Abstract: A hand shake compensation unit having a first substrate on which an image sensor is provided, a second substrate on which a processing circuit for processing an output signal from the image sensor is provided, a driving mechanism that drives the first substrate with respect to the second substrate, and a plurality of cable members that connects the first substrate with the second substrate and whose drawing directions on the first substrate are different from each other.

Abstract: A mechanism, of a camera, for surely resetting a microcomputer at time of switching among a plurality of types of power sources. In the mechanism in which a manual operation dial for switching among the plurality of types of power sources is rotated to slide an electrical contact piece over a predetermined electrically conductive/non-conductive pattern so that a desired power source type is selected, an electric conductivity/non-conductivity between an IC and a negative terminal changes, immediately before an electric power across a positive terminal and the negative terminal is changed from “ON” to “OFF”, and immediately after the electric power is changed from “OFF” to “ON”. In association with the change, the IC outputs a reset signal to the microcomputer of the camera.

Abstract: A flexible printed circuit board for use in a display unit of a camera, which includes a flexible substrate with a printed circuit pattern, a die of an integrated circuit chip mounted on said substrate for driving the display drive, a plurality of wires, and resin sealant for covering said integrated circuit chip. The flexible substrate has first terminals to be in contact with a display device and second terminals in electric connections to said first terminals, respectively. The die of the integrated circuit chip includes a plurality of connecting terminals. The plurality of wires are for bonding said connecting terminals of the integrated circuit chip to said second terminals of said printed circuit pattern.

Abstract: The present invention provides an improved chip mounting method for mounting an IC chip on a substrate, comprising the steps of; integrally molding a projection on the substrate, the projection being located on a surface of the substrate on which the IC chip will be mounted; forming a conductive pattern on the projection and on a necessary portion of the substrate; forming a connecting layer on the conductive pattern formed on the projection; and fixing said IC chip on the substrate while electrically connecting an exposed electrode of the IC chip with the conductive pattern formed on the projection through the connecting layer.

Abstract: A printed circuit board is plated through the steps of providing a printed circuit board, covering at least a predetermined portion to be plated of the printed circuit board with a mask, sealing tightly the periphery of the concavity by sandwiching a sealing material between the mask and the circuit board, providing an electric contact piece, filling up the space with plating solution, connecting the electric contact piece to a power supply, and supplying a plating electric current to the predetermined portion to be plated of the printed circuit board.

Abstract: A method of making a printed circuit board includes providing a substrate coated with a conductive layer, developing a first photoresist layer on the conductive layer to define a first conductive pattern of the desired circuit configuration having a plurality of discontinuous segments, and a second conductive pattern interconnecting the discontinuous segments of the desired circuit configuration. A second layer of photoresist is positioned across the whole surface of the substrate except at least a selected portion of the first conductive pattern, and the substrate is electrically activated during a coating process for depositing conductive material on the selected portion of the first conductive pattern. The first conductive pattern is subsequently coated with photoresist, and the second conductive pattern, which is now exposed on the substrate, is subject to an etching process to effectively remove all of the second conductive pattern.