Abstract: A particulate trap for use in a diesel engine can efficiently trap particulates contained in exhaust gas with low pressure drop and can burn collected particulates for regeneration with less power consumption. A filter element having a built-in electric heater is mounted in a case provided in the exhaust line of a diesel engine. The filter has two mutually opposed surfaces between which is mounted the electric heater. With this arrangement, it is possible to increase the filtration area and also the heating efficiency.

Abstract: A particulate trap for use in a diesel engine which is inexpensive, and which is high in particulate trapping efficiency, regeneration properties and durability, and low in pressure loss due to particulates trapped. An even number of flat filters made from a non-woven fabric of heat-resistant metallic fiber are laminated alternately with the same number of corrugated sheets made of a heat-resistant metal. The laminate thus formed are rolled into a columnar shape. Each space between the adjacent flat filters in which every other corrugated sheet is inserted is closed at one end of the filter element by a closure member. The other spaces between the adjacent flat filters are closed at the other end of the filter element.

Abstract: The present invention provides a car exhaust purifying filter member which is high in the capacity to collect solid and liquid contents in exhausts and which has such high heat resistance as to be capable of withstanding heat when burned for cleaning and a method of manufacturing the same. A three-dimensional mesh-like metallic porous member made from Ni--Cr--Al and having a three-dimensional framework is heated at 800-1000 .degree. C. in the atmosphere to form on its surface a densely grown fibrous alumina crystal. This member is used as a filter member. Such a filter member shows excellent collecting capacity and corrosion resistance and can withstand high temperatures. Also, it is possible to firmly carry a catalyst on the fibrous alumina crystal formed on the surface. Because of its increased surface area, it has an increased catalyst carrying capacity.

Abstract: A particulate trap for diesel engine use which is less likely to vibrate or deform under exhaust pressures achieves goods results in particulate trapping properties, pressure drop, durability and regenerating properties. This trap has a filter element having a plurality of flat or cylindrical filters of three-dimensionally reticulated porous member. Longitudinally extending exhaust incoming and outgoing spaces are defined alternately between the adjacent filters by alternately closing the inlet and outlet ends of the spaces between the adjacent filters. Gas permeable reinforcing members are inserted in the exhaust outgoing spaces to prevent the filter from being deformed due to the difference between the pressure upstream and downstream of each filter produced when exhausts pass through the filters. Similar gas permeable reinforcing members may also be inserted in the exhaust incoming spaces or at both ends of the filter element to more positively prevent vibration of the filters.

Abstract: A process for manufacturing a plastic package type semiconductor device composed of a rolled metal substrate made of copper or copper alloy and an insulating film formed on the surface of the substrate. The film may be a single-layer film made of silicon oxynitride or a composite film formed by laminating a silicon oxide layer and a silicon oxynitride layer (or a silicon nitride layer). A semiconductor element is mounted on the film or on the exposed surface of the substrate. Other passive elements are provided on the film. After connecting these elements with bonding wires, the entire device is sealed in a resin molding. This device is thus free of cracks due to difference in thermal expansion between the film and the substrate, or peeling due to moisture absorption.

Abstract: A plastic package type semiconductor device is composed of a rolled metal substrate made of copper or copper alloy and an insulating film formed on the surface of the substrate. The film may be a single-layer film made of silicon oxynitride or a composite film formed by laminating a silicon oxide layer and a silicon oxynitride layer (or a silicon nitride layer). A semiconductor element is mounted on the film or on the exposed surface of the substrate. Other passive elements are provided on the film. After connecting these elements with bonding wires, the entire device is sealed in a resin molding. This device is thus free of cracks due to difference in thermal expansion between the film and the substrate, or peeling due to moisture absorption.

Abstract: A wiring board has a wiring circuit which is reliable and which can be easily miniaturized, and used for the production of a highly integrated, lighter, thinner, shorter, smaller and low-cost semiconductor device. This wiring board can be sealed in a plastic package. The wiring board has a metal plate and a thin-film dielectric layer formed on the surface of the metal plate. A semiconductor device is mounted on the surface of the dielectric layer or the exposed surface of the metal plate. Film wirings are formed on the dielectric layer. Each film wiring is in the form of a laminate formed by laminating, by vapor phase deposition or by plating, a an aluminum conductive layer, an adhesive layer of chromium, titanium or a laminate thereof, a diffusion barrier layer of nickel, copper or a laminate thereof, and a corrosion-preventive and wire bonding layer of gold.