Patents by Inventor Shunsuke YAMAMICHI
Shunsuke YAMAMICHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11981128Abstract: There are provided a substrate on which a first integrated circuit, a first transistor, a second integrated circuit, and a second transistor are disposed; a heat sink fixed to the substrate; a first heat conductive elastic body which is in contact with the heat sink and the first integrated circuit; a second heat conductive elastic body which is in contact with the heat sink and the first transistor; a third heat conductive elastic body which is in contact with the heat sink and the second integrated circuit; and a fourth heat conductive elastic body which is in contact with the heat sink and the second transistor, the heat sink has a first recess portion positioned between the first heat conductive elastic body and the second heat conductive elastic body, and a second recess portion positioned between the third heat conductive elastic body and the fourth heat conductive elastic body.Type: GrantFiled: November 29, 2021Date of Patent: May 14, 2024Assignee: SEIKO EPSON CORPORATIONInventors: Shunsuke Yamamichi, Yusuke Matsumoto
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Patent number: 11904605Abstract: There is provided a head unit including: a substrate on which a first driving circuit is disposed; a heat sink fixed to the substrate; and heat conductive elastic bodies positioned between the substrate and the heat sink, in which the first driving circuit includes a first integrated circuit, a first amplifier circuit including a first transistor, and a first smoothing circuit that outputs the first driving signal, in which a first heat conductive elastic body is in contact with the heat sink and the first integrated circuit, a second heat conductive elastic body is in contact with the heat sink and the first transistor, and the first heat conductive elastic body and the second heat conductive elastic body are in a form of a gel having flame retardancy and electric insulation property.Type: GrantFiled: November 29, 2021Date of Patent: February 20, 2024Assignee: SEIKO EPSON CORPORATIONInventors: Shunsuke Yamamichi, Yusuke Matsumoto
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Patent number: 11865835Abstract: There are provided a substrate on which a first integrated circuit, a first transistor, a second integrated circuit, and a second transistor are disposed; a heat sink fixed to the substrate; the substrate has a first fixing reference hole and a second fixing reference hole, the heat sink has a first fixing reference pin and a second fixing reference pin which are inserted into the first fixing reference hole and the second fixing reference hole, and the first integrated circuit, the second integrated circuit, the first transistor, and the second transistor are positioned between the first fixing reference hole and the second fixing reference hole.Type: GrantFiled: November 29, 2021Date of Patent: January 9, 2024Assignee: Seiko Epson CorporationInventors: Shunsuke Yamamichi, Yusuke Matsumoto
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Patent number: 11752763Abstract: A liquid ejection apparatus includes a head unit that ejects a liquid, and a control unit that controls an operation of the head unit, wherein the head unit includes a drive signal output circuit that outputs a drive signal, a first substrate on which the drive signal output circuit is provided, and a first ejection head including a first drive element driven by the drive signal, and a first nozzle plate including a first nozzle from which a liquid is ejected by driving the first drive element, wherein the first substrate includes a first face and a second face, wherein the drive signal output circuit is provided on the first face, and wherein a shortest distance between the first nozzle plate and the second face is shorter than a shortest distance between the first nozzle plate and the first face.Type: GrantFiled: July 26, 2021Date of Patent: September 12, 2023Assignee: Seiko Epson CorporationInventors: Shunsuke Yamamichi, Yusuke Matsumoto
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Patent number: 11685155Abstract: A liquid ejecting apparatus includes a head unit that includes a nozzle that ejects a liquid, a control circuit that outputs a control signal that controls an operation of the head unit, a power supply circuit that supplies a power supply voltage to the head unit, and a liquid container that stores the liquid. The head unit includes a first terminal to which the control signal is input, a second terminal to which the power supply voltage is supplied, and a liquid supply port to which the liquid is supplied, the first terminal and the second terminal are located side by side along a first direction, and the second terminal is located between the first terminal and the liquid supply port in a second direction intersecting the first direction.Type: GrantFiled: September 28, 2021Date of Patent: June 27, 2023Inventors: Yusuke Matsumoto, Shunsuke Yamamichi
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Publication number: 20220169009Abstract: There is provided a head unit including: a substrate on which a first driving circuit is disposed; a heat sink fixed to the substrate; and heat conductive elastic bodies positioned between the substrate and the heat sink, in which the first driving circuit includes a first integrated circuit, a first amplifier circuit including a first transistor, and a first smoothing circuit that outputs the first driving signal, in which a first heat conductive elastic body is in contact with the heat sink and the first integrated circuit, a second heat conductive elastic body is in contact with the heat sink and the first transistor, and the first heat conductive elastic body and the second heat conductive elastic body are in a form of a gel having flame retardancy and electric insulation property.Type: ApplicationFiled: November 29, 2021Publication date: June 2, 2022Inventors: Shunsuke YAMAMICHI, Yusuke MATSUMOTO
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Publication number: 20220169010Abstract: There are provided a substrate on which a first integrated circuit, a first transistor, a second integrated circuit, and a second transistor are disposed; a heat sink fixed to the substrate; a first heat conductive elastic body which is in contact with the heat sink and the first integrated circuit; a second heat conductive elastic body which is in contact with the heat sink and the first transistor; a third heat conductive elastic body which is in contact with the heat sink and the second integrated circuit; and a fourth heat conductive elastic body which is in contact with the heat sink and the second transistor, the heat sink has a first recess portion positioned between the first heat conductive elastic body and the second heat conductive elastic body, and a second recess portion positioned between the third heat conductive elastic body and the fourth heat conductive elastic body.Type: ApplicationFiled: November 29, 2021Publication date: June 2, 2022Inventors: Shunsuke YAMAMICHI, Yusuke MATSUMOTO
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Publication number: 20220169017Abstract: There are provided a first fixing section to a third fixing section that fix a heat sink to a substrate on which a first driving circuit and a second driving circuit are disposed; the first drive circuit includes first transistor and first integrated circuit, and the second drive circuit includes second transistor and second integrated circuit, lengths of the first transistor and the second transistor in the normal direction of the substrate are longer than lengths of the first integrated circuit and the second integrated circuit, the first fixing section and the second fixing section overlap a first virtual straight line that connects the first transistor and the second transistor, and the third fixing section overlaps a second virtual straight line that connects the first integrated circuit and the second integrated circuit to each other.Type: ApplicationFiled: November 29, 2021Publication date: June 2, 2022Inventors: Shunsuke YAMAMICHI, Yusuke MATSUMOTO
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Publication number: 20220169006Abstract: There are provided a substrate on which a first integrated circuit, a first transistor, a second integrated circuit, and a second transistor are disposed; a heat sink fixed to the substrate; the substrate has a first fixing reference hole and a second fixing reference hole, the heat sink has a first fixing reference pin and a second fixing reference pin which are inserted into the first fixing reference hole and the second fixing reference hole, and the first integrated circuit, the second integrated circuit, the first transistor, and the second transistor are positioned between the first fixing reference hole and the second fixing reference hole.Type: ApplicationFiled: November 29, 2021Publication date: June 2, 2022Inventors: Shunsuke YAMAMICHI, Yusuke MATSUMOTO
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Publication number: 20220169018Abstract: There are provided a substrate on which a first integrated circuit, a first transistor, and a first inductor element are disposed, and which has a first side and a second side facing each other; a heat sink having a fifth side and a sixth side along the first side; the first integrated circuit, the first transistor, and the first inductor element are positioned in order of the first integrated circuit, the first transistor, and the first inductor element from the first side toward the second side, and the heat sink is fixed to the substrate such that a shortest distance between the fifth side and the first side is shorter than a shortest distance between the sixth side and the first side, and a shortest distance between the first integrated circuit and the fifth side is longer than a shortest distance between the first transistor and the sixth side.Type: ApplicationFiled: November 29, 2021Publication date: June 2, 2022Inventors: Shunsuke YAMAMICHI, Yusuke MATSUMOTO
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Publication number: 20220097367Abstract: A liquid ejecting apparatus includes a head unit that includes a nozzle that ejects a liquid, a control circuit that outputs a control signal that controls an operation of the head unit, a power supply circuit that supplies a power supply voltage to the head unit, and a liquid container that stores the liquid. The head unit includes a first terminal to which the control signal is input, a second terminal to which the power supply voltage is supplied, and a liquid supply port to which the liquid is supplied, the first terminal and the second terminal are located side by side along a first direction, and the second terminal is located between the first terminal and the liquid supply port in a second direction intersecting the first direction.Type: ApplicationFiled: September 28, 2021Publication date: March 31, 2022Inventors: Yusuke MATSUMOTO, Shunsuke YAMAMICHI
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Publication number: 20220024204Abstract: A liquid ejection apparatus includes a head unit that ejects a liquid, and a control unit that controls an operation of the head unit, wherein the head unit includes a drive signal output circuit that outputs a drive signal, a first substrate on which the drive signal output circuit is provided, and a first ejection head including a first drive element driven by the drive signal, and a first nozzle plate including a first nozzle from which a liquid is ejected by driving the first drive element, wherein the first substrate includes a first face and a second face, wherein the drive signal output circuit is provided on the first face, and wherein a shortest distance between the first nozzle plate and the second face is shorter than a shortest distance between the first nozzle plate and the first face.Type: ApplicationFiled: July 26, 2021Publication date: January 27, 2022Inventors: Shunsuke YAMAMICHI, Yusuke MATSUMOTO