Patents by Inventor Shunsuke Takeyama

Shunsuke Takeyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230235198
    Abstract: A sealing film which seals between a metal first base and a second base, the sealing film including: a first adhesive layer that mainly contains an acid-modified polyolefin and adheres to the first base; a second adhesive layer that mainly contains a polyolefin and adheres to the second base; and a base material layer provided between the first adhesive layer and the second adhesive layer, in which the base material layer contains (A), (B), and (C), a ratio [(A)/(B)+(C)] is 90/10 to 20/80, a content percentage of (B) with respect to a total amount of (A), (B), and (C) is 5% by mass or more and 70% by mass or less, and a content percentage of (C) with respect to the total amount of (A), (B), and (C) is 5% by mass or more and 70% by mass or less.
    Type: Application
    Filed: June 22, 2021
    Publication date: July 27, 2023
    Inventors: Shunsuke Takeyama, Takanori Sakuragi, Atsufumi Meguro, Takashi Shimizu
  • Patent number: 11710881
    Abstract: Provided are an electrode lead wire member including a sealing film having high adhesive strength and resistance to an electrolytic solution, and a battery including the electrode lead wire member. Provided is an electrode lead wire member including: a derivation portion extending in one direction; a surface-treated layer formed, at the derivation portion, on a surface of the derivation portion; and a sealing film provided in contact with the surface-treated layer, in which the sealing film has an adhesive resin layer in contact with the surface-treated layer, and the adhesive resin layer contains imine-modified polyolefin or modified polyolefin having a carbodiimide group.
    Type: Grant
    Filed: March 11, 2021
    Date of Patent: July 25, 2023
    Assignee: FUJIMORI KOGYO CO., LTD.
    Inventors: Kunihiro Takei, Hirokazu Iizuka, Shunsuke Takeyama
  • Publication number: 20230207936
    Abstract: A sealing film forms a seal between a first metal base body and a second base body. The sealing film includes a first adhesive layer, a second adhesive layer, and a base material layer. The first adhesive layer mainly contains an acid-modified polyolefin and adheres to the first base body. The second adhesive layer mainly contains a polyolefin and adheres to the second base body. The base material layer is provided between the first adhesive layer and the second adhesive layer. The thickness of the first adhesive layer is at least 25 and at most 70 when the total thickness of the sealing film is defined as 100. The thickness of the base material layer is at least 25 and at most 70. The thickness of the second adhesive layer is at least 5 and at most 50.
    Type: Application
    Filed: May 25, 2021
    Publication date: June 29, 2023
    Inventors: Shunsuke Takeyama, Takanori Sakuragi, Atsufumi Meguro, Takashi Shimizu
  • Publication number: 20210203046
    Abstract: Provided are an electrode lead wire member including a sealing film having high adhesive strength and resistance to an electrolytic solution, and a battery including the electrode lead wire member. Provided is an electrode lead wire member including: a derivation portion extending in one direction; a surface-treated layer formed, at the derivation portion, on a surface of the derivation portion; and a sealing film provided in contact with the surface-treated layer, in which the sealing film has an adhesive resin layer in contact with the surface-treated layer, and the adhesive resin layer contains imine-modified polyolefin or modified polyolefin having a carbodiimide group.
    Type: Application
    Filed: March 11, 2021
    Publication date: July 1, 2021
    Inventors: Kunihiro TAKEI, Hirokazu IIZUKA, Shunsuke TAKEYAMA
  • Patent number: 10985359
    Abstract: Provided are an electrode lead wire member including a sealing film having high adhesive strength and resistance to an electrolytic solution, and a battery including the electrode lead wire member. Provided is an electrode lead wire member including: a derivation portion extending in one direction; a surface-treated layer formed, at the derivation portion, on a surface of the derivation portion; and a sealing film provided in contact with the surface-treated layer, in which the sealing film has an adhesive resin layer in contact with the surface-treated layer, and the adhesive resin layer contains imine-modified polyolefin or modified polyolefin having a carbodiimide group.
    Type: Grant
    Filed: February 4, 2019
    Date of Patent: April 20, 2021
    Assignee: FUJIMORI KOGYO CO., LTD.
    Inventors: Kunihiro Takei, Hirokazu Iizuka, Shunsuke Takeyama
  • Publication number: 20190245189
    Abstract: Provided are an electrode lead wire member including a sealing film having high adhesive strength and resistance to an electrolytic solution, and a battery including the electrode lead wire member. Provided is an electrode lead wire member including: a derivation portion extending in one direction; a surface-treated layer formed, at the derivation portion, on a surface of the derivation portion; and a sealing film provided in contact with the surface-treated layer, in which the sealing film has an adhesive resin layer in contact with the surface-treated layer, and the adhesive resin layer contains imine-modified polyolefin or modified polyolefin having a carbodiimide group.
    Type: Application
    Filed: February 4, 2019
    Publication date: August 8, 2019
    Inventors: Kunihiro TAKEI, Hirokazu IIZUKA, Shunsuke TAKEYAMA
  • Patent number: 8956690
    Abstract: A laminated body which forms a resin mold by compression molding using a master mold, the laminated body having: a pair of mutually facing base materials, a layer of a liquid or gel-like curable resin material sandwiched between the pair of base materials, and one or more flow suppression bodies, which are composed of a cured product of the curable resin material and are sandwiched between the pair of base materials, wherein the layer of the curable resin material is sealed by the pair of base materials and the flow suppression bodies. Also, a method for manufacturing a resin mold using the laminated body.
    Type: Grant
    Filed: May 22, 2009
    Date of Patent: February 17, 2015
    Assignee: Showa Denko K.K.
    Inventors: Hiroshi Uchida, Tomokazu Umezawa, Masato Fukushima, Shunsuke Takeyama, Takanori Sakuragi