Abstract: A substrate cleaning apparatus comprises: a cleaning member 11,21 that comes into contact with a substrate W and cleans the substrate W; a member rotating unit 15, 25 that rotates the cleaning member 11, 21; a pressing drive unit 19, 29 that presses the cleaning member 11, 21 against the substrate W; a torque detecting unit 16, 26 for detecting torque applied to the member rotating unit 15, 25; and a control unit 50 that controls pressing force on the basis of a result of detection by the torque detecting unit 16, 26.

Abstract: It is an object of the embodiment of the invention to enhance the work efficiency of a substrate transfer test between a plurality of units. A test control section (CPU) which is provided in a loading/unloading unit 2 performs a substrate transfer test for the loading/unloading unit 2 alone by receiving a wafer mounted on a substrate table 2300 or 2400 which is installed outside the loading/unloading unit 2 and transporting the wafer into the loading/unloading unit 2 by a transport mechanism or transporting a wafer placed in the loading/unloading unit 2 to a substrate table 2200 and mounting the wafer on the substrate table 2200 by the transport mechanism while the loading/unloading unit 2 is not assembled together with the cleaning unit and the polishing unit.

Abstract: A substrate cleaning apparatus comprises: a cleaning member 11,21 that comes into contact with a substrate W and cleans the substrate W; a member rotating unit 15, 25 that rotates the cleaning member 11, 21; a pressing drive unit 19, 29 that presses the cleaning member 11, 21 against the substrate W; a torque detecting unit 16, 26 for detecting torque applied to the member rotating unit 15, 25; and a control unit 50 that controls pressing force on the basis of a result of detection by the torque detecting unit 16, 26.

Abstract: It is an object of the embodiment of the invention to enhance the work efficiency of a substrate transfer test between a plurality of units. A test control section (CPU) which is provided in a loading/unloading unit 2 performs a substrate transfer test for the loading/unloading unit 2 alone by receiving a wafer mounted on a substrate table 2300 or 2400 which is installed outside the loading/unloading unit 2 and transporting the wafer into the loading/unloading unit 2 by a transport mechanism or transporting a wafer placed in the loading/unloading unit 2 to a substrate table 2200 and mounting the wafer on the substrate table 2200 by the transport mechanism while the loading/unloading unit 2 is not assembled together with the cleaning unit and the polishing unit.