Abstract: Embodiments are for a confocal microscope unit attached to a connection port of a microscope including: light sources which output irradiation light to a sample to be observed; photodetectors which detect observation light generated from a sample in response to the irradiation light; a scan mirror which scans the irradiation light on the sample and guides the observation light generated from the sample to the photodetectors; a scan lens which guides the irradiation light scanned by the scan mirror to the microscope optical system and guides the observation light focused by the microscope optical system to the scan mirror; a lens barrel to which the scan lens is fixed; an attachment portion which attaches the lens barrel to the connection port ; and a movable portion which supports the lens barrel so that an angle of the lens barrel with respect to the attachment portion is changeable.

Abstract: An imaging device including a photoelectric conversion layer including a semiconductor nanoparticle (100) including a particle body (101) and a monoatomic ligand (102). The particle body (101) includes a semiconductor core (103) including at least two or more elements selected from a Group I element, a Group III element, a Group V element, and a Group VI element. The monoatomic ligand (102) is bonded to a surface of the particle body (101).

Abstract: A manufacturing method of a quantum dot ensemble of the present disclosure is a manufacturing method of a quantum dot ensemble including a plurality of core-shell quantum dots 10A that each includes a core 10B including a compound semiconductor, and a shell 10C including a compound semiconductor and covering the core, and a ligand 10D coordinated to the shell, and the manufacturing method includes mixing a core material, a shell material, and the ligand in a solvent and thereafter performing heating to thereby form the core-shell quantum dots, coordinate the ligand to the shell, and cleave the ligand.

Abstract: Tape for encasing electronic parts comprising a carrier tape having a plurality of recesses for encasing electronic parts and a plurality of guide perforations, and a cover tape pasted onto said carrier tape with an adhesive so as to seal only said recesses while leaving said guide perforations open.