Abstract: A tap 1 has a threaded portion 2 including a cutting blade 5 on an outer circumferential surface, a flute portion 3 that divides the threaded portion 2 in a circumferential direction, and a shank portion 4 formed continuously from the threaded portion 2 and the flute portion 3 along a central axis O. The flute portion 3 includes, in a cross-sectional view, a first flute 31 formed continuously from the cutting blade 5 of the threaded portion 2, a second flute 32 formed continuously from the first flute 31, and a ridge line portion 33 being a boundary between the first and second flutes 31, 32. A distance “e” from the central axis O to the ridge line portion 33 is longer than a distance d1 and a distance d2, respectively.

Abstract: A tap 1 has a threaded portion 2 including a cutting blade 5 on an outer circumferential surface, a flute portion 3 that divides the threaded portion 2 in a circumferential direction, and a shank portion 4 formed continuously from the threaded portion 2 and the flute portion 3 along a central axis O. The flute portion 3 includes, in a cross-sectional view, a first flute 31 formed continuously from the cutting blade 5 of the threaded portion 2, a second flute 32 formed continuously from the first flute 31, and a ridge line portion 33 being a boundary between the first and second flutes 31, 32. A distance “e” from the central axis O to the ridge line portion 33 is longer than a distance d1 and a distance d2, respectively.

Abstract: A measurement unit measures a cross-sectional shape of an edge part of a semiconductor wafer. The measurement unit measures a cross-sectional shape of an edge part of a support member. The measurement unit measures a cross-sectional shape of an edge part of a laminated wafer. An analysis unit calculates a thickness of an adhesive agent by subtracting a thickness of the semiconductor wafer and a thickness of the support member from a thickness of the laminated wafer.

Abstract: A measurement unit measures a cross-sectional shape of an edge part of a semiconductor wafer. The measurement unit measures a cross-sectional shape of an edge part of a support member. The measurement unit measures a cross-sectional shape of an edge part of a laminated wafer. An analysis unit calculates a thickness of an adhesive agent by subtracting a thickness of the semiconductor wafer and a thickness of the support member from a thickness of the laminated wafer.

Abstract: The present invention provides a cable guide for changing direction of an inner cable for operating a sliding door of a car, comprising a pulley casing having a box shape with an opening at its top and a guide recess at an inner side of its bottom, a slider provided with a sliding plate slidably guided by means of the guide recess of the pulley casing and a shaft extending upward from a top of the sliding plate, a pulley rotatably supported by the shaft of the slider, an urging member urging the slider along the guide recess toward a direction for giving tension to the inner cable, and a casing cover covering the opening of the pulley casing, and being configured so that an inner side of the casing cover and a top face of the shaft are slidable each other.