Patents by Inventor Shunsuke TONOUCHI

Shunsuke TONOUCHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermosetting resin composition, prepreg, laminated board, printed wiring board, and high speed communication-compatible module
    Patent number: 10876000
    Abstract: A thermosetting resin composition containing: (A) an addition reaction product of a maleimide compound having at least two N-substituted maleimide groups in one molecule (a1) and an amine compound having at least two primary amino groups in one molecule (a2), (B) a thermoplastic elastomer, and (C) a copolymer resin having a structural unit derived from an aromatic vinyl compound and a structural unit derived from a carboxylic acid anhydride.
    Type: Grant
    Filed: May 30, 2017
    Date of Patent: December 29, 2020
    Assignee: Showa Denko Materials Co., Ltd.
    Inventors: Shunsuke Tonouchi, Tomokazu Shimada, Kazutoshi Danjoubara, Tomio Fukuda, Minoru Kakitani
  • THERMOSETTING RESIN COMPOSITION, PREPREG, LAMINATED BOARD, PRINTED WIRING BOARD, AND HIGH-SPEED COMMUNICATION-COMPATIBLE MODULE
    Publication number: 20190169432
    Abstract: A thermosetting resin composition containing: (A) an addition reaction product of a maleimide compound having at least two N-substituted maleimide groups in one molecule (a1) and an amine compound having at least two primary amino groups in one molecule (a2), (B) a thermoplastic elastomer, and (C) a copolymer resin having a structural unit derived from an aromatic vinyl compound and a structural unit derived from a carboxylic acid anhydride.
    Type: Application
    Filed: May 30, 2017
    Publication date: June 6, 2019
    Inventors: Shunsuke TONOUCHI, Tomokazu SHIMADA, Kazutoshi DANJOUBARA, Tomio FUKUDA, Minoru KAKITANI