Abstract: An optical data link 20 comprises a mounting member 22, an optical element assembly 24, a circuit board 26, and a spacer 32. The PGA substrate 22 has a substrate 22a and a plurality of electrically conductive pins 22b. The circuit board 26 has a pair of surfaces. Electronic components 34a to 34e are mounted on the pair of surfaces. The optical element assembly 24 includes a semiconductor optical element 24f. The semiconductor optical element 24f is connected to an electrically conductive layer on the circuit board 26. The spacer 32 functions so as to distance the circuit board 26 from the PGA substrate 22. Since the circuit board 26 is distanced from the PGA substrate 22, the electronic components 34a to 34e can be mounted on both surfaces of the circuit board 22.

Abstract: An optical connection sleeve 1 for optically connecting an optical fiber 41 and an optical device 51 is constituted by a resin sleeve 15 including an end portion 10 in which a ferrule 40 is inserted and a metal sleeve 16 including an end portion 12 on which the optical device 51 is disposed, the metal sleeve 16 being insert-molded in the resin sleeve 15 to be fixed thereto. With such a constitution, occurrence of positional deviation between the sleeve 1 and an optical device unit 50 is prevented, and the optical fiber 41 and the optical device 51 can be optically connected surely. Furthermore, it is prevented that the sleeve portion extending cylindrically functions as an antenna for electromagnetic noises.

Abstract: An optical data link comprises a housing, a circuit board, a semiconductor electrical device, an electrically insulating sealing resin, an optical subassembly, a first heat spreader, and a second heat spreader. The circuit board is provided in the housing. The semiconductor electrical device is provided on the circuit board. The electrically insulating sealing resin covers the semiconductor electrical device. The optical subassembly is supported by the housing. The optical subassembly includes a semiconductor optical device. The semiconductor optical device is connected to the semiconductor electrical device through the circuit board. The first heat spreader is provided between the housing and the semiconductor electrical device and is in contact with the housing. The second heat spreader is provided between the housing and the optical subassembly and is in contact with the housing and the optical subassembly. The second heat spreader is located apart from the first heat spreader.

Abstract: An optical data link 20 comprises a mounting member 22, an optical element assembly 24, a circuit board 26, and a spacer 32. The PGA substrate 22 has a substrate 22a and a plurality of electrically conductive pins 22b. The circuit board 26 has a pair of surfaces. Electronic components 34a to 34e are mounted on the pair of surfaces. The optical element assembly 24 includes a semiconductor optical element 24f. The semiconductor optical element 24f is connected to an electrically conductive layer on the circuit board 26. The spacer 32 functions so as to distance the circuit board 26 from the PGA substrate 22. Since the circuit board 26 is distanced from the PGA substrate 22, the electronic components 34a to 34e can be mounted on both surfaces of the circuit board 22.

Abstract: A resin sleeve is used as an optical connection sleeve 1 for optically connecting an optical fiber 41 with an optical component. A ferrule fixing surface 21 provided on an inner peripheral surface of a ferrule insertion portion 2 of the sleeve 1 is formed to have a multifaceted shape in which a cross section thereof on a plane vertical to an optical axis A thereof has a hexagonal shape. A ferrule 40 can be positioned and fixed accurately by a tight fit utilizing elastic deformation of resin. An outer peripheral surface of the ferrule 40 and the ferrule fixing surface 21 come into line contact with each other, and thus detachability of the ferrule 40 is enhanced. Therefore, an optical fiber ferrule can be held accurately, and the optical connection sleeve having a satisfactory detachability, an optical module using the same and an optical communication module are realized.

Abstract: An optical data link 20 comprises a mounting member 22, an optical element assembly 24, a circuit board 26, and a spacer 32. The PGA substrate 22 has a substrate 22a and a plurality of electrically conductive pins 22b. The circuit board 26 has a pair of surfaces. Electronic components 34a to 34c are mounted on the pair of surfaces. The optical element assembly 24 includes a semiconductor optical element 24f. The semiconductor optical element 24f is connected to an electrically conductive layer on the circuit board 26. The spacer 32 functions so as to distance the circuit board 26 from the PGA substrate 22. Since the circuit board 26 is distanced from the PGA substrate 22, the electronic components 34a to 34e can be mounted on both surfaces of the circuit board 22.

Abstract: A tuning-fork crystal wafer 1A which has legs 11, 12 with grooves 11c, 12c is shaped by etching of a crystal substrate 2. To improve processing precision of the depth of the grooves 11c, 12c, the width of the grooves 11c, 12c, is set in advance, based on the etch stop technique in which the amount of etching depends on the pattern of an etch portion. Consequently, as far as the etch time satisfies a required minimum time, it is possible to obtain the depth as designed.

Abstract: An optical module is inserted into a cage containing a connector electrically connected to a conductive wiring on a host board. The cage, the connector and the conductive wiring is provided on the host board. The optical module includes a circuit board and a housing. The circuit board has a card edge connector at an edge thereof. The card edge connector mates with the connector on the host board. The housing has a conductive ceiling with a rear edge and builds the circuit board therein. The conductive ceiling has a stopper supported thereby and protrudes therefrom. The stopper extrudes from the edge of the circuit board and the rear edge of the conductive ceiling.

Abstract: An optical data link comprises a housing, a circuit board, a semiconductor electrical device, an electrically insulating sealing resin, an optical subassembly, a first heat spreader, and a second heat spreader. The circuit board is provided in the housing. The semiconductor electrical device is provided on the circuit board. The electrically insulating sealing resin covers the semiconductor electrical device. The optical subassembly is supported by the housing. The optical subassembly includes a semiconductor optical device. The semiconductor optical device is connected to the semiconductor electrical device through the circuit board. The first heat spreader is provided between the housing and the semiconductor electrical device and is in contact with the housing. The second heat spreader is provided between the housing and the optical subassembly and is in contact with the housing and the optical subassembly. The second heat spreader is located apart from the first heat spreader.

Abstract: An optical connection sleeve 1 for optically connecting an optical fiber 41 and an optical device 51 is constituted by a resin sleeve 15 including an end portion 10 in which a ferrule 40 is inserted and a metal sleeve 16 including an end portion 12 on which the optical device 51 is disposed, the metal sleeve 16 being insert-molded in the resin sleeve 15 to be fixed thereto. With such a constitution, occurrence of positional deviation between the sleeve 1 and an optical device unit 50 is prevented, and the optical fiber 41 and the optical device 51 can be optically connected surely. Furthermore, it is prevented that the sleeve portion extending cylindrically functions as an antenna for electromagnetic noises.

Abstract: A resin sleeve is used as an optical connection sleeve 1 for optically connecting an optical fiber 41 with an optical component such as an optical device 51. Then, a ferrule fixing surface 21 provided on an inner peripheral surface of a ferrule insertion portion 2 of the sleeve 1 is formed to have a multifaceted shape in which a cross section thereof on a plane vertical to an optical axis A thereof has a hexagonal shape. Accordingly, a ferrule 40 can be positioned and fixed with high accuracy by a tight fit utilizing elastic deformation of resin. Moreover, an outer peripheral surface of the ferrule 40 and the ferrule fixing surface 21 come into line contact with each other, and thus detachability of the ferrule 40 is enhanced. Therefore, an optical fiber ferrule can be held with high accuracy, and the optical connection sleeve having a satisfactory detachability, an optical module using the same and an optical communication module are realized.

Abstract: An optical part 25, which is used to be placed at an end face of an optical fiber, is constituted by a single light-transmitting material transparent to light transmitted through the optical fiber, and comprises an optical fiber contacting face 30 disposed in contact with the end face of the optical fiber, and an light emitting face 33 tilted with respect to a cross section perpendicular to the axis of the optical fiber. Since the light emitting face 33 is formed with an inclination, such an optical part 25 restrains reflected light occurring at the optical fiber end face from going back to the optical fiber. Also, since the optical part 25 is constituted by a single light-transmitting material, its configuration is simple, and the length can be shortened in the optical axis direction.

Abstract: One aspect of the present invention is an optical data link. The optical data link comprises a housing, first and second optical communication subassemblies, first and second substrates, and electronic components. The housing has a base portion which extends along a reference plane. The first and second optical communication subassemblies are contained in the housing. The first and second substrates are contained in the housing. The electronic components are electrically connected with the first optical communication subassembly, and are mounted on the first substrate. The electronic components are also electrically connected with the second optical communication subassembly and are mounted on the second substrate. The first substrate is inclined at a first angle with respect to another reference plane orthogonal to the first reference plane.

Abstract: An optical data link 20 comprises a mounting member 22, an optical element assembly 24, a circuit board 26, and a spacer 32. The PGA substrate 22 has a substrate 22a and a plurality of electrically conductive pins 22b. The circuit board 26 has a pair of surfaces. Electronic components 34a to 34c arc mounted on the pair of surfaces. The optical element assembly 24 includes a semiconductor optical element 24f. The semiconductor optical element 24f is connected to an electrically conductive layer on the circuit board 26. The spacer 32 functions so as to distance the circuit board 26 from the PGA substrate 22. Since the circuit board 26 is distanced from the PGA substrate 22, the electronic components 34a to 34e can be mounted on both surfaces of the circuit board 22.