Patents by Inventor Shunsuke FURUSE
Shunsuke FURUSE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240006448Abstract: Provided is an imaging device including: a first semiconductor substrate provided with a photoelectric conversion element, a second semiconductor substrate stacked on the first semiconductor substrate with an interlayer insulating film interposed therebetween and provided with a pixel circuit that reads out charges generated in the photoelectric conversion element as a pixel signal, and a via that penetrates the interlayer insulating film and electrically connects a first surface of the first semiconductor substrate facing the second semiconductor substrate and at least a part of a second surface of the second semiconductor substrate facing the first surface.Type: ApplicationFiled: October 11, 2021Publication date: January 4, 2024Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATIONInventors: Takeya MOCHIZUKI, Keiichi NAKAZAWA, Shinichi YOSHIDA, Kenya NISHIO, Nobutoshi FUJII, Suguru SAITO, Masaki OKAMOTO, Ryosuke KAMATANI, Yuichi YAMAMOTO, Kazutaka IZUKASHI, Yuki MIYANAMI, Hirotaka YOSHIOKA, Hiroshi HORIKOSHI, Takuya KUROTORI, Shunsuke FURUSE, Takayoshi HONDA
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Publication number: 20230178575Abstract: Provided is a semiconductor device including: a multilayer substrate including an optical element; a light-transmitting plate provided on the substrate to cover the optical element; and a lens of an inorganic material provided between the substrate and the light-transmitting plate. A structure having a same strength as a strength per unit area of the lens is provided at a portion outside an effective photosensitive region where the optical element is formed, when the substrate is viewed in plan.Type: ApplicationFiled: January 31, 2023Publication date: June 8, 2023Applicant: SONY GROUP CORPORATIONInventors: Takaaki HIRANO, Shinji MIYAZAWA, Kensaku MAEDA, Yusuke MORIYA, Shunsuke FURUSE, Yutaka OOKA
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Publication number: 20230170377Abstract: There is provided semiconductor devices and methods of forming the same, including: a first substrate; and a second substrate adjacent to the first substrate, where a side wall of the second substrate includes one or more diced portions that can include a blade diced portion and a stealth diced portion; and also imaging devices and methods of forming the same, including: a first substrate; a transparent layer; an adhesive layer between the first substrate and the transparent layer; a second substrate, where the first substrate is disposed between the adhesive layer and the second substrate; and a groove extending from the adhesive layer to the second substrate, where the groove is filled with the adhesive layer.Type: ApplicationFiled: January 26, 2023Publication date: June 1, 2023Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATIONInventors: Masanari YAMAGUCHI, Taizo TAKACHI, Shunsuke FURUSE, Takashi OINOUE, Yuki IKEBE
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Publication number: 20230113565Abstract: Provided is a light-emitting device and a method for manufacturing the same which allow the filling performance of the film that fills the space around light-emitting elements to be improved. The light-emitting device according to the disclosure includes a substrate, a plurality of light-emitting elements and a plurality of electrodes sequentially provided on a first surface of the substrate, and a film provided on the first surface of the substrate to surround the light-emitting elements, and when the first surface is a bottom surface of the substrate, the lowermost part of a bottom surface of the film is provided in a higher position than a bottom surface of the electrode. In this way, for example, the film is formed before the substrate is provided on another substrate, so that the filling performance of the film that fills the space around the light-emitting elements can be improved.Type: ApplicationFiled: February 1, 2021Publication date: April 13, 2023Inventors: SHUNSUKE FURUSE, HIROTAKA YOSHIOKA
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Patent number: 11600648Abstract: Provided is a semiconductor device including: a multilayer substrate including an optical element; a light-transmitting plate provided on the substrate to cover the optical element; and a lens of an inorganic material provided between the substrate and the light-transmitting plate. A structure having a same strength as a strength per unit area of the lens is provided at a portion outside an effective photosensitive region where the optical element is formed, when the substrate is viewed in plan.Type: GrantFiled: May 7, 2021Date of Patent: March 7, 2023Assignee: SONY GROUP CORPORATIONInventors: Takaaki Hirano, Shinji Miyazawa, Kensaku Maeda, Yusuke Moriya, Shunsuke Furuse, Yutaka Ooka
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Patent number: 11594563Abstract: The present technology relates to techniques of preventing intrusion of moisture into a chip. Various illustrative embodiments include image sensors that include: a substrate; a plurality of layers stacked on the substrate; the plurality of layers including a photodiode layer having a plurality of photodiodes formed on a surface of the photodiode layer; the plurality of layers including at least one layer having a groove formed such that a portion of the at least one layer is excavated; and a transparent resin layer formed above the photodiode layer and formed in the groove. The present technology can be applied to, for example, an image sensor.Type: GrantFiled: January 8, 2021Date of Patent: February 28, 2023Assignee: SONY CORPORATIONInventors: Atsushi Yamamoto, Shinji Miyazawa, Yutaka Ooka, Kensaku Maeda, Yusuke Moriya, Naoki Ogawa, Nobutoshi Fujii, Shunsuke Furuse, Masaya Nagata, Yuichi Yamamoto
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Patent number: 11587970Abstract: There is provided semiconductor devices and methods of forming the same, including: a first substrate; and a second substrate adjacent to the first substrate, where a side wall of the second substrate includes one or more diced portions that can include a blade diced portion and a stealth diced portion; and also imaging devices and methods of forming the same, including: a first substrate; a transparent layer; an adhesive layer between the first substrate and the transparent layer; a second substrate, where the first substrate is disposed between the adhesive layer and the second substrate; and a groove extending from the adhesive layer to the second substrate, where the groove is filled with the adhesive layer.Type: GrantFiled: March 11, 2020Date of Patent: February 21, 2023Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATIONInventors: Masanari Yamaguchi, Taizo Takachi, Shunsuke Furuse, Takashi Oinoue, Yuki Ikebe
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Publication number: 20210305300Abstract: The present technology relates to techniques of preventing intrusion of moisture into a chip. Various illustrative embodiments include image sensors that include: a substrate; a plurality of layers stacked on the substrate; the plurality of layers including a photodiode layer having a plurality of photodiodes formed on a surface of the photodiode layer; the plurality of layers including at least one layer having a groove formed such that a portion of the at least one layer is excavated; and a transparent resin layer formed above the photodiode layer and formed in the groove. The present technology can be applied to, for example, an image sensor.Type: ApplicationFiled: January 8, 2021Publication date: September 30, 2021Applicant: SONY CORPORATIONInventors: Atsushi YAMAMOTO, Shinji MIYAZAWA, Yutaka OOKA, Kensaku MAEDA, Yusuke MORIYA, Naoki OGAWA, Nobutoshi FUJII, Shunsuke FURUSE, Masaya NAGATA, Yuichi YAMAMOTO
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Publication number: 20210265407Abstract: Provided is a semiconductor device including: a multilayer substrate including an optical element; a light-transmitting plate provided on the substrate to cover the optical element; and a lens of an inorganic material provided between the substrate and the light-transmitting plate. A structure having a same strength as a strength per unit area of the lens is provided at a portion outside an effective photosensitive region where the optical element is formed, when the substrate is viewed in plan.Type: ApplicationFiled: May 7, 2021Publication date: August 26, 2021Applicant: SONY GROUP CORPORATIONInventors: Takaaki HIRANO, Shinji MIYAZAWA, Kensaku MAEDA, Yusuke MORIYA, Shunsuke FURUSE, Yutaka OOKA
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Patent number: 11037975Abstract: Provided is a semiconductor device including: a multilayer substrate including an optical element; a light-transmitting plate provided on the substrate to cover the optical element; and a lens of an inorganic material provided between the substrate and the light-transmitting plate. A structure having a same strength as a strength per unit area of the lens is provided at a portion outside an effective photosensitive region where the optical element is formed, when the substrate is viewed in plan.Type: GrantFiled: April 19, 2019Date of Patent: June 15, 2021Assignee: SONY CORPORATIONInventors: Takaaki Hirano, Shinji Miyazawa, Kensaku Maeda, Yusuke Moriya, Shunsuke Furuse, Yutaka Ooka
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Patent number: 11024658Abstract: The present technology relates to techniques of preventing intrusion of moisture into a chip. Various illustrative embodiments include image sensors that include: a substrate; a plurality of layers stacked on the substrate; the plurality of layers including a photodiode layer having a plurality of photodiodes formed on a surface of the photodiode layer; the plurality of layers including at least one layer having a groove formed such that a portion of the at least one layer is excavated; and a transparent resin layer formed above the photodiode layer and formed in the groove. The present technology can be applied to, for example, an image sensor.Type: GrantFiled: March 2, 2020Date of Patent: June 1, 2021Assignee: SONY CORPORATIONInventors: Atsushi Yamamoto, Shinji Miyazawa, Yutaka Ooka, Kensaku Maeda, Yusuke Moriya, Naoki Ogawa, Nobutoshi Fujii, Shunsuke Furuse, Masaya Nagata, Yuichi Yamamoto
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Publication number: 20200273897Abstract: The present technology relates to techniques of preventing intrusion of moisture into a chip. Various illustrative embodiments include image sensors that include: a substrate; a plurality of layers stacked on the substrate; the plurality of layers including a photodiode layer having a plurality of photodiodes formed on a surface of the photodiode layer; the plurality of layers including at least one layer having a groove formed such that a portion of the at least one layer is excavated; and a transparent resin layer formed above the photodiode layer and formed in the groove. The present technology can be applied to, for example, an image sensor.Type: ApplicationFiled: March 2, 2020Publication date: August 27, 2020Applicant: SONY CORPORATIONInventors: Atsushi YAMAMOTO, Shinji MIYAZAWA, Yutaka OOKA, Kensaku MAEDA, Yusuke MORIYA, Naoki OGAWA, Nobutoshi FUJII, Shunsuke FURUSE, Masaya NAGATA, Yuichi YAMAMOTO
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Publication number: 20200212087Abstract: There is provided semiconductor devices and methods of forming the same, including: a first substrate; and a second substrate adjacent to the first substrate, where a side wall of the second substrate includes one or more diced portions that can include a blade diced portion and a stealth diced portion; and also imaging devices and methods of forming the same, including: a first substrate; a transparent layer; an adhesive layer between the first substrate and the transparent layer; a second substrate, where the first substrate is disposed between the adhesive layer and the second substrate; and a groove extending from the adhesive layer to the second substrate, where the groove is filled with the adhesive layer.Type: ApplicationFiled: March 11, 2020Publication date: July 2, 2020Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATIONInventors: Masanari YAMAGUCHI, Taizo TAKACHI, Shunsuke FURUSE, Takashi OINOUE, Yuki IKEBE
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Patent number: 10622404Abstract: There is provided semiconductor devices and methods of forming the same, including: a first substrate; and a second substrate adjacent to the first substrate, where a side wall of the second substrate includes one or more diced portions that can include a blade diced portion and a stealth diced portion; and also imaging devices and methods of forming the same, including: a first substrate; a transparent layer; an adhesive layer between the first substrate and the transparent layer; a second substrate, where the first substrate is disposed between the adhesive layer and the second substrate; and a groove extending from the adhesive layer to the second substrate, where the groove is filled with the adhesive layer.Type: GrantFiled: July 19, 2016Date of Patent: April 14, 2020Assignee: Sony Semiconductor Solutions CorporationInventors: Masanari Yamaguchi, Taizo Takachi, Shunsuke Furuse, Takashi Oinoue, Yuki Ikebe
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Patent number: 10608028Abstract: The present technology relates to techniques of preventing intrusion of moisture into a chip. Various illustrative embodiments include image sensors that include: a substrate; a plurality of layers stacked on the substrate; the plurality of layers including a photodiode layer having a plurality of photodiodes formed on a surface of the photodiode layer; the plurality of layers including at least one layer having a groove formed such that a portion of the at least one layer is excavated; and a transparent resin layer formed above the photodiode layer and formed in the groove. The present technology can be applied to, for example, an image sensor.Type: GrantFiled: July 26, 2018Date of Patent: March 31, 2020Assignee: SONY CORPORATIONInventors: Atsushi Yamamoto, Shinji Miyazawa, Yutaka Ooka, Kensaku Maeda, Yusuke Moriya, Naoki Ogawa, Nobutoshi Fujii, Shunsuke Furuse, Masaya Nagata, Yuichi Yamamoto
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Publication number: 20190244996Abstract: Provided is a semiconductor device including: a multilayer substrate including an optical element; a light-transmitting plate provided on the substrate to cover the optical element; and a lens of an inorganic material provided between the substrate and the light-transmitting plate. A structure having a same strength as a strength per unit area of the lens is provided at a portion outside an effective photosensitive region where the optical element is formed, when the substrate is viewed in plan.Type: ApplicationFiled: April 19, 2019Publication date: August 8, 2019Applicant: SONY CORPORATIONInventors: Takaaki HIRANO, Shinji MIYAZAWA, Kensaku MAEDA, Yusuke MORIYA, Shunsuke FURUSE, Yutaka OOKA
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Package and electronic apparatus including a package having a microlens layer and color filter layer
Patent number: 10332924Abstract: Provided is a semiconductor device including: a multilayer substrate including an optical element; a light-transmitting plate provided on the substrate to cover the optical element; and a lens of an inorganic material provided between the substrate and the light-transmitting plate. A structure having a same strength as a strength per unit area of the lens is provided at a portion outside an effective photosensitive region where the optical element is formed, when the substrate is viewed in plan.Type: GrantFiled: March 2, 2018Date of Patent: June 25, 2019Assignee: Sony CorporationInventors: Takaaki Hirano, Shinji Miyazawa, Kensaku Maeda, Yusuke Moriya, Shunsuke Furuse, Yutaka Ooka -
Publication number: 20180331142Abstract: The present technology relates to techniques of preventing intrusion of moisture into a chip. Various illustrative embodiments include image sensors that include: a substrate; a plurality of layers stacked on the substrate; the plurality of layers including a photodiode layer having a plurality of photodiodes formed on a surface of the photodiode layer; the plurality of layers including at least one layer having a groove formed such that a portion of the at least one layer is excavated; and a transparent resin layer formed above the photodiode layer and formed in the groove. The present technology can be applied to, for example, an image sensor.Type: ApplicationFiled: July 26, 2018Publication date: November 15, 2018Applicant: SONY CORPORATIONInventors: Atsushi YAMAMOTO, Shinji MIYAZAWA, Yutaka OOKA, Kensaku MAEDA, Yusuke MORIYA, Naoki OGAWA, Nobutoshi FUJII, Shunsuke FURUSE, Masaya NAGATA, Yuichi YAMAMOTO
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Patent number: 10038021Abstract: The present technology relates to techniques of preventing intrusion of moisture into a chip. Various illustrative embodiments include image sensors that include: a substrate; a plurality of layers stacked on the substrate; the plurality of layers including a photodiode layer having a plurality of photodiodes formed on a surface of the photodiode layer; the plurality of layers including at least one layer having a groove formed such that a portion of the at least one layer is excavated; and a transparent resin layer formed above the photodiode layer and formed in the groove. The present technology can be applied to, for example, an image sensor.Type: GrantFiled: March 31, 2017Date of Patent: July 31, 2018Assignee: Sony CorporationInventors: Atsushi Yamamoto, Shinji Miyazawa, Yutaka Ooka, Kensaku Maeda, Yusuke Moriya, Naoki Ogawa, Nobutoshi Fujii, Shunsuke Furuse, Masaya Nagata, Yuichi Yamamoto
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Publication number: 20180197906Abstract: There is provided semiconductor devices and methods of forming the same, including: a first substrate; and a second substrate adjacent to the first substrate, where a side wall of the second substrate includes one or more diced portions that can include a blade diced portion and a stealth diced portion; and also imaging devices and methods of forming the same, including: a first substrate; a transparent layer; an adhesive layer between the first substrate and the transparent layer; a second substrate, where the first substrate is disposed between the adhesive layer and the second substrate; and a groove extending from the adhesive layer to the second substrate, where the groove is filled with the adhesive layer.Type: ApplicationFiled: July 19, 2016Publication date: July 12, 2018Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATIONInventors: Masanari YAMAGUCHI, Taizo TAKACHI, Shunsuke FURUSE, Takashi OINOUE, Yuki IKEBE