Abstract: An image input device is provided which can instruct a host computer to perform a cleared process with respect to image data obtained by scanning without a user's instruction being input to the host computer. The image input device is adapted to be connected to a host computer so as to transfer image data to the host computer. An instruction with respect to what process is to be applied to the image data by the host computer is input to the image input device by the user. The content of the instruction is announced to the host computer when the image data is transferred to the host computer.

Abstract: An interfacing apparatus, connecting between a host system and a data processing device and including a parallel interface function for transmitting signals, includes an energy saving mode controller and an interface circuit controller. The energy saving mode controller selectively switches the apparatus into an energy saving mode from an idling mode. In the energy saving mode, the energy saving mode controller cuts off power for driving an interface circuit, except for a minimal power required to be supplied to at least one predefined portion of the interface circuit. The interface circuit controller notifies the host system of statuses of the interface apparatus using at least one status signal line. After having entered the energy saving mode, the interface circuit controller maintains the at least one logic level signal line at a status which is reversed from a usual logic level thereof in the idling mode.

Abstract: An IC mounting method and its resulting structure, such as an IC card is provided. An IC card includes a metal plate formed with at least one hole, and an IC chip is located fixed in position in the hole with a filler material filling the gap between the hole and the IC chip. An interconnect pattern is provided on the plate with an electrically insulating film sandwiched therebetween, and the interconnect pattern is in electrical contact with a contact pad of the IC chip. Preferably, the surface of the IC chip on which the contact pad is provided is substantially flush with one surface of the plate. When an electrically insulating film is fixedly attached to a substrate having a hole, in which an IC chip is fixedly provided, by an adhesive agent, the material of the film is selected to be similar to the material of the adhesive agent.