Patents by Inventor Shunsuke Mikuriya
Shunsuke Mikuriya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240055262Abstract: Provided is a method capable of efficiently polishing the front and back sides of a carrier plate unused after manufacture, which is used in a double-sided polishing process for semiconductor wafers. The method comprises: sandwiching a carrier plate unused after manufacture and to be polished between an upper surface plate and a lower surface plate in the double-sided polishing apparatus, and supplying a polishing liquid while relatively rotating the carrier plate to be polished, the upper surface plate, and the lower surface plate to polish both sides of the carrier plate to be polished, wherein a polishing pad including, on its surface, an abrasive grain-containing layer in which abrasive grains of 2 ?m or more in grain size are embedded is used as a polishing pad in a double-sided polishing apparatus.Type: ApplicationFiled: November 19, 2021Publication date: February 15, 2024Applicant: SUMCO CorporationInventors: Shunsuke MIKURIYA, Shinya TAKUBO
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Patent number: 11772231Abstract: Provided is a double-sided polishing method of a wafer in which the wafer, which has been set in a wafer loading hole of the carrier, is compressed and held along with the carrier with an upper platen and a lower platen and the upper platen and the lower platen are rotated while supplying slurry to the wafer. The method includes: previously measuring an inclination value of a main surface of each of a plurality of carriers in the vicinity of the edge of the wafer loading hole; selecting, from among the plurality of carriers, those for which the inclination value is equal to or smaller than a threshold based on the measurement results of the inclination value; and applying the double-sided polishing to a wafer using the selected carrier.Type: GrantFiled: May 23, 2017Date of Patent: October 3, 2023Assignee: SUMCO CORPORATIONInventors: Shunsuke Mikuriya, Tomonori Miura
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Patent number: 11170988Abstract: Provided is a method of double-side polishing a silicon wafer using a double-side polishing apparatus, the method including in succession: a first polishing step of performing double-side polishing while supplying a first polishing agent that is an alkaline aqueous solution containing abrasive grains to the polishing cloths; a polishing agent switching step of stopping the supply of the first polishing agent and starting the supply of a second polishing agent that is an alkaline aqueous solution containing a water-soluble polymer with no abrasive grains, with the polishing cloths of the upper plate and the lower plate being in contact with the front surface and the back surface of the silicon wafer, respectively and with the upper plate and the lower plate being continuously rotated; and a second polishing step of performing double-side polishing while supplying the second polishing agent to the polishing cloths.Type: GrantFiled: August 31, 2017Date of Patent: November 9, 2021Assignee: SUMCO CORPORATIONInventors: Ryuichi Tanimoto, Ichiro Yamazaki, Shunsuke Mikuriya
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Patent number: 11127584Abstract: Provided a method of producing a carrier which make it possible to prevent the reduction in the flatness of a semiconductor wafer even if the semiconductor wafer is subjected to repeated double-side polishing procedures. The method of producing a carrier including a metal portion and a ring-shaped resin portion includes: a preparation step of preparing the metal portion and the resin portion (Step S1); a placement step of placing the resin portion in the retainer opening in the metal portion (Step S2); and a resin portion polishing step of polishing both surface of the resin portion (Step S4). The method includes, prior to the resin portion polishing step (Step S4), a production stage swelling step of swelling the resin portion placed in the retainer opening in the metal portion by impregnating the resin portion with a first liquid (Step S3).Type: GrantFiled: August 14, 2018Date of Patent: September 21, 2021Assignee: SUMCO CORPORATIONInventors: Shunsuke Mikuriya, Tomonori Miura
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Publication number: 20200365387Abstract: Provided a method of producing a carrier which make it possible to prevent the reduction in the flatness of a semiconductor wafer even if the semiconductor wafer is subjected to repeated double-side polishing procedures. The method of producing a carrier including a metal portion and a ring-shaped resin portion includes: a preparation step of preparing the metal portion and the resin portion (Step S1); a placement step of placing the resin portion in the retainer opening in the metal portion (Step S2); and a resin portion polishing step of polishing both surface of the resin portion (Step S4). The method includes, prior to the resin portion polishing step (Step S4), a production stage swelling step of swelling the resin portion placed in the retainer opening in the metal portion by impregnating the resin portion with a first liquid (Step S3).Type: ApplicationFiled: August 14, 2018Publication date: November 19, 2020Applicant: SUMCO CORPORATIONInventors: Shunsuke MIKURIYA, Tomonori MIURA
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Publication number: 20200185215Abstract: Provided is a method of double-side polishing a silicon wafer using a double-side polishing apparatus, the method including in succession: a first polishing step of performing double-side polishing while supplying a first polishing agent that is an alkaline aqueous solution containing abrasive grains to the polishing cloths; a polishing agent switching step of stopping the supply of the first polishing agent and starting the supply of a second polishing agent that is an alkaline aqueous solution containing a water-soluble polymer with no abrasive grains, with the polishing cloths of the upper plate and the lower plate being in contact with the front surface and the back surface of the silicon wafer, respectively and with the upper plate and the lower plate being continuously rotated; and a second polishing step of performing double-side polishing while supplying the second polishing agent to the polishing cloths.Type: ApplicationFiled: August 31, 2017Publication date: June 11, 2020Applicant: SUMCO CORPORATIONInventors: Ryuichi TANIMOTO, Ichiro YAMAZAKI, Shunsuke MIKURIYA
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Publication number: 20190160627Abstract: Provided is a double-sided polishing method of a wafer in which the wafer, which has been set in a wafer loading hole of the carrier, is compressed and held along with the carrier with an upper platen and a lower platen and the upper platen and the lower platen are rotated while supplying slurry to the wafer. The method includes: previously measuring an inclination value of a main surface of each of a plurality of carriers in the vicinity of the edge of the wafer loading hole; selecting, from among the plurality of carriers, those for which the inclination value is equal to or smaller than a threshold based on the measurement results of the inclination value; and applying the double-sided polishing to a wafer using the selected carrier.Type: ApplicationFiled: May 23, 2017Publication date: May 30, 2019Applicant: SUMCO CORPORATIONInventors: Shunsuke MIKURIYA, Tomonori MIURA
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Patent number: 8932952Abstract: Disclosed is a method for polishing a silicon wafer, wherein a surface to be polished of a silicon wafer is rough polished, while supplying a polishing liquid, which is obtained by adding a water-soluble polymer to an aqueous alkaline solution that contains no free abrasive grains, to a polishing cloth. Consequently, the surface to be polished can be polished at high polishing rate and the flatness of the edge portion including roll-off and roll-up can be controlled.Type: GrantFiled: March 23, 2011Date of Patent: January 13, 2015Assignee: Sumco CorporationInventors: Shinichi Ogata, Ryuichi Tanimoto, Ichiro Yamasaki, Shunsuke Mikuriya
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Patent number: 8900033Abstract: An object of the present invention is to provide a method of polishing silicon wafers, capable of suppressing generation of undesired sounds from carriers and reducing the thickness variation of the wafers after polished. The method is a wafer polishing method in which wafers 20 are polished by supplying a polishing solution to surfaces 30a of a pair of polishing pads 30 positioned above and below carriers 10 each having a circular hole 11 for retaining the wafers 20, the carriers 10 being thinner than the wafers 20; and sliding the polishing pads 30 relatively to the carriers 10, thereby simultaneously polishing both surfaces of the wafers 20 retained in the carriers 10. The method is characterized in that information sourced from the carriers 10 when a difference between the thickness of the carriers 10 and the thickness of the wafers 20 reaches a predetermined value is detected to calculate the thickness of the wafers 20, thereby terminating polishing.Type: GrantFiled: November 30, 2010Date of Patent: December 2, 2014Assignee: Sumco CorporationInventors: Kazushige Takaishi, Keiichi Takanashi, Tetsurou Taniguchi, Shinichi Ogata, Shunsuke Mikuriya
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Patent number: 8728942Abstract: Mirror-polishing a front surface of a silicon wafer using polishing liquid composed of an abrasive grain-free alkaline solution including water-soluble polymers simplifies a polishing process, thus leading to an increase in productivity and a reduction in cost, and reduces the density of LPDs attributable to processing and occurring in the front surface of a mirror-polished wafer, thus improving the surface roughness of the wafer front surface.Type: GrantFiled: August 20, 2010Date of Patent: May 20, 2014Assignee: Sumico CorporationInventors: Shinichi Ogata, Kazushige Takaishi, Hironori Nishimura, Shigeru Okuuchi, Shunsuke Mikuriya, Yuichi Nakayoshi
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Publication number: 20130032573Abstract: Disclosed is a method for polishing a silicon wafer, wherein a surface to be polished of a silicon wafer is rough polished, while supplying a polishing liquid, which is obtained by adding a water-soluble polymer to an aqueous alkaline solution that contains no free abrasive grains, to a polishing cloth. Consequently, the surface to be polished can be polished at high polishing rate and the flatness of the edge portion including roll-off and roll-up can be controlled.Type: ApplicationFiled: March 23, 2011Publication date: February 7, 2013Applicant: SUMCO CORPORATIONInventors: Shinichi Ogata, Ryuichi Tanimoto, Ichiro Yamasaki, Shunsuke Mikuriya
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Publication number: 20130017763Abstract: An object of the present invention is to provide a method of polishing silicon wafers, capable of suppressing generation of undesired sounds from carriers and reducing the thickness variation of the wafers after polished. The method is a wafer polishing method in which wafers 20 are polished by supplying a polishing solution to surfaces 30a of a pair of polishing pads 30 positioned above and below carriers 10 each having a circular hole 11 for retaining the wafers 20, the carriers 10 being thinner than the wafers 20; and sliding the polishing pads 30 relatively to the carriers 10, thereby simultaneously polishing both surfaces of the wafers 20 retained in the carriers 10. The method is characterized in that information sourced from the carriers 10 when a difference between the thickness of the carriers 10 and the thickness of the wafers 20 reaches a predetermined value is detected to calculate the thickness of the wafers 20, thereby terminating polishing.Type: ApplicationFiled: November 30, 2010Publication date: January 17, 2013Inventors: Kazushige Takaishi, Keiichi Takanashi, Tetsurou Taniguchi, Shinichi Ogata, Shunsuke Mikuriya
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Publication number: 20120156878Abstract: Mirror-polishing a front surface of a silicon wafer using polishing liquid composed of an abrasive grain-free alkaline solution including water-soluble polymers simplifies a polishing process, thus leading to an increase in productivity and a reduction in cost, and reduces the density of LPDs attributable to processing and occurring in the front surface of a mirror-polished wafer, thus improving the surface roughness of the wafer front surface.Type: ApplicationFiled: August 20, 2010Publication date: June 21, 2012Applicant: SUMCO CORPORATIONInventors: Shinichi Ogata, Kazushige Takaishi, Hironori Nishimura, Shigeru Okuuchi, Shunsuke Mikuriya, Yuichi Nakayoshi