Patents by Inventor Shunsuke Ishikawa

Shunsuke Ishikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120084328
    Abstract: Generation of a search query to be issued to a document search engine is supported by providing a GUI creation unit that generates a graphical user interface for supporting generation of a search query. The GUI creation unit generates a query-node creation window that is a GUI window for generating a new search word to be connected to a search query by a logical operator. The query-node creation window includes a sample-document preview area that displays a sample document, a facet list area that displays facets extracted from the sample document in list form, a query-node creation assist area to assist generation of the new search word, and a logical-operator selection icon to select a logical operator that connects the generated search word.
    Type: Application
    Filed: September 20, 2011
    Publication date: April 5, 2012
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Shunsuke Ishikawa, Keisuke Nitta, Takuya Tejima
  • Publication number: 20100252144
    Abstract: There is provided a soldering flux in which the volatilized amount in reflow is reduced to enable soldering with a smaller environmental load while suppressing the stickiness of the flux residue and ensuring a high reliability. A solder paste composition using the same is also provided. The soldering flux comprises a base resin, an activating agent, and a solvent, wherein the solvent comprises an oil component having an iodine value of 120 to 170. Preferably, the content of the oil component is 22 to 80% by weight relative to the whole flux. Also, the oil component preferably contains at least one of drying oil and semidrying oil, and more preferably contains one or more kinds selected from tung oil, poppy-seed oil, walnut oil, safflower oil, sunflower oil, and soy bean oil. The solder paste composition comprises the soldering flux described above and a solder alloy powder.
    Type: Application
    Filed: November 25, 2008
    Publication date: October 7, 2010
    Applicant: Harima Chemicals, Inc.
    Inventors: Shunsuke Ishikawa, Akira Shinozuka, Masami Aihara
  • Publication number: 20100243717
    Abstract: Provided is a soldering flux in which the volatilized amount in reflowing is reduced to enable soldering with a small environmental load while suppressing the stickiness of the flux residue to ensure a high reliability, as well as a solder paste composition and a soldering method using the same. The soldering flux comprises a base resin, an activating agent, and a solvent, wherein the solvent comprises an organic acid anhydride being liquid form at 20° C. or higher and a polyhydric alcohol being liquid form at 20° C. or higher, and when the acid value and the content of the organic acid anhydride is AV (mgKOH/g) and WA(g), respectively, and the hydroxyl value and the content of the polyhydric alcohol is OHV (mgKOH/g) and WOH(g), respectively, then AV×WA:OHV×WOH=1:0.4 to 0.6.
    Type: Application
    Filed: November 25, 2008
    Publication date: September 30, 2010
    Applicant: Harima Chemicals, Inc
    Inventors: Shunsuke Ishikawa, Akira Shinozuka, Masami Aihara
  • Patent number: 7669752
    Abstract: A flux contains resin having film forming ability, activator, solvent and at least one complex selected from silver complex and copper complex. The flux is used when soldering is performed onto a circuit having electroless nickel plating or further having gold plating on the electroless nickel plating. Allowing a barrier layer of silver or copper to deposit on the surfaces of lands suppresses the diffusion of nickel into the melted solder alloy during soldering, and also prevents phosphorous concentration. This improves the bonding strength of soldering and suppresses the reduction deposition of silver and/or copper to portions other than circuit patterns.
    Type: Grant
    Filed: June 22, 2007
    Date of Patent: March 2, 2010
    Assignee: Harima Chemicals, Inc.
    Inventors: Kazuki Ikeda, Shunsuke Ishikawa, Takaaki Anada, Keigo Obata, Takao Takeuchi, Naoya Inoue
  • Publication number: 20070241170
    Abstract: A flux contains resin having film forming ability, activator, solvent and at least one complex selected from silver complex and copper complex. The flux is used when soldering is performed onto a circuit having electroless nickel plating or further having gold plating on the electroless nickel plating. Allowing a barrier layer of silver or copper to deposit on the surfaces of lands suppresses the diffusion of nickel into the melted solder alloy during soldering, and also prevents phosphorous concentration. This improves the bonding strength of soldering and suppresses the reduction deposition of silver and/or copper to portions other than circuit patterns.
    Type: Application
    Filed: June 22, 2007
    Publication date: October 18, 2007
    Inventors: Kazuki Ikeda, Shunsuke Ishikawa, Takaaki Anada, Keigo Obata, Takao Takeuchi, Naoya Inoue
  • Publication number: 20060147683
    Abstract: A flux contains resin having film forming ability, activator, solvent, and at least one complex selected from silver complex and copper complex. The flux is used when soldering is performed onto a circuit having electroless nickel plating or further having gold plating on the electroless nickel plating. Allowing a barrier layer of silver or copper to deposit on the surfaces of lands suppresses the diffusion of nickel into the melted solder alloy during soldering, and also prevents phosphorous concentration. This improves the bonding strength of soldering and suppresses the reduction deposition of silver and/or copper to portions other than circuit patterns.
    Type: Application
    Filed: December 30, 2004
    Publication date: July 6, 2006
    Inventors: Kazuki Ikeda, Shunsuke Ishikawa, Takaaki Anada, Keigo Obata, Takao Takeuchi, Naoya Inoue