Abstract: A method of fabricating a photovoltaic panel is disclosed which is formed by arranging a number of granular photovoltaic devices in an array and forming the array into the shape of a panel from a transparent resin and includes each photovoltaic device having a part protruding from the resin.

Abstract: A method of fabricating a photovoltaic panel is disclosed which is formed by arranging a number of granular photovoltaic devices in an array and forming the array into the shape of a panel from a transparent resin and includes each photovoltaic device having a part protruding from the resin.

Abstract: An object of the present invention is to form suitable spherical convex lens on the surfaces of spherical or granular photovoltaic devices in an easy and cost-effective method even when the photovoltaic devices have variations in the size and shape. To achieve the object, the invention is a method in which are carried out immersing the photovoltaic device in a liquid resin and lifting the photovoltaic device, thereby causing the liquid resin to adhere to the surface of the photovoltaic device, and hardening the liquid resin adherent to the surface of the photovoltaic device, thereby forming a resin lens on the surface of the photovoltaic device. Since a spherical convex lens is formed on the surface of the photovoltaic device by surface tension of the resin liquid, a suitable spherical convex lens can be formed on the surface of the photovoltaic device and the photovoltaic device can be positioned at the center of the lens even when the photovoltaic devices have variations in the size and shape.

Abstract: An object of the present invention is to provide a technique for forming an ohmic connection between a semiconductor and a metal efficiently in a short period of time. The present invention provides a method of forming at least one electrode on a surface of a semiconductor, wherein a metal or alloy for the electrode is rubbed against a predetermined region of the semiconductor surface so as to be adhered by frictional force and frictional heat to the predetermined region of the semiconductor as an electrode and part of the adhered metal or a metal of the alloy is diffused into an inside of the semiconductor by the frictional heat thereby to be formed into an ohmic electrode substantially simultaneously when the metal or alloy is adhered by the frictional force and frictional heat to the predetermined region of the semiconductor.

Abstract: An object of the present invention is to provide a technique for forming an ohmic connection between a semiconductor and a metal efficiently in a short period of time.