Patents by Inventor Shunsuke Sone
Shunsuke Sone has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8997337Abstract: A manufacturing apparatus for an electronic component includes a plurality of press members provided with a pair of arm sections extending in one direction intersecting with a direction of the pressing, the plurality of press members contacting a housing of a connector and pressing a plurality of pins held by the housing toward a plurality of holes in a substrate, a drive unit pressing the press members and press-fitting the plurality of pins into the holes in the substrate, a stress measurement unit coupled with the pair of arm sections and adapted to measure a stress generated at the pair of arm sections when the pins are pressed toward the holes in the substrate, and a drive control unit controlling a press force of the drive unit in accordance with a measurement result of the stress measurement unit.Type: GrantFiled: September 15, 2010Date of Patent: April 7, 2015Assignee: Fujitsu LimitedInventors: Shunsuke Sone, Hirokazu Yamanishi
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Patent number: 8113560Abstract: A mounter apparatus includes a first block disposed so as to be able to be reciprocated by an actuator in a first direction, the first block has a conical hole having a conical internal wall and an axis parallel to the first direction, a second block disposed so as to face the first block and is held by the first block with an elastic body interposed between the first block and the second block, the second block moving by the actuator together with the first block in the first direction, the second block approaching the first block while compressing the elastic body, the second block moving away from the first block due to an elastic force of the elastic body, and a suction head portion rotatably held by the second block and has a suction nozzle on the opposite side from the side where the first block is disposed.Type: GrantFiled: January 18, 2011Date of Patent: February 14, 2012Assignee: Fujitsu LimitedInventor: Shunsuke Sone
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Publication number: 20110174941Abstract: A mounter apparatus includes a first block disposed so as to be able to be reciprocated by an actuator in a first direction, the first block has a conical hole having a conical internal wall and an axis parallel to the first direction, a second block disposed so as to face the first block and is held by the first block with an elastic body interposed between the first block and the second block, the second block moving by the actuator together with the first block in the first direction, the second block approaching the first block while compressing the elastic body, the second block moving away from the first block due to an elastic force of the elastic body, and a suction head portion rotatably held by the second block and has a suction nozzle on the opposite side from the side where the first block is disposed.Type: ApplicationFiled: January 18, 2011Publication date: July 21, 2011Applicant: FUJITSU LIMITEDInventor: Shunsuke SONE
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Publication number: 20110061225Abstract: A manufacturing apparatus for an electronic component includes a plurality of press members contacting a housing of a connector, pressing a plurality of pins held by the housing toward a plurality of holes in a substrate, and provided with a pair of arm sections extending in one direction intersecting with a direction of the pressing, a drive unit pressing the press members and press-fitting the plurality of pins into the holes in the substrate, a stress measurement unit provided to the respective arm sections and adapted to measure a stress generated when the pins are pressed toward the holes in the substrate, and a drive control unit controlling a press force of the drive unit in accordance with a measurement result of the stress measurement unit.Type: ApplicationFiled: September 15, 2010Publication date: March 17, 2011Applicant: FUJITSU LIMITEDInventors: Shunsuke Sone, Hirokazu Yamanishi
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Publication number: 20090241335Abstract: A wiring work support device includes a database storing information of an object lead or an object pad, an image input part taking an image of a printed-circuit board, a position specification part specifying a position of the object lead or the object pad on the printed-circuit board on the basis of information stored in the database and image data from the image input part and a position teaching part. The position teaching part superposes, marks and displays the position on the printed-circuit board, specified by the position specification part, on an actual printed-circuit board or an image in which the printed-circuit board is displayed.Type: ApplicationFiled: March 6, 2009Publication date: October 1, 2009Applicant: FUJITSU LIMITEDInventors: Shunsuke SONE, Hirokazu YAMANISHI
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Patent number: 7584532Abstract: An apparatus for processing a magnetic head slider used for a magnetic disk apparatus for performing a magnetic recording/reproducing process in a discoid recording medium. The apparatus for processing a magnetic head slider includes a discoid recording medium used as an abrasive material, a holding unit configured to hold a suspension arm on which a magnetic head slider is disposed, an elevating unit configured to bring the magnetic head slider into contact with the discoid recording medium in a sliding manner by elevating and lowering the discoid recording medium, and a rotating unit configured to rotate the discoid recording medium at a rotation speed lower than a rotation speed upon the magnetic recording/reproducing process.Type: GrantFiled: March 6, 2006Date of Patent: September 8, 2009Assignee: Fujitsu LimitedInventors: Shunsuke Sone, Hirokazu Yamanishi
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Patent number: 7534159Abstract: A processing method includes the steps of elastically deforming a jig together with a work, the jig having been mounted on a work, compressing the work against a polishing surface, and moving the work and the polishing surface relative to each other.Type: GrantFiled: March 31, 2005Date of Patent: May 19, 2009Assignee: Fujitsu LimitedInventors: Michinao Nomura, Yoshiaki Yanagida, Koji Sudo, Shunsuke Sone
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Patent number: 7525805Abstract: An electronic apparatus includes a housing, a first unit that is attached through a front side of the housing, a second unit that is attached through a backside of the housing, a panel that has a first surface connected to the first unit, and a second surface connected to the second unit, and establishes an electric connection between the first unit and the second unit, and a support member to which the panel is attached, the support member being movable relative to the housing in a side surface direction of the housing.Type: GrantFiled: September 27, 2007Date of Patent: April 28, 2009Assignee: Fujitsu LimitedInventors: Hirokazu Yamanishi, Shunsuke Sone
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Publication number: 20090052496Abstract: A temperature testing apparatus includes a housing, a first fan, a second fan, a heat source device, a module, and a test unit. The housing has an inlet and an outlet. The first fan is placed near the inlet and sucks air into the housing through the inlet. The second fan is placed near the outlet and exhausting the air out of the housing through the outlet. The heat source device provides hot air to the first fan. The module is installed into the housing and the module is placed at a position near the first fan. The module is placed on hot air path formed between the inlet and the outlet. And the test unit performs an evaluation test on the module.Type: ApplicationFiled: May 19, 2008Publication date: February 26, 2009Applicant: FUJITSU LIMITEDInventors: Shunsuke Sone, Hirokazu Yamanishi
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Publication number: 20080130220Abstract: An electronic apparatus includes a housing, a first unit that is attached through a front side of the housing, a second unit that is attached through a backside of the housing, a panel that has a first surface connected to the first unit, and a second surface connected to the second unit, and establishes an electric connection between the first unit and the second unit, and a support member to which the panel is attached, the support member being movable relative to the housing in a side surface direction of the housing.Type: ApplicationFiled: September 27, 2007Publication date: June 5, 2008Applicant: FUJITSU LIMITEDInventors: Hirokazu YAMANISHI, Shunsuke SONE
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Publication number: 20070135018Abstract: An apparatus for processing a magnetic head slider used for a magnetic disk apparatus for performing a magnetic recording/reproducing process in a discoid recording medium comprises a discoid recording medium used as an abrasive material, a holding unit configured to hold a suspension arm on which a magnetic head slider is disposed, an elevating unit configured to bring the magnetic head slider into contact with the discoid recording medium in a sliding manner by elevating and lowering the suspension arm, and a rotating unit configured to rotate the discoid recording medium at a rotation speed lower than a rotation speed upon the magnetic recording/reproducing process.Type: ApplicationFiled: March 6, 2006Publication date: June 14, 2007Applicant: FUJITSU LIMITEDInventors: Shunsuke Sone, Hirokazu Yamanishi
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Patent number: 7014532Abstract: A lapping machine comprises a lapping surface plate (1) rotated by a rotating mechanism, a lapping jig (28) having a plurality of projections to bottom surfaces of which a work (30) to be lapped by a lapping surface on the lapping surface plate (1) is fitted, amount-of-projection adjusting elements (29) for adjusting the variation of the plurality of projections (28c) to the lapping surface plate (1) individually, and a control circuit (36) for outputting variation-of-projection control signals to the variation-of-projection adjusting elements (29).Type: GrantFiled: April 13, 2004Date of Patent: March 21, 2006Assignee: Fujitsu LimitedInventors: Teruaki Nishioka, Kazuo Yokoi, Yoshiaki Yanagida, Shunsuke Sone
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Publication number: 20050186887Abstract: A processing method includes the steps of elastically deforming a jig together with a work, the jig having been mounted on a work, compressing the work against a polishing surface, and moving the work and the polishing surface relative to each other.Type: ApplicationFiled: March 31, 2005Publication date: August 25, 2005Applicant: FUJITSU LIMITEDInventors: Michinao Nomura, Yoshiaki Yanagida, Koji Sudo, Shunsuke Sone
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Patent number: 6913509Abstract: Disclosed herein is a method of polishing a workpiece having a plurality of resistance elements by operating a plurality of bend mechanisms to push/pull the workpiece with respect to a polishing surface. This method includes the steps of measuring a shape of the workpiece, calculating an operational amount of each bend mechanism according to the shape measured, pressing the workpiece on the polishing surface with the bend mechanisms according to the operational amount calculated, and updating the operational amount according to a working amount of the workpiece. According to this method, magnetic heads included in the workpiece can be stably polished.Type: GrantFiled: June 12, 2003Date of Patent: July 5, 2005Assignee: Fujitsu LimitedInventors: Shunsuke Sone, Yoshiaki Yanagida, Teruaki Nishioka, Koji Suto
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Publication number: 20040209546Abstract: A lapping machine comprises a lapping surface plate (1) rotated by a rotating mechanism, a lapping jig (28) having a plurality of projections to bottom surfaces of which a work (30) to be lapped by a lapping surface on the lapping surface plate (1) is fitted, amount-of-projection adjusting elements (29) for adjusting the variation of the plurality of projections (28c) to the lapping surface plate (1) individually, and a control circuit (36) for outputting variation-of-projection control signals to the variation-of-projection adjusting elements (29).Type: ApplicationFiled: April 13, 2004Publication date: October 21, 2004Applicant: Fujitsu LimitedInventors: Teruaki Nishioka, Kazuo Yokoi, Yoshiaki Yanagida, Shunsuke Sone
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Patent number: 6722947Abstract: A lapping machine comprises a lapping surface plate (1) rotated by a rotating mechanism, a lapping jig (28) having a plurality of projections to bottom surfaces of which a work (30) to be lapped by a lapping surface on the lapping surface plate (1) is fitted, amount-of-projection adjusting elements (29) for adjusting the variation of the plurality of projections (28c) to the lapping surface plate (1) individually, and a control circuit (36) for outputting variation-of-projection control signals to the variation-of-projection adjusting elements (29).Type: GrantFiled: September 10, 2001Date of Patent: April 20, 2004Assignee: Fujitsu LimitedInventors: Teruaki Nishioka, Kazuo Yokoi, Yoshiaki Yanagida, Shunsuke Sone, Koji Sudo, Tomokazu Sugiyama
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Publication number: 20030216106Abstract: Disclosed herein is a method of polishing a workpiece having a plurality of resistance elements by operating a plurality of bend mechanisms to push/pull the workpiece with respect to a polishing surface. This method includes the steps of measuring a shape of the workpiece, calculating an operational amount of each bend mechanism according to the shape measured, pressing the workpiece on the polishing surface with the bend mechanisms according to the operational amount calculated, and updating the operational amount according to a working amount of the workpiece. According to this method, magnetic heads included in the workpiece can be stably polished.Type: ApplicationFiled: June 12, 2003Publication date: November 20, 2003Applicant: Fujitsu LimitedInventors: Shunsuke Sone, Yoshiaki Yanagida, Teruaki Nishioka, Koji Suto
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Patent number: 6599170Abstract: Disclosed herein is a method of polishing a workpiece having a plurality of resistance elements by operating a plurality of bend mechanisms to push/pull the workpiece with respect to a polishing surface. This method includes the steps of measuring a shape of the workpiece, calculating an operational amount of each bend mechanism according to the shape measured, pressing the workpiece on the polishing surface with the bend mechanisms according to the operational amount calculated, and updating the operational amount according to a working amount of the workpiece. According to this method, magnetic heads included in the workpiece can be stably polished.Type: GrantFiled: December 13, 2000Date of Patent: July 29, 2003Assignee: Fujitsu LimitedInventors: Shunsuke Sone, Yoshiaki Yanagida, Teruaki Nishioka, Koji Suto, Tomokazu Sugiyama
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Publication number: 20020052172Abstract: A lapping machine comprises a lapping surface plate (1) rotated by a rotating mechanism, a lapping jig (28) having a plurality of projections to bottom surfaces of which a work (30) to be lapped by a lapping surface on the lapping surface plate (1) is fitted, amount-of-projection adjusting elements (29) for adjusting the variation of the plurality of projections (28c) to the lapping surface plate (1) individually, and a control circuit (36) for outputting variation-of-projection control signals to the variation-of-projection adjusting elements (29).Type: ApplicationFiled: September 10, 2001Publication date: May 2, 2002Applicant: FUJITSU LIMITEDInventors: Teruaki Nishioka, Kazuo Yokoi, Yoshiaki Yanagida, Shunsuke Sone, Koji Sudo, Tomokazu Sugiyama
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Patent number: 6315636Abstract: Disclosed herein is a lapping machine for lapping a row bar having a plurality of head sliders. The lapping machine includes a lap plate for providing a lapping surface, a row tool having a work surface for pressing the row bar against the lapping surface, and a mechanism for operating the row tool so that a given pressure distribution is produced between the row bar and the lapping surface. The row tool has a plurality of holes arranged along the work surface. The mechanism includes a plurality of pivoted links each having a load point where a force having a direction perpendicular to the work surface is applied to the row tool in each of the holes. Each of the pivoted links further has a support point as the fulcrum and an effort point where a force having a direction substantially parallel to the work surface is received. The ratio of a distance between the load point and the support point to a distance between the effort point and the support point is substantially constant.Type: GrantFiled: January 18, 2000Date of Patent: November 13, 2001Assignee: Fujitsu LimitedInventors: Yoshiaki Yanagida, Teruaki Nishioka, Koji Sudo, Shunsuke Sone, Tomokazu Sugiyama