Patents by Inventor Shunsuke KOGOI

Shunsuke KOGOI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160338193
    Abstract: A multilayer board disclosed herein includes: a plurality of insulating layers made of a thermosetting resin and stacked on one another, each insulating layer being provided with a via hole; a plurality of wiring each formed between the insulating layers and including an inclined side surface; and a conductive via made of a cured product of conductive paste filled in the via hole and connecting the vertically adjacent wiring to each other. Here, orientations of the inclined side surfaces are alternately changed from the wiring to the wiring.
    Type: Application
    Filed: April 15, 2016
    Publication date: November 17, 2016
    Applicant: FUJITSU LIMITED
    Inventors: Junichi Kanai, Yasuhiro Karahashi, Hirofumi Kobayashi, Shunsuke KOGOI, Junichi Murayama, Koji Komemura, Hidehiko Fujisaki