Patents by Inventor Shunji Horikawa

Shunji Horikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5714014
    Abstract: A semiconductor heterojunction material includes a heterojunction configured by successively overlaying first, middle and third layers of semiconductor, some or all of the constituent elements of the first and third layers being different and the middle layer containing all elements contained in the first and third layers.
    Type: Grant
    Filed: June 13, 1995
    Date of Patent: February 3, 1998
    Assignee: Showa Denko K.K.
    Inventor: Shunji Horikawa