafer, the arc-shaped work face of a peripheral-face-polishing member is brought into line-contact with a peripheral face of the device wafer, and a disc-shaped work face of a peripheral-edge-polishing member is brought into planar contact with the front face of the device wafer at a peripheral edge thereof, whereby the inclined faces, the peripheral face, and the peripheral edge are polished simultaneously by the respective polishing members. Thus, an unnecessary part of a metallic film is removed from the periphery of the device wafer.

Abstract: Disclosed is a wafer edge polishing system which improves the throughput and reduces the average processing cost. The system incorporates a wafer inspection unit. A wafer is polished in a wafer edge polishing unit and carried by a carrier unit to the wafer inspection unit where the polished surfaces of the wafer is inspected, and if it is judged as poorly polished, it is re-carried to the wafer edge polishing unit by the carrier unit.

Abstract: A pair of edge polishing members (13a, 13b) each having a recess arcked working surface (22) are located on both sides of a diameter direction of a circular plate-shaped work (1) which is held by a chuck means (12) and is rotatable therewith, with the axes of the respective polishing members being inclined with respect to the axis (L) of the work (1), in a manner such that the working surface (22) of one edge polishing member (13a) gets in contact with the edge portion (2a) on the front side of the work (1), while the working surface (22) of the other edge polishing member (13b) gets in contact with the edge portion (2b) on the back side of the work (1), thereby polishing the two edge portions (2a, 2b).

Abstract: When a device wafer is chucked and is rotated about an axis thereof, arc-shaped work faces of first and second inclined-face-polishing members are brought into line-contact with inclined faces disposed at front and rear faces, respectively, of the device wafer, the arc-shaped work face of a peripheral-face-polishing member is brought into line-contact with a peripheral face of the device wafer, and a disc-shaped work face of a peripheral-edge-polishing member is brought into planar contact with the front face of the device wafer at a peripheral edge thereof, whereby the inclined faces, the peripheral face, and the peripheral edge are polished simultaneously by the respective polishing members. Thus, an unnecessary part of a metallic film is removed from the periphery of the device wafer.

Abstract: A pair of edge polishing members (13a, 13b) each having a recess arcked working surface (22) are located on both sides of a diameter direction of a circular plate-shaped work (1) which is held by a chuck means (12) and is rotatable therewith, with the axes of the respective polishing members being inclined with respect to the axis (L) of the work (1), in a manner such that the working surface (22) of one edge polishing member (13a) gets in contact with the edge portion (2a) on the front side of the work (1), while the working surface (22) of the other edge polishing member (13b) gets in contact with the edge portion (2b) on the back side of the work (1), thereby polishing the two edge portions (2a, 2b).

Abstract: An edge face of a deposited film at an edge portion of a device wafer having the deposited film formed on a substrate is polished at a substantially right angle so as to prevent the deposited film from peeling-off and dusting. A forming body having a sectional shape substantially agreeing with that of an edge portion of a device wafer after polishing, which is an object to be polished, is rotated and brought into contact with a polishing body so as to form a polishing portion on the polishing body surface. The edge portion of the object-to be polished is rotated and urged into contact with the formed polishing portion, so that the edge portion of the object to be polished is polished in a sectional shape agreeing with that of the polishing portion of the polishing body. The edge face of the deposited film on the substrate surface is polished not slantingly but at a right angel so as to be removed, so that peeling-off of the deposited film due to a post-process, etc.

Abstract: A single-side polishing method, and an apparatus therefor, for the upper surface and the end face of a substrate edge with a polishing strip are provided. The apparatus comprises a substrate holding member rotatably holding the substrate and a supporting a member capable of coming into contact with and retreating from the substrate holding member; a moving section pressed by a force imparting member against a single side and an end face of the substrate edge via the polishing strip is arranged so that the polishing strip polishes the side and the end face of the substrate edge upon rotation of the substrate.

Abstract: An edge face of a deposited film at an edge portion of a device wafer having the deposited film formed on a substrate is polished at a substantially right angle so as to prevent the deposited film from peeling-off and dusting. A forming body having a sectional shape substantially agreeing with that of an edge portion of a device wafer after polishing, which is an object to be polished, is rotated and brought into contact with a polishing body so as to form a polishing portion on the polishing body surface. The edge portion of the object to be polished is rotated and urged into contact with the formed polishing portion, so that the edge portion of the object to be polished is polished in a sectional shape agreeing with that of the polishing portion of the polishing body. The edge face of the deposited film on the substrate surface is polished not slantingly but at a right angel so as to be removed, so that peeling-off of the deposited film due to a post-process, etc.

Abstract: The present invention provides a polishing compound which does not make stain grow on the surface of work-piece comprising, the dispersion containing 1-30 wt. % of metal oxide particles having 8-500 nm average diameter, acid or alkali and salt, and whose pH is 7-12. Desirably said polishing compound is the compound in which water soluble organic solvent is contained. Further, present invention provides edge polishing method and surface polishing method by use of said polishing compound.

Abstract: A polishing apparatus comprises a rotating table intermittently rotating through 120°0 increments; three polishing drums and three work-holding means 12 provided on the rotating table; a handling means for unloading a processed work from the work-holding means at a handling position and supplying an unprocessed work to the work-holding means at the same position; and a work-inverting means for inverting a work, the front-plane-side edge of which has been polished, at a front-plane edge polishing position.

Abstract: To provide a small polishing means featuring high machining efficiency that is capable of efficiently and quickly mirror-polishing an outer periphery of a chamfered workpiece (5) by bringing the outer periphery into even contact with a plurality of polishing drums (2, 2) at the same time. In an apparatus for polishing an outer periphery by bringing an outer periphery of the workpiece (5) retained by workpiece retaining means (3a, 3b) into contact with two polishing drums (2, 2) simultaneously to perform mirror polishing, the workpiece retaining means (3a, 3b) are supported by a sliding mechanism (16) such that they may move in a direction in which the two polishing drums (2, 2) are arranged, thereby to form an aligning means. In addition, the workpiece retaining means (3a, 3b) are provided with loading means (30) for absorbing a force applied to the workpiece retaining means in an X direction, the force being generated due to contact between the rotating workpiece (5) and the polishing drums (2, 2).

Abstract: A carrier comprising a disk-shaped body portion having fluid circulation holes, a ring-shaped diaphragm portion expanding outward from the outer peripheral surface of the body portion and having pliability, a ring-shaped edge portion projecting at least downward from an outer edge portion of the diaphragm portion and having an inner diameter of at least an outer diameter of a work piece, a pliable sheet having an outer peripheral portion affixed air tightly to a bottom end portion of said edge portion, the back surface of the sheet defining a single pressure chamber communicating with the fluid circulation holes, and a ring-shaped member surrounding the work piece affixed to the bottom surface of the sheet.

Abstract: A workpiece can be simply taken out from a surface plate by a small force without being damaged even though the workpiece is stuck to the workpiece through the surface tension of polishing liquid intervening between the workpiece and the surface plate. By using a takeout device comprising a chucking means for chucking the workpiece and a posture control mechanism for changing the posture of the chuck means, the workpiece horizontally set on the surface plate is chucked by the chuck means in its horizontal posture, and then the chuck means 15 is inclined by the posture control mechanism so as to lift up one end part of the workpiece W in order to separate the workpiece from the surface plate. Thereafter the workpiece can be lifted up in its entirety so as to be taken out from the surface plate.

Abstract: Two cylindrical polishing drums 2 and 2, each having a polishing work surface 2a on their outer circumference, are disposed at an interval smaller than the diameter of a workpiece 7. The polishing drums 2 and 2 are rotated at a required speed, and a chamfered edge 7a of the outer circumference of the workpiece held by a workpiece holding means 3a is pressed against both polishing drums at the same time to mirror-polish the edge 7a at two different points.

Abstract: There are provided with a carrier having a work-holding hole in which a work is fitted and held, a surface plate for grinding the work held on the carrier, and exciter for exciting the carrier to adjust a position of the work deviated from the work-holding hole. Exciting the carrier by the exciter causes a position of the work, deviated from the work-holding hole, to be adjusted, thereby causing the work to be fitted in the work-holding hole.

Abstract: In order to take a ground work W out of a work-holding hole of a carrier by chucking the outer periphery of the work W, a surface grinding machine is provided with chucking means for chucking the outer periphery of the work W by a plurality of claw members and a plurality of cutouts into which the claw members of the chucking means can be inserted are made in the edge of the work-holding hole of the carrier, and the ground work W in the work-holding hole is taken out at the position of the cutouts.

Abstract: A single side work polishing apparatus rectifies the surface geometry of a polishing pad during the polishing of a work. A correction roller is mounted to a pressure member that pushes a work against a polishing pad held by a rotating surface plate. The correction roller has a length substantially equivalent to the width of the working area of the polishing pad and is arranged along the radial direction of the surface plate. During polishing, the work and the correction roller are pressed against the polishing pad by the pressure member. The correction roller rotates about its longitudinal axis to rectify the polishing pad while the work is being polished.

Abstract: The present invention provides a work unloading means capable of unloading polished works safely and promptly from a processing section. This means uses an upper and a lower surface plates 5 and 6 to polish works 4 held by a plurality of carriers 3 that engage a sun gear 1 and an internal gear 2, allows the works 4 to be sucked by the bottom surface of the upper surface plate 5 to lift them together with the plate 5, and then intermittently rotates the lifted upper surface plate 5 by a specified angle increment to transfer the works 4 to an unloading position A, where the works are released from the upper surface plate 5 for unloading.

Abstract: The invention relates to a sheet feeding type wafer polishing machine which processes both surfaces of the wafer and outermost periphery of the wafer (edge part) in series, having two platens which are adhered to a polishing pad or a grinding stone and holding a wafer therebetween. The surface of the wafer is processed by rotating at least one of the two platens and wafer, wherein the diameters of the platens are bigger than the radius of the wafer and smaller than the diameter of the wafer, and the wafer is supported by at least three guide rollers which contact to the outermost periphery of the wafer. The present invention also provides an edge polishing and a surface polishing method which are carried out by the wafer processing machine.