Abstract: A crimp terminal-equipped flexible printed circuit board includes: a first flexible printed circuit board having a base film and a circuit provided on a surface of the base film and made of metal foil; multiple crimp terminals including crimp pieces crimped to penetrate the first flexible printed circuit board and bent to bite into part of the circuit; and an insulating reinforcing film partially integrally provided on an area of the base film where the multiple crimp pieces penetrate.

Abstract: Provided is a flexible printed wiring board including: a base film which is an insulating layer; a first conductor layer; a second conductor layer; and a through-hole, in which the first conductor layer is provided on one surface of the base film, the second conductor layer is provided on the other surface of the base film, and the through-hole is provided so as to penetrate the base film and electrically connect the first conductor layer and the second conductor layer to each other, and the second conductor layer has a solderable region.

Abstract: A vehicle exterior component includes a cover, a housing, and a substrate. The cover is configured to arranged forward of a radar device in an emission direction of electromagnetic waves. The housing covers a rear surface of the cover. The substrate is arranged in the housing. The substrate includes a light emitting unit configured to emit visible light. The cover forms an angle in a range of 0° to 5° with respect to an orthogonal plane that is orthogonal to the emission direction. The rear wall of the housing faces the cover in the emission direction and forms an angle in a range of 2° to 10° with respect to the orthogonal plane.

Abstract: Provided is a flexible printed circuit board with connection terminal, including: a base film and a conductor layer provided on the base film, wherein the connection terminal includes a plurality of crimping pieces for fixing the connection terminal to the flexible printed circuit board, the crimping pieces penetrate the flexible printed circuit board by being crimped, and are bent in a direction opposite to a direction in which the crimping pieces penetrate the flexible printed circuit board, to bite into at least a part of the conductor layer, and the conductor layer is removed in a region of the conductor layer which the crimping pieces penetrate.

Abstract: A crimp terminal-equipped flexible printed circuit board includes: a first flexible printed circuit board having a base film and a circuit provided on a surface of the base film and made of metal foil; multiple crimp terminals including crimp pieces crimped to penetrate the first flexible printed circuit board and bent to bite into part of the circuit; and an insulating reinforcing film partially integrally provided on an area of the base film where the multiple crimp pieces penetrate.

Abstract: Provided is a heater which includes a base film having a metal foil on a surface of the base film, and a resistor. The metal foil forms a heater circuit that generates heat when energized, and the heater circuit is connected in series with the resistor.

Abstract: Provided is a heater which includes a flexible printed wiring board, in which the flexible printed wiring board includes a base film, a first metal foil, and a second metal foil, the first metal foil forms a heater circuit portion that generates heat when energized, on a first surface of the base film, and the second metal foil forms a heat conductive foil portion that maintains a non-energized state, on a second surface of the base film.

Abstract: A heater includes: a flexible printed wiring board including a base film and a metal foil provided on one side of the base film; a heater circuit portion that is formed from the metal foil and generates heat when energized; and a heat conductive foil portion that is formed from the metal foil at a position away from the heater circuit portion and is maintained in a non-energized state.

Abstract: The present invention provides a Group III nitride semiconductor light-emitting device which is intended to relax stress applied to a light-emitting layer. The light-emitting device includes an MQW layer, and an n-side superlattice layer formed below the MQW layer. The n-side superlattice layer is formed by repeatedly depositing layer units, each unit including an InGaN layer, a GaN layer, and an n-GaN layer which are sequentially deposited from the side of the sapphire substrate. In the n-side superlattice layer, an InGaN layer more proximal to the MQW layer has a higher In compositional proportion. The In compositional proportion of the InGaN layer (which is most proximal to the MQW layer) of the n-side superlattice layer is 70% to 100% of the In compositional proportion of the InGaN layer (which is most proximal to the n-side superlattice layer) of the MQW layer.