Patents by Inventor Shunsuke Nukina

Shunsuke Nukina has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multilayer wiring board with metal foil wiring layer, wire wiring layer, and interlayer conduction hole
    Patent number: 9668345
    Abstract: A multilayer wiring board includes a first metal foil wiring layer that has at least two or more layers of metal foil wiring lines and is arranged on a mounting surface side for mounting a surface mount type component, a wire wiring layer that is arranged on an opposite side of the mounting surface, and in which an insulation coating wire is wired, and a first interlayer conduction hole that has a conduction part which electrically connects the metal foil wiring line positioned on a surface of the first metal foil wiring layer to at least one of the metal foil wiring line in an inner layer of the first metal foil wiring layer and the insulation coating wire of the wire wiring layer. A hole diameter of the first interlayer conduction hole varies in a board thickness direction of the multilayer wiring board.
    Type: Grant
    Filed: March 27, 2013
    Date of Patent: May 30, 2017
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Hiroyuki Yamaguchi, Seiichi Kurihara, Hiroshi Sakurai, Shunsuke Nukina
  • MULTILAYER WIRING BOARD
    Publication number: 20150075843
    Abstract: A multilayer wiring board includes a first metal foil wiring layer that has at least two or more layers of metal foil wiring lines and is arranged on a mounting surface side for mounting a surface mount type component, a wire wiring layer that is arranged on an opposite side of the mounting surface, and in which an insulation coating wire is wired, and a first interlayer conduction hole that has a conduction part which electrically connects the metal foil wiring line positioned on a surface of the first metal foil wiring layer to at least one of the metal foil wiring line in an inner layer of the first metal foil wiring layer and the insulation coating wire of the wire wiring layer. A hole diameter of the first interlayer conduction hole varies in a board thickness direction of the multilayer wiring board.
    Type: Application
    Filed: March 27, 2013
    Publication date: March 19, 2015
    Inventors: Hiroyuki Yamaguchi, Seiichi Kurihara, Hiroshi Sakurai, Shunsuke Nukina