Abstract: A solid state image sensor of the present disclosure includes: a first semiconductor substrate provided with at least a pixel array unit in which pixels that perform photoelectric conversion are arranged in a matrix form; and a second semiconductor substrate provided with at least a control circuit unit that drives the pixels. The first semiconductor substrate and the second semiconductor substrate are stacked, with first surfaces on which wiring layers are formed facing each other, the pixel array unit is composed of a plurality of divided array units, the control circuit unit is provided corresponding to each of the plurality of divided array units, and electrical connection is established in each of the divided array units, through an electrode located on each of the first surfaces of the first semiconductor substrate and the second semiconductor substrate, between the pixel array unit and the control circuit unit.

Abstract: Ranging systems, calibration methods, programs, and electronic apparatus with lower cost calibration are disclosed. In one example, a ranging system includes a light source, a sensor that detects reflection light of light emitted from the light source and reflected on a target object, a determination unit that determines whether or not a peripheral object is usable as a reflection object on the basis of a predetermined determination condition, and a generation unit that generates a correction table for correcting an offset value between a true value of a range value and a measured value on the basis of a detection result received from the sensor and obtained by detecting reflection light of light applied from the light source to a target object usable as the reflection object in a case where the peripheral object is determined to be usable as the reflection object.

Abstract: An optical module according to the present disclosure includes: a light-emitting section (10) configured to emit light; a light-receiving section (20) including a first light-receiving section and a second light-receiving section; a first cover part (30) provided on a light emission side of the light-emitting section (10), and configured to guide first light (L1) that is a portion of the light emitted from the light-emitting section (10) in a direction of a target (2) and guide second light (L2) that is another portion of the light emitted from the light-emitting section (10) in a direction different from the direction of the target (2); and a second cover part (40) provided on a light incidence side of the light-receiving section (20), and configured to guide reflected light (L1R) that is the first light (L1) reflected by the target (2) in a direction of the first light-receiving section and guide the second light (L2) guided from the first cover part (30) in a direction of the second light-receiving section

Abstract: A solid state image sensor of the present disclosure includes: a first semiconductor substrate provided with at least a pixel array unit in which pixels that perform photoelectric conversion are arranged in a matrix form; and a second semiconductor substrate provided with at least a control circuit unit that drives the pixels. The first semiconductor substrate and the second semiconductor substrate are stacked, with first surfaces on which wiring layers are formed facing each other, the pixel array unit is composed of a plurality of divided array units, the control circuit unit is provided corresponding to each of the plurality of divided array units, and electrical connection is established in each of the divided array units, through an electrode located on each of the first surfaces of the first semiconductor substrate and the second semiconductor substrate, between the pixel array unit and the control circuit unit.

Abstract: An object of the present disclosure is to provide an optical distance measurement device and an optical distance measurement method that make it easier to generate calibration information used for calibrating a measured distance.

Abstract: The present technology relates to a signal processing apparatus and a signal processing method that allow easy adjustment of a pulse duty ratio. A phase comparison section outputs a phase difference signal corresponding to a phase difference between rising edges or falling edges of a first pulse and a second pulse. The first pulse is used as a basis at the time of adjusting a duty ratio, and the second pulse has a duty ratio that is to be adjusted. A reference signal generation section outputs a reference signal that starts changing according to the first pulse. A comparison section outputs a comparison output signal representing a magnitude relation between the phase difference signal and the reference signal, and the comparison output signal is fed back as the second pulse. The present technology is applicable to a case of adjusting a duty ratio of a pulse.

Abstract: The present disclosure relates to a distance measurement apparatus and a detection method that allow for reliable detection of diffuser breakage. Provided is a distance measurement apparatus that includes a light source section and a breakage detection section. The light source section emits a laser beam. The breakage detection section detects breakage of a diffusion member that diffuses the laser beam emitted from the light source section. The light source section modulates the laser beam on the basis of a pulsed wave generated by a pulse generator and emits the modulated laser beam. The breakage detection section feeds the pulsed wave to one end of a transparent electrode formed in a predetermined pattern on the diffusion member, detects a reflected wave that occurs at a released end that is another end, and detects breakage of the diffusion member on the basis of a detection result of the reflected wave.

Abstract: A solid state image sensor of the present disclosure includes: a first semiconductor substrate provided with at least a pixel array unit in which pixels that perform photoelectric conversion are arranged in a matrix form; and a second semiconductor substrate provided with at least a control circuit unit that drives the pixels. The first semiconductor substrate and the second semiconductor substrate are stacked, with first surfaces on which wiring layers are formed facing each other, the pixel array unit is composed of a plurality of divided array units, the control circuit unit is provided corresponding to each of the plurality of divided array units, and electrical connection is established in each of the divided array units, through an electrode located on each of the first surfaces of the first semiconductor substrate and the second semiconductor substrate, between the pixel array unit and the control circuit unit.

Abstract: A solid state image sensor of the present disclosure includes: a first semiconductor substrate provided with at least a pixel array unit in which pixels that perform photoelectric conversion are arranged in a matrix form; and a second semiconductor substrate provided with at least a control circuit unit that drives the pixels. The first semiconductor substrate and the second semiconductor substrate are stacked, with first surfaces on which wiring layers are formed facing each other, the pixel array unit is composed of a plurality of divided array units, the control circuit unit is provided corresponding to each of the plurality of divided array units, and electrical connection is established in each of the divided array units, through an electrode located on each of the first surfaces of the first semiconductor substrate and the second semiconductor substrate, between the pixel array unit and the control circuit unit.

Abstract: A solid state image sensor of the present disclosure includes: a first semiconductor substrate provided with at least a pixel array unit in which pixels that perform photoelectric conversion are arranged in a matrix form; and a second semiconductor substrate provided with at least a control circuit unit that drives the pixels. The first semiconductor substrate and the second semiconductor substrate are stacked, with first surfaces on which wiring layers are formed facing each other, the pixel array unit is composed of a plurality of divided array units, the control circuit unit is provided corresponding to each of the plurality of divided array units, and electrical connection is established in each of the divided array units, through an electrode located on each of the first surfaces of the first semiconductor substrate and the second semiconductor substrate, between the pixel array unit and the control circuit unit.

Abstract: A solid state image sensor of the present disclosure includes: a first semiconductor substrate provided with at least a pixel array unit in which pixels that perform photoelectric conversion are arranged in a matrix form; and a second semiconductor substrate provided with at least a control circuit unit that drives the pixels. The first semiconductor substrate and the second semiconductor substrate are stacked, with first surfaces on which wiring layers are formed facing each other, the pixel array unit is composed of a plurality of divided array units, the control circuit unit is provided corresponding to each of the plurality of divided array units, and electrical connection is established in each of the divided array units, through an electrode located on each of the first surfaces of the first semiconductor substrate and the second semiconductor substrate, between the pixel array unit and the control circuit unit.

Abstract: An objective is to identify the health state of mechanical equipment and provide information usable for determining maintenance work timing or the like. A health management system includes a time-series data acquisition unit configured to acquire multi-dimensional sensor data and environmental data from mechanical equipment; a first discrimination unit configured to quantify the equipment state of the mechanical equipment by a statistical method using normal data as learning data; a second discrimination unit configured to quantify the health state indicating the performance or quality of the mechanical equipment by a statistical method using normal data; and an output unit configured to display and/or output to the outside the quantified equipment state and health state.

Abstract: To sensing an anomaly on the basis of a multi-dimensional time series sensor signal, in order to determine the next action for a countermeasure, survey, or the like, the present invention is configured such that a multi-dimensional feature vector for each time is extracted on the basis of a sensor signal, a reference feature vector for each time is extracted on the basis of a set of characteristic vectors for a predetermined learning period and the characteristic vector of each time, an anomaly measure is calculated on the basis of the difference between the feature vectors for the times and the reference feature vectors, an anomaly is detected by comparing the anomaly measure and a predetermined threshold value, and the anomaly-related sensor for the time the anomaly is detected is identified on the basis of a 2-dimensional distribution density of feature values.

Abstract: A method for reviewing a defect including a light capturing step that illuminates a sample with light under plural optical conditions, while varying only at least one of illumination conditions, sample conditions, or detection conditions, and detects plural lights scattering from the sample; a signal obtaining step that obtains plural signals based on the lights detected; and a processing step that discriminates a defect from noise according to a waveform characteristic quantity, an image characteristic quantity, or a value characteristic quantity created using the signals and derives the coordinates of defect.

Abstract: In case-based anomaly indication detection in a facility, there are problems such as error generation due to insufficient learning data or execution difficulty due to increased memory capacity and calculation time when the learning data period has been increased to obtain the learning data sufficiently. Provided is a method for monitoring facility state on the basis of a time series signal outputted from the facility, wherein an operation pattern label for each fixed interval is assigned on the basis of the time series signal, learning data is selected on the basis of the operation pattern label for each fixed interval, a normal model is created on the basis of the selected learning data, an anomaly measure is calculated on the basis of the time series signal and the normal model, and the facility state is determined to be anomaly or normal on the basis of the calculated anomaly measure.

Abstract: Provided is an anomaly detection method and system capable of constructing determination condition rules of anomaly detection from case-based anomaly detection by way of multivariate analysis of a multi-dimensional sensor signal, applying the rules to design-based anomaly detection of individual sensor signals, and also appropriately executing setting and control of threshold values for highly sensitive, early, and clearly visible detection of anomalies. Anomaly detection on the basis of a case base by way of multivariate analysis controls design-based anomaly detection. That is to say, (1) anomaly detection on the basis of a case base performs selection of sensor signals and anomaly detection according to various types of anomalies. Specifically, anomaly detection (characteristic conversion), evaluation of level of effect of each signal, construction of determination conditions (rules), and display and selection of sensor signals corresponding to the anomaly are performed.

Abstract: detect a fine defect in reviewing To review a fine defect detected by another inspection apparatus, there is disclosed a method for reviewing a defect including a light capturing step that illuminates a sample with light under plural optical conditions, while varying only at least one of illumination conditions, sample conditions, or detection conditions, and detects plural lights scattering from the sample; a signal obtaining step that obtains plural signals based on the lights detected; and a processing step that discriminates a defect from noise according to a waveform characteristic quantity, an image characteristic quantity, or a value characteristic quantity created using the signals and derives the coordinates of defect.

Abstract: To sensing an anomaly on the basis of a multi-dimensional time series sensor signal, in order to determine the next action for a countermeasure, survey, or the like, the present invention is configured such that a multi-dimensional feature vector for each time is extracted on the basis of a sensor signal, a reference feature vector for each time is extracted on the basis of a set of characteristic vectors for a predetermined learning period and the characteristic vector of each time, an anomaly measure is calculated on the basis of the difference between the feature vectors for the times and the reference feature vectors, an anomaly is detected by comparing the anomaly measure and a predetermined threshold value, and the anomaly-related sensor for the time the anomaly is detected is identified on the basis of a 2-dimensional distribution density of feature values.

Abstract: In a facility such as a plant, error detection can be performed by using characteristic amounts based on a statistical probability characteristic, but when sensor data is acquired at long sampling intervals for reducing costs, those intense changes cannot always be caught. Furthermore, when the sensor sampling time is not synchronized with the start of a sequence, a time difference occurs between sensor data obtained in the same sequence at different times, so it is not possible to determine a statistical probability characteristic for areas of intense change. Therefore, with the present invention a statistical probability characteristic for a time period to be monitored is calculated by estimating the sensor data that cannot be obtained, and error detection is performed on the basis of that statistical probability characteristic with respect to sequences with intense changes. Thus, it is possible to perform error detection with respect to sequences with intense changes.

Abstract: An objective is to identify the health state of mechanical equipment and provide information usable for determining maintenance work timing or the like. A health management system includes a time-series data acquisition unit configured to acquire multi-dimensional sensor data and environmental data from mechanical equipment; a first discrimination unit configured to quantify the equipment state of the mechanical equipment by a statistical method using normal data as learning data; a second discrimination unit configured to quantify the health state indicating the performance or quality of the mechanical equipment by a statistical method using normal data; and an output unit configured to display and/or output to the outside the quantified equipment state and health state.