Abstract: An electronic control device of the invention having a multiple of power supply system lines, with an object of providing a device such that no circulation path is formed in a ground line, includes a power supply in which a multiple of power supply system lines are provided, a multiple of drive units to which the power is independently supplied from the power supply system lines, and at least one controller that outputs control signals to the multiple of drive units, and is configured so that negative side lines of the power supply system lines are connected by one ground line in the controller.

Abstract: A semiconductor device includes a first insulating resin member sealing a mounting surface of a lead frame, and a second insulating resin member sealing a heat dissipating surface. The second insulating resin member contains a filler having a maximum diameter of 0.02 mm to 0.075 mm. The second insulating resin member includes a thin molded portion formed in contact with the heat dissipating surface of the lead frame. The thin molded portion has a thickness 1.1 times to 2 times the maximum diameter of the filler. The semiconductor device includes, at an interface between the first insulating resin member and the second insulating resin member, a mixture layer in which these resins are mixed with each other.

Abstract: An electronic control device of the invention having a multiple of power supply system lines, with an object of providing a device such that no circulation path is formed in a ground line, includes a power supply in which a multiple of power supply system lines are provided, a multiple of drive units to which the power is independently supplied from the power supply system lines, and at least one controller that outputs control signals to the multiple of drive units, and is configured so that negative side lines of the power supply system lines are connected by one ground line in the controller.

Abstract: A semiconductor device includes a first insulating resin member sealing a mounting surface of a lead frame, and a second insulating resin member sealing a heat dissipating surface. The second insulating resin member contains a filler having a maximum diameter of 0.02 mm to 0.075 mm. The second insulating resin member includes a thin molded portion formed in contact with the heat dissipating surface of the lead frame. The thin molded portion has a thickness 1.1 times to 2 times the maximum diameter of the filler. The semiconductor device includes, at an interface between the first insulating resin member and the second insulating resin member, a mixture layer in which these resins are mixed with each other.

Abstract: In a rotary electric machine in which a controller and a heat sink are arranged in an extending direction of an output shaft of a motor, in order to provide a rotary electric machine which secures a heat rejection performance and an insulation performance of a semiconductor device to be mounted to the controller and is downsized as a whole, the controller includes a semiconductor device having a drive circuit provided so as to correspond to a stator winding of the motor, and the semiconductor device has a main face held in close contact with the heat sink. On a close contact face between the semiconductor device and the heat sink, a drive circuit is formed so as to extend along an outer edge portion of the heat sink to increase a cooling area.

Abstract: Provided is an integrated electric power steering apparatus including a positive-side wiring pattern configured to connect a positive side of a power supply and a positive side of an inverter circuit and a negative-side wiring pattern configured to connect a negative side of the power supply and a negative side of the inverter circuit, in which one of the wiring patterns is formed on a central side of a wiring board and another of the wiring patterns is formed on an outer periphery side of the wiring board. A plurality of switching elements forming the inverter circuit are mounted between the positive-side wiring pattern and the negative-side wiring pattern formed on the wiring board.

Abstract: In an electric driving apparatus, a sensor magnet is fixed to a first end portion of a rotary shaft of a motor. A sensor device includes a rotation sensor that detects a magnetic field generated by the sensor magnet. The rotation sensor opposes the sensor magnet in an axial direction of the rotary shaft. A control unit mounted on the motor includes an inverter circuit that is connected to an armature winding of the motor via a plurality of feeder wires. The inverter circuit is disposed in a position further from the sensor magnet than the rotation sensor in the axial direction of the rotary shaft. A shield plate formed from a magnetic material is disposed between the rotation sensor and the inverter circuit.

Abstract: In a rotary electric machine in which a controller and a heat sink are arranged in an extending direction of an output shaft of a motor, in order to provide a rotary electric machine which secures a heat rejection performance and an insulation performance of a semiconductor device to be mounted to the controller and is downsized as a whole, the controller includes a semiconductor device having a drive circuit provided so as to correspond to a stator winding of the motor, and the semiconductor device has a main face held in close contact with the heat sink. On a close contact face between the semiconductor device and the heat sink, a drive circuit is formed so as to extend along an outer edge portion of the heat sink to increase a cooling area.

Abstract: Provided is a semiconductor module having an integrated insulating sheet structure, wherein detachment of the insulating sheet can be suppressed and improved reliability of the semiconductor module is achieved, by adopting a structure in which at least one location of the insulating sheet is sunken inside a mold, and a sealing resin body and the insulating sheet of the semiconductor module form a protrusion.

Abstract: In a semiconductor device, a thinly-molded portion covering a whole of a heat dissipating surface portion of a lead frame and a die pad space filled portion are integrally molded from a second mold resin, because of which adhesion between the thinly-molded portion and lead frame improves owing to the die pad space filled portion adhering to a side surface of the lead frame. Also, as the thinly-molded portion is partially thicker owing to the die pad space filled portion, strength of the thinly-molded portion increases, and a deficiency or cracking is unlikely to occur.

Abstract: In a semiconductor device, a first skirt portion molded from a first mold resin and a second skirt portion molded from a second mold resin are provided on a heat dissipating surface of a lead frame. Also, a thinly-molded portion is molded integrally with the second skirt portion from the second mold resin. According to this kind of configuration, adhesion between the thinly-molded portion and lead frame is high, and the semiconductor device with excellent heat dissipation and insulation is obtained.

Abstract: Provided is an integrated electric power steering apparatus including a positive-side wiring pattern configured to connect a positive side of a power supply and a positive side of an inverter circuit and a negative-side wiring pattern configured to connect a negative side of the power supply and a negative side of the inverter circuit, in which one of the wiring patterns is formed on a central side of a wiring board and another of the wiring patterns is formed on an outer periphery side of the wiring board. A plurality of switching elements forming the inverter circuit are mounted between the positive-side wiring pattern and the negative-side wiring pattern formed on the wiring board.

Abstract: A semiconductor module forming a semiconductor device includes lead frames in which switching elements are mounted on the side of upper surfaces and heat radiation surfaces are formed on the side of lower surfaces, and bus bars disposed on the lead frames and connecting between plural switching elements. The heat radiation surfaces of the lead frames are arranged on one plane and upper surfaces of flat surface portions of the bus bars are arranged on one plane, therefore, a layout property on the heat radiation surfaces or the upper surfaces the flat surface portions is good, which facilitates creation of a heat radiation structure and so on.

Abstract: A semiconductor module can be realized, which is formed by mounting an electronic component and a bus bar by solder on a lead frame including a plurality of terminals, wherein a solder flow suppressing section capable of restricting a direction of flow of solder on the lead frame is formed in the vicinity of the solder portion of the component mounted by solder, and by this configuration, positional deviation, such as rotation or movement of the mounted component, is suppressed and the size of the module can be made compact.

Abstract: In an electric driving apparatus, a sensor magnet is fixed to a first end portion of a rotary shaft of a motor. A sensor device includes a rotation sensor that detects a magnetic field generated by the sensor magnet. The rotation sensor opposes the sensor magnet in an axial direction of the rotary shaft. A control unit mounted on the motor includes an inverter circuit that is connected to an armature winding of the motor via a plurality of feeder wires. The inverter circuit is disposed in a position further from the sensor magnet than the rotation sensor in the axial direction of the rotary shaft. A shield plate formed from a magnetic material is disposed between the rotation sensor and the inverter circuit.

Abstract: In a semiconductor device, a thinly-molded portion covering a whole of a heat dissipating surface portion of a lead frame and a die pad space filled portion are integrally molded from a second mold resin, because of which adhesion between the thinly-molded portion and lead frame improves owing to the die pad space filled portion adhering to a side surface of the lead frame. Also, as the thinly-molded portion is partially thicker owing to the die pad space filled portion, strength of the thinly-molded portion increases, and a deficiency or cracking is unlikely to occur.

Abstract: In a semiconductor device, a first skirt portion molded from a first mold resin and a second skirt portion molded from a second mold resin are provided on a heat dissipating surface of a lead frame. Also, a thinly-molded portion is molded integrally with the second skirt portion from the second mold resin. According to this kind of configuration, adhesion between the thinly-molded portion and lead frame is high, and the semiconductor device with excellent heat dissipation and insulation is obtained.

Abstract: A semiconductor module forming a semiconductor device includes lead frames in which switching elements are mounted on the side of upper surfaces and heat radiation surfaces are formed on the side of lower surfaces, and bus bars disposed on the lead frames and connecting between plural switching elements. The heat radiation surfaces of the lead frames are arranged on one plane and upper surfaces of flat surface portions of the bus bars are arranged on one plane, therefore, a layout property on the heat radiation surfaces or the upper surfaces the flat surface portions is good, which facilitates creation of a heat radiation structure and so on.

Abstract: A semiconductor module can be realized, which is formed by mounting an electronic component and a bus bar by solder on a lead frame including a plurality of terminals, wherein a solder flow suppressing section capable of restricting a direction of flow of solder on the lead frame is formed in the vicinity of the solder portion of the component mounted by solder, and by this configuration, positional deviation, such as rotation or movement of the mounted component, is suppressed and the size of the module can be made compact.

Abstract: Provided is a semiconductor module having an integrated insulating sheet structure, wherein detachment of the insulating sheet can be suppressed and improved reliability of the semiconductor module is achieved, by adopting a structure in which at least one location of the insulating sheet is sunken inside a mold, and a sealing resin body and the insulating sheet of the semiconductor module form a protrusion.