Patents by Inventor Shunji Shuto

Shunji Shuto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device manufacturing system and method for manufacturing semiconductor devices including calculating oxide film thickness using real time simulator
    Patent number: 7702413
    Abstract: The present invention provides a solution for interleaving data frames, in a semiconductor device manufacturing system in which the processing apparatus for conducting a process on any one of a semiconductor substrate and a thin film on a surface thereof; a self-diagnostic system for diagnosing a state of the processing apparatus; and a parameter fitting apparatus for maintaining a parameter of the self-diagnostic system when an inspection result of the semiconductor substrate having undergone the process has been determined to be correct, and for changing the parameter of the self-diagnostic system when the inspection result has been determined to be incorrect.
    Type: Grant
    Filed: September 8, 2004
    Date of Patent: April 20, 2010
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Yukihiro Ushiku, Akira Ogawa, Hidenori Kakinuma, Shunji Shuto, Masahiro Abe, Tatsuo Akiyama, Shigeru Komatsu
  • Semiconductor device manufacturing system and method for manufacturing semiconductor devices including calculating oxide film thickness using real time simulator
    Patent number: 7623937
    Abstract: The present invention provides a solution for interleaving data frames, in a semiconductor device manufacturing system in which the processing apparatus for conducting a process on any one of a semiconductor substrate and a thin film on a surface thereof; a self-diagnostic system for diagnosing a state of the processing apparatus; and a parameter fitting apparatus for maintaining a parameter of the self-diagnostic system when an inspection result of the semiconductor substrate having undergone the process has been determined to be correct, and for changing the parameter of the self-diagnostic system when the inspection result has been determined to be incorrect.
    Type: Grant
    Filed: September 8, 2004
    Date of Patent: November 24, 2009
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Yukihiro Ushiku, Akira Ogawa, Hidenori Kakinuma, Shunji Shuto, Masahiro Abe, Tatsuo Akiyama, Shigeru Komatsu
  • Semiconductor device manufacturing system and method for manufacturing semiconductor devices
    Publication number: 20050095774
    Abstract: The present invention provides a solution for interleaving data frames, in a semiconductor device manufacturing system in which the processing apparatus for conducting a process on any one of a semiconductor substrate and a thin film on a surface thereof; a self-diagnostic system for diagnosing a state of the processing apparatus; and a parameter fitting apparatus for maintaining a parameter of the self-diagnostic system when an inspection result of the semiconductor substrate having undergone the process has been determined to be correct, and for changing the parameter of the self-diagnostic system when the inspection result has been determined to be incorrect.
    Type: Application
    Filed: September 8, 2004
    Publication date: May 5, 2005
    Inventors: Yukihiro Ushiku, Akira Ogawa, Hidenori Kakinuma, Shunji Shuto, Masahiro Abe, Tatsuo Akiyama, Shigeru Komatsu